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公开(公告)号：US20100199777A1
公开(公告)日：2010-08-12
申请号：US12368402
申请日：2009-02-10
CPC分类号： G01L19/141 , G01L19/0084 , H01L2224/05554 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L2224/73265 , H01L2924/1461 , H01L2924/15747 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： A method and apparatus are described for fabricating an exposed backside pressure sensor (30) which protects interior electrical components (37) formed on a topside surface of a pressure sensor transducer die (31) from corrosive particles using a protective gel layer (38) and molding compound (39), but which vents a piezoresistive transducer sensor diaphragm (33) formed on a backside of the pressure sensor transducer die (31) through a vent hole (42) formed in an exposed die flag (36), enabling the sensor diaphragm (33) to directly sense pressure variations without the influence of a protective gel.
摘要翻译： 描述了一种用于制造暴露的背侧压力传感器（30）的方法和装置，其利用保护性凝胶层（38）保护形成在压力传感器传感器模具（31）的顶侧表面上的内部电气部件（37）免受腐蚀性颗粒的影响， 模制化合物（39），但是通过形成在暴露的模具标记（36）中的通气孔（42）通向形成在压力传感器传感器模头（31）的背面上的压阻换能器传感器膜片（33），使得传感器 隔膜（33）直接感应压力变化而不受保护凝胶的影响。
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公开(公告)号：US20090004775A1
公开(公告)日：2009-01-01
申请号：US12207719
申请日：2008-09-10
申请人： James J. Wang , William G. McDonald
发明人： James J. Wang , William G. McDonald
IPC分类号： H01L21/56
CPC分类号： H01L23/4951 , H01L23/49541 , H01L23/49551 , H01L24/45 , H01L24/48 , H01L2224/06135 , H01L2224/06136 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/48465 , H01L2224/73215 , H01L2924/00014 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/1461 , H01L2924/00 , H01L2924/00012 , H01L2224/05599
摘要： Methods are provided for forming Quad Flat No-Lead (QFN) packages. An embodiment includes disposing an active side of a semiconductor chip on a plurality of leads, coupling a plurality of wire bonds to the active side of the semiconductor chip, coupling the plurality of wire bonds to the plurality of leads in a space between the active side and the plurality of leads, and encasing the semiconductor chip, at least a portion of each of the plurality of leads, and the plurality of wire bonds in a mold material to define a mounting side of the QFN package. The mounting side has a perimeter, the plurality of leads are oriented on and exposed on the mounting side within the perimeter, and the plurality of wire bonds are oriented between the active side and the mounting side within the mold material.
摘要翻译： 提供了用于形成四方扁平无铅（QFN）封装的方法。 一个实施例包括将半导体芯片的有源侧设置在多个引线上，将多个引线接合耦合到半导体芯片的有源侧，将多个引线接合耦合到多个引线之间的活动侧 以及多个引线，并且将所述多个引线中的每一个的至少一部分包围所述半导体芯片，并将所述多个引线接合在模具材料中以限定所述QFN封装的安装侧。 安装侧具有周边，多个引线定位在周边内的安装侧并且暴露在周边内的安装侧，并且多个引线接合在模具材料内的有源侧和安装侧之间取向。
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公开(公告)号：US08686550B2
公开(公告)日：2014-04-01
申请号：US13371635
申请日：2012-02-13
IPC分类号： H01L23/02
CPC分类号： H01L23/3157 , B60C23/0433 , G01L19/0069 , G01L19/147 , H01L23/49575 , H01L24/32 , H01L24/48 , H01L2224/2919 , H01L2224/32145 , H01L2224/32245 , H01L2224/48091 , H01L2224/48145 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/1461 , H01L2924/1815 , H01L2924/00 , H01L2224/45099 , H01L2924/00012
摘要： A pressure sensor package is provided that reduces the occurrence of micro gaps between molding material and metal contacts that can store high-pressure air. The present invention provides this capability by reducing or eliminating interfaces between package molding material and metal contacts. In one embodiment, a control die is electrically coupled to a lead frame and then encapsulated in molding material, using a technique that forms a cavity over a portion of the control die. The cavity exposes contacts on the free surface of the control die that can be electrically coupled to a pressure sensor device using, for example, wire bonding techniques. In another embodiment, a region of a substrate can be encapsulated in molding material, using a technique that forms a cavity over a sub-portion of the substrate that includes contacts. A pressure sensor device can be electrically coupled to the exposed contacts.
摘要翻译： 提供了压力传感器封装，其减少了可存储高压空气的成型材料和金属触点之间的微小间隙的发生。 本发明通过减少或消除封装模制材料和金属触点之间的界面来提供这种能力。 在一个实施例中，使用在控制管芯的一部分上形成空腔的技术将控制管芯电耦合到引线框架，然后封装在成型材料中。 空腔使控制管芯的自由表面上的触点露出，该触点可以使用例如引线接合技术电耦合到压力传感器装置。 在另一个实施例中，可以使用在包括触点的衬底的子部分上形成空腔的技术将衬底的区域封装在模制材料中。 压力传感器装置可以电连接到暴露的触点。
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公开(公告)号：US20130207207A1
公开(公告)日：2013-08-15
申请号：US13371635
申请日：2012-02-13
CPC分类号： H01L23/3157 , B60C23/0433 , G01L19/0069 , G01L19/147 , H01L23/49575 , H01L24/32 , H01L24/48 , H01L2224/2919 , H01L2224/32145 , H01L2224/32245 , H01L2224/48091 , H01L2224/48145 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/1461 , H01L2924/1815 , H01L2924/00 , H01L2224/45099 , H01L2924/00012
摘要： A pressure sensor package is provided that reduces the occurrence of micro gaps between molding material and metal contacts that can store high-pressure air. The present invention provides this capability by reducing or eliminating interfaces between package molding material and metal contacts. In one embodiment, a control die is electrically coupled to a lead frame and then encapsulated in molding material, using a technique that forms a cavity over a portion of the control die. The cavity exposes contacts on the free surface of the control die that can be electrically coupled to a pressure sensor device using, for example, wire bonding techniques. In another embodiment, a region of a substrate can be encapsulated in molding material, using a technique that forms a cavity over a sub-portion of the substrate that includes contacts. A pressure sensor device can be electrically coupled to the exposed contacts.
摘要翻译： 提供了压力传感器封装，其减少了可存储高压空气的成型材料和金属触点之间的微小间隙的发生。 本发明通过减少或消除封装模制材料和金属触点之间的界面来提供这种能力。 在一个实施例中，使用在控制管芯的一部分上形成空腔的技术将控制管芯电耦合到引线框架，然后封装在成型材料中。 该空腔暴露出控制管芯的自由表面上的触点，其可以使用例如引线接合技术电耦合到压力传感器装置。 在另一个实施例中，可以使用在包括触点的衬底的子部分上形成空腔的技术将衬底的区域封装在模制材料中。 压力传感器装置可以电连接到暴露的触点。
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公开(公告)号：US08384168B2
公开(公告)日：2013-02-26
申请号：US13091997
申请日：2011-04-21
申请人： Stephen R. Hooper , Dwight L. Daniels , James D. MacDonald , William G. McDonald , Chunlin C. Xia
发明人： Stephen R. Hooper , Dwight L. Daniels , James D. MacDonald , William G. McDonald , Chunlin C. Xia
CPC分类号： G01L9/0052 , B81B7/0041 , B81B2201/0264 , B81B2207/012 , G01L19/0672 , G01L19/147 , H01L2224/16225 , H01L2924/15151 , H01L2924/16152
摘要： Apparatus and related fabrication methods are provided for a sensor device. The sensor device includes a sensor structure including a first portion having a sensing arrangement formed thereon and a second structure. A sealing structure is interposed between the sensor structure and the second structure, wherein the sealing structure surrounds the first portion of the sensor structure. The sealing structure establishes a fixed reference pressure on a first side of the first portion, and an opposing side of the first portion is exposed to an ambient pressure.
摘要翻译： 为传感器装置提供了装置和相关的制造方法。 该传感器装置包括传感器结构，该传感器结构包括其上形成有感测装置的第一部分和第二结构。 在传感器结构和第二结构之间插入密封结构，其中密封结构围绕传感器结构的第一部分。 密封结构在第一部分的第一侧上建立固定的参考压力，并且第一部分的相对侧暴露于环境压力。
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公开(公告)号：US20110036174A1
公开(公告)日：2011-02-17
申请号：US12539853
申请日：2009-08-12
CPC分类号： B81B7/0061 , B81B2201/0264 , B81C2203/0154 , G01L19/0084 , G01L19/141 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2924/1461 , H01L2924/15747 , H01L2924/181 , H01L2924/1815 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A method and apparatus are described for fabricating an exposed differential pressure sensor (30) which protects interior electrical components (37) formed on a topside surface of a differential pressure sensor transducer die (31) from corrosive particles using a molding compound (39), but which vents both sides of a piezoresistive transducer sensor diaphragm (33) through a first vent hole (42) formed in an exposed die flag (36) and a second vent hole (38) formed in an exposed cap structure (33), enabling the sensor diaphragm (33) to sense differential pressure variations directly or indirectly through a protective gel.
摘要翻译： 描述了一种用于制造暴露的差压传感器（30）的方法和装置，其使用模制化合物（39）将形成在差压传感器传感器模头（31）的顶侧表面上的内部电气部件（37）与腐蚀性颗粒保护， 但是通过形成在暴露的盖标志（36）中的第一通气孔（42）和形成在暴露的盖结构（33）中的第二通气孔（38），通过压阻换能器传感器隔膜（33）的两侧通风，使得能够 传感器隔膜（33）通过保护性凝胶直接或间接地感测差压变化。
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公开(公告)号：US07713781B2
公开(公告)日：2010-05-11
申请号：US12207719
申请日：2008-09-10
申请人： James J. Wang , William G. McDonald
发明人： James J. Wang , William G. McDonald
IPC分类号： H01L23/02
CPC分类号： H01L23/4951 , H01L23/49541 , H01L23/49551 , H01L24/45 , H01L24/48 , H01L2224/06135 , H01L2224/06136 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/48465 , H01L2224/73215 , H01L2924/00014 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/1461 , H01L2924/00 , H01L2924/00012 , H01L2224/05599
摘要： Methods are provided for forming Quad Flat No-Lead (QFN) packages. An embodiment includes disposing an active side of a semiconductor chip on a plurality of leads, coupling a plurality of wire bonds to the active side of the semiconductor chip, coupling the plurality of wire bonds to the plurality of leads in a space between the active side and the plurality of leads, and encasing the semiconductor chip, at least a portion of each of the plurality of leads, and the plurality of wire bonds in a mold material to define a mounting side of the QFN package. The mounting side has a perimeter, the plurality of leads are oriented on and exposed on the mounting side within the perimeter, and the plurality of wire bonds are oriented between the active side and the mounting side within the mold material.
摘要翻译： 提供了用于形成四方扁平无铅（QFN）封装的方法。 一个实施例包括将半导体芯片的有源侧设置在多个引线上，将多个引线接合耦合到半导体芯片的有源侧，将多个引线接合耦合到多个引线之间的活动侧 以及多个引线，并且将所述多个引线中的每一个的至少一部分包围所述半导体芯片，并将所述多个引线接合在模具材料中以限定所述QFN封装的安装侧。 安装侧具有周边，多个引线定位在周边内的安装侧并且暴露在周边内的安装侧，并且多个引线接合在模具材料内的有源侧和安装侧之间取向。
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18.发明申请LEAD FRAME HAVING A FLAG WITH IN-PLANE AND OUT-OF-PLANE MOLD LOCKING FEATURES 有权具有平面和平面外模具锁定特征的标签的引导框架公开(公告)号：US20130049181A1
公开(公告)日：2013-02-28
申请号：US13220898
申请日：2011-08-30
申请人： Jian Wen , Darrel R. Frear , William G. McDonald
发明人： Jian Wen , Darrel R. Frear , William G. McDonald
IPC分类号： H01L23/495 , H01L21/56
CPC分类号： H01L23/49503 , H01L21/565 , H01L23/3107 , H01L23/49544 , H01L23/49548 , H01L23/49551 , H01L23/49555 , H01L24/73 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00 , H01L2924/00012 , H01L2924/00014
摘要： A semiconductor device lead frame having enhanced mold locking features is provided. The lead frame has a flag with bendable edge features along the edge of the flag. Each edge feature is shaped to resist movement against encapsulating mold material in a plane of the edge feature. By bending a portion of the edge feature, improved mold locking of the flag is provided in multiple planes.
摘要翻译： 提供了具有增强的模具锁定特征的半导体器件引线框架。 引线框架具有沿着标志边缘的可弯曲边缘特征的标志。 每个边缘特征被成形为抵抗将模具材料封装在边缘特征的平面内的运动。 通过弯曲边缘特征的一部分，在多个平面中提供了标志的改进的模具锁定。
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公开(公告)号：US07652357B2
公开(公告)日：2010-01-26
申请号：US12350547
申请日：2009-01-08
申请人： James J. Wang , William G. McDonald
发明人： James J. Wang , William G. McDonald
IPC分类号： H01L23/02
CPC分类号： H01L23/4951 , H01L23/49541 , H01L23/49551 , H01L24/45 , H01L24/48 , H01L2224/06135 , H01L2224/06136 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/48465 , H01L2224/73215 , H01L2924/00014 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/1461 , H01L2924/00 , H01L2924/00012 , H01L2224/05599
摘要： Quad Flat No-Lead (QFN) packages are provided. An embodiment of a QFN package includes a semiconductor chip including an active surface and an inactive surface, a plurality of leads, a plurality of wire bonds configured to couple the plurality of leads to the semiconductor chip, and a mold material including a mounting side and having a perimeter. The active surface is oriented toward the mounting side, the plurality of wire bonds are disposed between the active surface and the mounting side within the mold material, and the plurality of leads are exposed on the mounting side and are at least partially encapsulated within the perimeter of the mold material.
摘要翻译： 提供四方扁平无铅（QFN）封装。 QFN封装的一个实施例包括半导体芯片，其包括有源表面和非活性表面，多个引线，被配置为将多个引线耦合到半导体芯片的多个引线键合，以及包括安装侧和 有一个周长。 活性表面朝向安装侧定向，多个引线接合位于模具材料内的活性表面和安装侧之间，并且多个引线在安装侧暴露并且至少部分地封装在周边内 的模具材料。
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公开(公告)号：US06683370B1
公开(公告)日：2004-01-27
申请号：US10417992
申请日：2003-04-15
IPC分类号： H01L23495
CPC分类号： H01L23/49575 , H01L23/053 , H01L23/3107 , H01L24/48 , H01L2224/05599 , H01L2224/45099 , H01L2224/48091 , H01L2224/48247 , H01L2224/85399 , H01L2924/00014 , H01L2924/14 , H01L2924/19041 , H01L2224/45015 , H01L2924/207 , H01L2924/00
摘要： A semiconductor component includes a non-leaded leadframe (100, 200, 300) having at least one interior electrical contact (110) and a plurality of exterior electrical contacts (120), a semiconductor chip (410) mounted onto the leadframe, a mold compound (510) disposed around the semiconductor chip, a cavity (520) in the mold compound exposing a portion of the at least one interior electrical contact, an electronic chip (710) mounted in the cavity, and a cover (810) disposed over the cavity. In one embodiment, the leadframe is part of an array including a plurality of leadframes spaced apart from each other by a plurality of dam bars.
摘要翻译： 半导体部件包括具有至少一个内部电触点（110）和多个外部电触头（120）的非引线引线框架（100,200,300），安装在引线框架上的半导体芯片（410），模具 配置在半导体芯片周围的化合物（510），暴露出至少一个内部电触点的一部分的模具化合物中的空腔（520），安装在该空腔中的电子芯片（710） 空腔。 在一个实施例中，引线框架是包括通过多个坝条彼此间隔开的多个引线框的阵列的一部分。
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