公开(公告)号：US06664511B2

公开(公告)日：2003-12-16

申请号：US10281876

申请日：2002-10-28

申请人： Douglas E. Crafts ,  James F. Farrell ,  Mark B. Farrelly ,  Suresh Ramalingam ,  Kenzo Ishida

发明人： Douglas E. Crafts ,  James F. Farrell ,  Mark B. Farrelly ,  Suresh Ramalingam ,  Kenzo Ishida

IPC分类号： H05B100

CPC分类号： G02B6/30 ,  G02B6/1203 ,  G02B6/36

摘要： A package for optical components includes an inner package enclosing the optical component, and an outer package enclosing the inner package. A heater may be disposed in the inner package proximate the optical component to control its temperature, and to maintain this temperature control, the outer package creates an isolated air pocket around the inner package, which thermally insulates the inner package from the outside environment. The outer package is formed of a material having low thermal conductivity, to promote this insulating function. This package is especially useful if the optical component comprises a planar light-wave circuit (PLC), e.g. an arrayed waveguide grating (AWG), which requires tight temperature control and structural integrity to maintain the integrity of the optical paths.

摘要翻译： 用于光学部件的封装包括封装光学部件的内部封装以及封装内部封装的外部封装。 加热器可以在靠近光学部件的内部包装件中设置以控制其温度，并且为了保持该温度控制，外部包装围绕内部包装形成隔离的空气袋，其将内部包装与外部环境热绝缘。 外包装由具有低导热性的材料形成，以促进该绝缘功能。 如果光学部件包括平面光波电路（PLC），例如， 阵列波导光栅（AWG），其需要严格的温度控制和结构完整性来维持光路的完整性。

公开(公告)号：US06525922B2

公开(公告)日：2003-02-25

申请号：US09751358

申请日：2000-12-29

申请人： Paul Winer ,  Richard H. Livengood ,  Suresh Ramalingam

发明人： Paul Winer ,  Richard H. Livengood ,  Suresh Ramalingam

IPC分类号： H01G4228

CPC分类号： H01L23/49822 ,  H01L21/563 ,  H01L23/49827 ,  H01L23/642 ,  H01L28/90 ,  H01L2224/16 ,  H01L2224/16268 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01057 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/15311 ,  H01L2924/00 ,  H01L2224/0401

摘要： A capacitor structure is formed on a substrate member having one or more via holes therein. Metallization portions within the via holes of the substrate member form part of the plates of the capacitor.

公开(公告)号：US20110291287A1

公开(公告)日：2011-12-01

申请号：US12786931

申请日：2010-05-25

申请人： Paul Y. Wu ,  Suresh Ramalingam ,  Namhoon Kim

发明人： Paul Y. Wu ,  Suresh Ramalingam ,  Namhoon Kim

IPC分类号： H01L23/48 ,  H01L21/768

CPC分类号： H01L21/76898 ,  H01L23/147 ,  H01L23/481 ,  H01L23/5384 ,  H01L25/0657 ,  H01L2223/6616 ,  H01L2224/16225 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/15311

摘要： A device has a silicon substrate with a via extending from a first surface of the silicon substrate having a conductor portion. A first dielectric portion surrounds the conductor portion. A second dielectric portion is disposed between a first silicon portion and the silicon substrate.

摘要翻译： 器件具有硅衬底，其具有从具有导体部分的硅衬底的第一表面延伸的通孔。 第一电介质部分围绕导体部分。 第二电介质部分设置在第一硅部分和硅衬底之间。

公开(公告)号：US07141448B2

公开(公告)日：2006-11-28

申请号：US09874666

申请日：2001-06-05

申请人： Suresh Ramalingam ,  Venkatesan Murali ,  Duane Cook

发明人： Suresh Ramalingam ,  Venkatesan Murali ,  Duane Cook

IPC分类号： H01L21/00 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L21/563 ,  H01L24/31 ,  H01L2224/16225 ,  H01L2224/73203 ,  H01L2224/83951 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/0401

摘要： An integrated circuit package which may include the dispense of a second encapsulant material (or fillet) different from the first underfill material on an integrated circuit package which may include an integrated circuit that is mounted to a substrate. The package may further have a first underfill material and a second underfill material that are attached to the integrated circuit and the substrate. The second encapsulant material may be tailored to inhibit cracking of the epoxy itself that propagates into the substrate during thermo-mechanical loading.

公开(公告)号：US07066657B2

公开(公告)日：2006-06-27

申请号：US09752881

申请日：2000-12-28

申请人： Venkatesan Murali ,  Douglas E. Crafts ,  Suresh Ramalingam ,  Brett M. Zaborsky ,  Siegfried B. Fleischer

发明人： Venkatesan Murali ,  Douglas E. Crafts ,  Suresh Ramalingam ,  Brett M. Zaborsky ,  Siegfried B. Fleischer

IPC分类号： G02B6/42 ,  G02B6/30

CPC分类号： G02B6/4246 ,  G02B6/4214 ,  G02B6/4292

摘要： An apparatus including a base having a first opening of a dimension suitable to pass a light emission therethrough, a first side wall coupled to the base and having a second opening of a dimension suitable to pass a light emission therethrough, a second side wall coupled to the base and having a reflective component thereon, and the base, the first side wall, and the second side wall define an interior chamber with the reflective component disposed in the interior chamber; and a fiber connector extending from an exterior of the first side wall adjacent the second opening. A method including powering a laser disposed in a substrate coupling a fiber optic cable to an optical subassembly; and aligning the optical assembly over the transceiver board to capture the emitted light from the laser in the fiber optic cable.

摘要翻译： 一种装置，包括具有第一开口的基座，该第一开口的尺寸适于通过其中的光发射;第一侧壁，其耦合到所述基座并且具有适于使光发射通过的尺寸的第二开口;第二侧壁， 所述底座并且在其上具有反射部件，并且所述基座，所述第一侧壁和所述第二侧壁限定内部腔室，所述反射部件设置在所述内部腔室中; 以及从邻近第二开口的第一侧壁的外部延伸的光纤连接器。 一种方法，包括为将光纤电缆耦合到光学子组件的基板中的激光器供电; 并且将光学组件对准在收发器板上以捕获来自光纤电缆中的激光器的发射光。

公开(公告)号：US20050117853A1

公开(公告)日：2005-06-02

申请号：US09752881

申请日：2000-12-28

申请人： Venkatesan Murali ,  Douglas Crafts ,  Suresh Ramalingam ,  Brett Zaborsky ,  Siegfried Fleischer

发明人： Venkatesan Murali ,  Douglas Crafts ,  Suresh Ramalingam ,  Brett Zaborsky ,  Siegfried Fleischer

IPC分类号： G02B6/42 ,  G02B6/36

CPC分类号： G02B6/4246 ,  G02B6/4214 ,  G02B6/4292

摘要： An apparatus including a base having a first opening of a dimension suitable to pass a light emission therethrough, a first side wall coupled to the base and having a second opening of a dimension suitable to pass a light emission therethrough, a second side wall coupled to the base and having a reflective component thereon, and the base, the first side wall, and the second side wall define an interior chamber with the reflective component disposed in the interior chamber; and a fiber connector extending from an exterior of the first side wall adjacent the second opening. A method including powering a laser disposed in a substrate coupling a fiber optic cable to an optical subassembly; and aligning the optical assembly over the transceiver board to capture the emitted light from the laser in the fiber optic cable.

摘要翻译： 一种装置，包括具有第一开口的基座，该第一开口的尺寸适于通过其中的光发射;第一侧壁，其耦合到所述基座并且具有适于使光发射通过的尺寸的第二开口;第二侧壁， 所述底座并且在其上具有反射部件，并且所述基座，所述第一侧壁和所述第二侧壁限定内部腔室，所述反射部件设置在所述内部腔室中; 以及从邻近第二开口的第一侧壁的外部延伸的光纤连接器。 一种方法，包括为将光纤电缆耦合到光学子组件的基板中的激光器供电; 并且将光学组件对准在收发器板上以捕获来自光纤电缆中的激光器的发射光。

公开(公告)号：US06687427B2

公开(公告)日：2004-02-03

申请号：US09752901

申请日：2000-12-29

申请人： Suresh Ramalingam ,  Venkatesan Murali

发明人： Suresh Ramalingam ,  Venkatesan Murali

IPC分类号： G02B626

CPC分类号： G02F1/3132 ,  G02F1/0147 ,  G02F1/3137

摘要： An apparatus comprising a body having dimensions suitable for light transmission therethrough, the body comprising a core extending therethrough, a first portion of the core comprising an index of refraction different than a second portion of the core and a cladding disposed about the core. An optical electronic integrated circuit (OEIC) substrate comprising a plurality of waveguides and a light source emitter coupled to at least one of the plurality of waveguides. A method comprising providing optical signals to an optical electronic integrated circuit (OEIC) through a plurality of waveguides are arranged in a circuit of different paths; and selecting an optical path by the index of refraction of a portion of the core.

公开(公告)号：US06528345B1

公开(公告)日：2003-03-04

申请号：US09262132

申请日：1999-03-03

申请人： Duane Cook ,  Suresh Ramalingam

发明人： Duane Cook ,  Suresh Ramalingam

IPC分类号： H01L2144

CPC分类号： H01L21/563 ,  H01L24/31 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83951 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/0401

摘要： A high throughput process line and method for underfilling an integrated circuit that is mounted to a substrate. The process line includes a first dispensing station that dispenses a first underfill material onto the substrate and an oven which moves the substrate while the underfill material flows between the integrated circuit and the substrate. The process line removes flow time (wicking time) as the bottleneck for achieving high throughput.

摘要翻译： 用于底部填充安装到基板的集成电路的高通量处理线和方法。 工艺线包括第一分配工位，其将第一底部填充材料分配到衬底上;以及烘箱，其在衬底材料在集成电路和衬底之间流动的同时移动衬底。 流程线将流动时间（芯吸时间）作为实现高吞吐量的瓶颈。

公开(公告)号：US20050109769A1

公开(公告)日：2005-05-26

申请号：US10719583

申请日：2003-11-21

申请人： John McClure ,  Suresh Ramalingam ,  James Lezotte

发明人： John McClure ,  Suresh Ramalingam ,  James Lezotte

IPC分类号： B23K20/06 ,  B23K20/22 ,  H05B6/14 ,  H05B6/10

CPC分类号： B21D39/021 ,  B21D26/14 ,  B23K20/06 ,  B23K20/22 ,  B23K33/002 ,  B23K2103/04 ,  B23K2103/10

摘要： A hemming machine for joining an inner sheet metal panel with an outer sheet metal panel comprising: a hemming tool containing an electromagnetic coil positioned to electromagnetically crimp and/or weld the outer sheet metal panel to the inner sheet metal panel, where a backing die positioned outside the inner metallic sheet and the outer metallic sheet opposite the electromagnetic coil.

摘要翻译： 一种用于将内部金属板与外部金属板接合的折边机，包括：折叠工具，其包含电磁线圈，该电磁线圈定位成将外部金属板电磁地卷曲和/或焊接到内部金属板，其中背衬模具定位 在内部金属片外面和与电磁线圈相对的外部金属片。

公开(公告)号：US06778727B2

公开(公告)日：2004-08-17

申请号：US10714414

申请日：2003-11-14

申请人： Suresh Ramalingam ,  Venkatesan Murali

发明人： Suresh Ramalingam ,  Venkatesan Murali

IPC分类号： G02B626

CPC分类号： G02F1/3132 ,  G02F1/0147 ,  G02F1/3137

摘要： An apparatus comprising a body having dimensions suitable for light transmission therethrough, the body comprising a core extending therethrough, a first portion of the core comprising an index of refraction different than a second portion of the core and a cladding disposed about the core. An optical electronic integrated circuit (OEIC) substrate comprising a plurality of waveguides and a light source emitter coupled to at least one of the plurality of waveguides. A method comprising providing optical signals to an optical electronic integrated circuit (OEIC) through a plurality of waveguides are arranged in a circuit of different paths; and selecting an optical path by the index of refraction of a portion of the core.