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公开(公告)号:US5259804A
公开(公告)日:1993-11-09
申请号:US921934
申请日:1992-07-29
申请人: Gregory Plow , James Palmer
发明人: Gregory Plow , James Palmer
IPC分类号: A63H33/40
CPC分类号: A63H33/40
摘要: A toy having a first and a second guide line support, each guide line having two ends and a handle member respectively secured at each end. A body member for operating aerodynamically includes a frame, a sail, and spaced fasteners which are also secured to the first and to the second guide lines. In one embodiment support elements are slideably secured to the body member and to the fasteners for supporting the body in a desired orientation between the first and second guidelines. Alternatively, the support members may be included as a part of the frame of the body member.
摘要翻译: 具有第一和第二引导线支撑的玩具,每个引导线具有两个端部,并且手柄部件分别固定在每个端部。 用于空气动力学的身体构件包括框架,帆和间隔开的紧固件,其也固定到第一和第二引导线。 在一个实施例中,支撑元件可滑动地固定到主体构件和紧固件,用于在第一和第二准则之间以期望的方向支撑身体。 或者,支撑构件可以包括作为主体构件的框架的一部分。
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公开(公告)号:US4358760A
公开(公告)日:1982-11-09
申请号:US256853
申请日:1981-04-23
申请人: James Palmer
发明人: James Palmer
CPC分类号: G08B17/06 , G08B17/10 , G08B17/113 , Y10S220/26
摘要: There is disclosed a portable fire alarm apparatus which comprises a foldable housing consisting of a base assembly having a surface for resting upon a horizontal plane. A central section is pivotally mounted to the base assembly to extend in the vertical plane. Pivotally mounted to the top of the central section is a top planar section which is pivotally mounted and adapted to be positioned in the horizontal plane where it is above and parallel to the base assembly and held in position by means of lockable hinges. The top section contains a smoke or heat detector with the central section containing a speaker or an alarm, with the base section containing electrical circuitry and a power source for alarm operation. The central section has an internal surface which is concave to act as a sounding surface for the audio signal indicative of an alarm condition. The base assembly contains a test indicator which operates in conjunction with a switch to enable a user to turn the unit OFF when not in use and to test for proper battery voltage when the unit is in the unfolded or folded state.
摘要翻译: 公开了一种便携式火灾报警装置,其包括由具有用于搁置在水平面上的表面的基座组件组成的可折叠壳体。 中心部分枢转地安装到基座组件以在垂直平面中延伸。 枢轴安装在中央部分的顶部是顶部平面部分,其被枢转地安装并且适于定位在水平面中,在水平面中它位于基部组件的上方并且平行于基部组件,并且通过可锁定铰链保持就位。 顶部包含烟或热检测器,中央部分包含扬声器或报警器,基座部分包含电路和用于报警操作的电源。 中心部分具有凹面的内表面,用作表示报警状态的音频信号的探测面。 基座组件包含与开关一起操作的测试指示器,以使用户在不使用时能够将单元关闭,并且在单元处于展开或折叠状态时测试正确的电池电压。
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公开(公告)号:US20080039426A1
公开(公告)日:2008-02-14
申请号:US11617651
申请日:2006-12-28
申请人: Orion Jankowski , James Palmer , Lee Honigberg
发明人: Orion Jankowski , James Palmer , Lee Honigberg
IPC分类号: A61K31/675 , A61K31/496 , A61P29/00 , A61P35/00 , A61P37/00 , C07D241/04 , C07F9/6584
CPC分类号: C07D471/04 , C07F9/65685 , C07F9/65846
摘要: Disclosed herein are compounds that inhibit the activity of particular tyrosine kinases. Methods for the preparation of such compounds are disclosed. Also disclosed are pharmaceutical compositions that include the compounds. Methods of using the compounds disclosed, alone or in combination with other therapeutic agents, for the treatment of tyrosine kinase-mediated diseases or conditions or tyrosine kinase-dependent diseases or conditions are provided.
摘要翻译: 本文公开了抑制特定酪氨酸激酶活性的化合物。 公开了制备这些化合物的方法。 还公开了包含化合物的药物组合物。 提供了使用单独或与其它治疗剂组合公开的化合物用于治疗酪氨酸激酶介导的疾病或病症或酪氨酸激酶依赖性疾病或病症的方法。
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公开(公告)号:US20070278729A1
公开(公告)日:2007-12-06
申请号:US11772862
申请日:2007-07-03
IPC分类号: B25B5/16
CPC分类号: B23K3/0623 , B23K2101/40 , H01L24/02 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/12 , H01L24/13 , H01L24/74 , H01L2221/68359 , H01L2224/0345 , H01L2224/0401 , H01L2224/05006 , H01L2224/05018 , H01L2224/05027 , H01L2224/05147 , H01L2224/05166 , H01L2224/05171 , H01L2224/05558 , H01L2224/05568 , H01L2224/05572 , H01L2224/05599 , H01L2224/05644 , H01L2224/05647 , H01L2224/1145 , H01L2224/11472 , H01L2224/11849 , H01L2224/13022 , H01L2224/13023 , H01L2224/13116 , H01L2224/16 , H01L2224/742 , H01L2224/94 , H01L2924/00013 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01022 , H01L2924/01029 , H01L2924/01042 , H01L2924/0105 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04941 , H01L2924/1305 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/00014 , H01L2224/11 , H01L2224/03 , H01L2224/13099 , H01L2224/05099 , H01L2224/13599 , H01L2224/29099 , H01L2224/29599 , H01L2924/00 , H01L2224/05552
摘要: A method of forming a semiconductor interconnect including, in the order recited: (a) providing a semiconductor wafer; (b) forming bonding pads in a terminal wiring level on the frontside of the wafer; (c) reducing the thickness of the wafer; (d) forming solder bumps on the bonding pads; and (e) dicing the wafer into bumped semiconductor chips.
摘要翻译: 一种形成半导体互连的方法,包括:(a)提供半导体晶片; (b)在晶片的前侧的端子布线层中形成接合焊盘; (c)减小晶片的厚度; (d)在焊盘上形成焊料凸块; 和(e)将晶片切割成凸起的半导体芯片。
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公开(公告)号:US06900237B2
公开(公告)日:2005-05-31
申请号:US10237509
申请日:2002-09-09
申请人: James Palmer
发明人: James Palmer
IPC分类号: C07C311/46 , C07D209/08 , C07D213/82 , C07D277/42 , C07D295/155 , C07D295/215 , C07D417/12 , A61K31/604 , C07D209/404
CPC分类号: C07D213/82 , C07C311/46 , C07D209/08 , C07D277/42 , C07D295/155 , C07D295/215 , C07D417/12
摘要: The present invention relates to novel cysteine protease inhibitors; the pharmaceutically acceptable salts and N-oxides thereof; their uses as therapeutic agents and the methods of their making.
摘要翻译: 本发明涉及新型半胱氨酸蛋白酶抑制剂; 其药学上可接受的盐和N-氧化物; 它们作为治疗剂的用途及其制备方法。
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公开(公告)号:USD421276S
公开(公告)日:2000-02-29
申请号:US96263
申请日:1998-11-09
申请人: James Palmer
设计人: James Palmer
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公开(公告)号:USD383749S
公开(公告)日:1997-09-16
申请号:US57414
申请日:1996-07-24
申请人: Albert Leo Nagele , Louis Lundell , James Palmer , Sang Oh , Leonid Soren
设计人: Albert Leo Nagele , Louis Lundell , James Palmer , Sang Oh , Leonid Soren
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公开(公告)号:US20070135386A1
公开(公告)日:2007-06-14
申请号:US11625369
申请日:2007-01-22
IPC分类号: A61K31/675 , A61K31/4965 , A61K31/50 , A61K31/4415 , A61K31/381 , A61K31/4035
CPC分类号: C07D295/215 , A61K38/00 , C07C317/48 , C07C317/50 , C07D205/085 , C07D207/24 , C07D207/48 , C07D223/12 , C07D307/32 , C07K5/0606 , C07K5/06078 , Y02A50/411 , Y02A50/423
摘要: The present invention relates to novel cathepsin S inhibitors, the pharmaceutically acceptable salts and N-oxides thereof, their uses as therapeutic agents and the methods of their making.
摘要翻译: 本发明涉及新型组织蛋白酶S抑制剂,其药学上可接受的盐和N-氧化物,它们作为治疗剂的用途及其制备方法。
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公开(公告)号:US20060089357A1
公开(公告)日:2006-04-27
申请号:US11296782
申请日:2005-12-07
申请人: Michael Graupe , James Palmer , John Patterson , Stephen Pickett , David Aldous , Sukanthini Thurairatnam , Andreas Timm , Frank Halley , Justine Lai , John Link , Jiayao Li
发明人: Michael Graupe , James Palmer , John Patterson , Stephen Pickett , David Aldous , Sukanthini Thurairatnam , Andreas Timm , Frank Halley , Justine Lai , John Link , Jiayao Li
IPC分类号: A61K31/537 , C07D265/30
CPC分类号: C07D213/40 , A61K31/4245 , A61K31/5375 , A61K31/5377 , C07C317/44 , C07C323/60 , C07D205/08 , C07D207/24 , C07D213/75 , C07D223/12 , C07D263/32 , C07D263/56 , C07D271/06 , C07D271/10 , C07D277/26 , C07D277/64 , C07D285/08 , C07D295/185 , C07D413/04 , C07D413/12
摘要: The present invention relates to novel cathepsin S inhibitors, the pharmaceutically acceptable salts and N-oxides thereof, their uses as therapeutic agents and the methods of their making.
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公开(公告)号:US20050272241A1
公开(公告)日:2005-12-08
申请号:US11184695
申请日:2005-07-19
CPC分类号: B23K3/0623 , B23K2101/40 , H01L24/02 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/12 , H01L24/13 , H01L24/74 , H01L2221/68359 , H01L2224/0345 , H01L2224/0401 , H01L2224/05006 , H01L2224/05018 , H01L2224/05027 , H01L2224/05147 , H01L2224/05166 , H01L2224/05171 , H01L2224/05558 , H01L2224/05568 , H01L2224/05572 , H01L2224/05599 , H01L2224/05644 , H01L2224/05647 , H01L2224/1145 , H01L2224/11472 , H01L2224/11849 , H01L2224/13022 , H01L2224/13023 , H01L2224/13116 , H01L2224/16 , H01L2224/742 , H01L2224/94 , H01L2924/00013 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01022 , H01L2924/01029 , H01L2924/01042 , H01L2924/0105 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04941 , H01L2924/1305 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/00014 , H01L2224/11 , H01L2224/03 , H01L2224/13099 , H01L2224/05099 , H01L2224/13599 , H01L2224/29099 , H01L2224/29599 , H01L2924/00 , H01L2224/05552
摘要: A method of forming a semiconductor interconnect including, in the order recited: (a) providing a semiconductor wafer; (b) forming bonding pads in a terminal wiring level on the frontside of the wafer; (c) reducing the thickness of the wafer; (d) forming solder bumps on the bonding pads; and (e) dicing the wafer into bumped semiconductor chips.
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