公开(公告)号：US09260291B2

公开(公告)日：2016-02-16

申请号：US12494147

申请日：2009-06-29

申请人： Stephane Caplet ,  Xavier Baillin

发明人： Stephane Caplet ,  Xavier Baillin

IPC分类号： B32B3/24 ,  H01L23/00 ,  B81B7/00 ,  H01L23/26

CPC分类号： B81B7/0038 ,  H01L23/26 ,  H01L2924/0002 ,  Y10T428/24331 ,  Y10T428/24612 ,  H01L2924/00

摘要： Getter structure comprising a substrate and at least one getter material-based layer mechanically connected to the substrate by means of at least one support, in which the surface of the support in contact with the substrate is smaller than the surface of a first face of the getter material layer, in which said first face is in contact with the support, and a second face of the getter material layer, opposite said first face is at least partially exposed.

摘要翻译： 吸气体结构包括基底和至少一个通过至少一个支撑件机械地连接到基底的吸气剂材料层，其中与衬底接触的支撑体的表面小于第一面的表面 吸气剂材料层，其中所述第一面与支撑体接触，吸气剂材料层的与所述第一面相对的第二面至少部分地露出。

公开(公告)号：US09051173B2

公开(公告)日：2015-06-09

申请号：US12898094

申请日：2010-10-05

申请人： Xavier Baillin ,  Emmanuelle Lagoutte ,  Guillaume Rodriguez

发明人： Xavier Baillin ,  Emmanuelle Lagoutte ,  Guillaume Rodriguez

IPC分类号： H05K5/00 ,  B05D5/12 ,  B81C1/00 ,  H01J29/94 ,  H01L23/10 ,  H01L23/26

CPC分类号： B81C1/00285 ,  H01J29/94 ,  H01J2211/52 ,  H01L23/10 ,  H01L23/26 ,  H01L2924/0002 ,  H01L2924/16195 ,  H01L2924/00

摘要： A treatment method for a getter material is provided, including forming a protective layer on the thin layer getter material by performing at least one oxidation and/or nitriding step of the thin layer getter material conducted under dry atmosphere of dioxygen and/or dinitrogen, wherein the protective layer is composed of oxide and/or nitride of the thin layer getter material, and wherein a thickness of the protective layer is between approximately 1 nm and 10 nm.

摘要翻译： 提供一种吸气剂材料的处理方法，包括通过在二氧和/或二氮的干燥气氛下进行的薄层吸气剂材料的至少一个氧化和/或氮化步骤，在薄层吸气剂材料上形成保护层，其中 保护层由薄层吸气剂材料的氧化物和/或氮化物构成，其中保护层的厚度在约1nm至10nm之间。

公开(公告)号：US08367940B2

公开(公告)日：2013-02-05

申请号：US12872251

申请日：2010-08-31

申请人： Thierry Hilt ,  Xavier Baillin

发明人： Thierry Hilt ,  Xavier Baillin

IPC分类号： H05K1/16

CPC分类号： B81B7/0077 ,  Y10T428/24562

摘要： The invention concerns a device for encapsulating an element within a microcavity made on a support (10), this device comprising an encapsulating membrane (12) capable of forming at least one part of the microcavity,characterized in that the device comprises at least one arm which mechanically attaches the membrane to the support, this arm being capable of bending so as to shift the membrane between: an open position in which the membrane overhangs the element to be encapsulated and its periphery defines an aperture extending around the element to be encapsulated, and a shut position in which the periphery of the encapsulation membrane rests on the support to obstruct this aperture.

摘要翻译： 本发明涉及一种用于将元件封装在支撑件（10）上制成的微空腔内的装置，该装置包括能够形成微腔的至少一部分的封装膜（12），其特征在于，该装置包括至少一个臂 其将膜机械地附接到支撑件上，该臂能够弯曲以便在下述位置之间移动膜：打开位置，其中膜突出于待包封的元件及其周边限定围绕待包封的元件延伸的孔， 以及关闭位置，其中包封膜的周边搁置在支撑件上以阻塞该孔。

公开(公告)号：US08367929B2

公开(公告)日：2013-02-05

申请号：US12848386

申请日：2010-08-02

申请人： Xavier Baillin ,  Stéphane Caplet ,  Thierry Hilt

发明人： Xavier Baillin ,  Stéphane Caplet ,  Thierry Hilt

IPC分类号： H05K5/00

CPC分类号： B81C1/00293 ,  B81C2203/0145 ,  Y10T156/1057

摘要： A microcavity structure including: a first substrate, a cover attached to the first substrate such that a space formed between the cover and the first substrate forms the microcavity, at least one hole passing through the cover, and at least one closing flap of the hole placed inside the microcavity and including at least two portions of materials with different thermal expansion coefficients placed one against the other, at least one first end of the two portions being mechanically linked to the cover, at least a second end of the two portions being free, and at least a part of the closing flap being placed opposite the hole, the two portions being capable of closing or not the hole under the effect of a temperature variation.

摘要翻译： 一种微腔结构，包括：第一基板，附接到第一基板的盖，使得形成在盖和第一基板之间的空间形成微腔，穿过盖的至少一个孔和孔的至少一个封闭盖 放置在所述微腔内部并且包括具有不同热膨胀系数的材料的至少两部分彼此相对放置，所述两个部分的至少一个第一端机械地连接到所述盖，所述两个部分的至少第二端是自由的 并且所述封闭翼片的至少一部分与所述孔相对放置，所述两个部分能够在温度变化的作用下闭合所述孔。

公开(公告)号：US20120161333A1

公开(公告)日：2012-06-28

申请号：US13311146

申请日：2011-12-05

申请人： Aurelie THUAIRE ,  Xavier Baillin ,  Nicolas Sillon

发明人： Aurelie THUAIRE ,  Xavier Baillin ,  Nicolas Sillon

IPC分类号： H01L23/522 ,  H01L21/768

CPC分类号： H01L21/76898

摘要： Device for connecting nano-objects to external electrical systems, and method for producing the device.According to the invention, which applies in particular to molecular characterization, a device including the following is produced: an upper layer (16) equipped with upper contact pads (8) to be connected to a nano-object (2); a lower layer (18), equipped with lower contact pads (12) to be connected to an external electrical system (4); above the lower layer, a bonding layer (20) including electrical through-vias (22) in contact with the lower pads; and, between the bonding layer and the upper layer, at least two layers (22, 24) equipped with conductive lines (25) and electrical vias (26), for connecting the upper pads to the lower pads.

摘要翻译： 用于将纳米物体连接到外部电气系统的装置以及用于制造该装置的方法。 根据本发明，其特别适用于分子表征，产生了包括以下的器件：上层（16），其配备有要连接到纳米物体（2）的上接触焊盘（8）; 下层（18），其配备有连接到外部电气系统（4）的下接触焊盘（12）; 在下层上方，包括与下垫接触的电通孔（22）的接合层（20） 并且在所述接合层和所述上层之间具有至少两个配备有导线（25）和电气通孔（26）的层（22,24），用于将所述上焊盘连接到所述下焊盘。

公开(公告)号：US20110115056A1

公开(公告)日：2011-05-19

申请号：US12917965

申请日：2010-11-02

申请人： Xavier Baillin

发明人： Xavier Baillin

IPC分类号： H01L29/32

CPC分类号： B81B7/0038 ,  H01L23/26 ,  H01L2924/0002 ,  H01L2924/00

摘要： The structure comprises a closed cavity under a controlled atmosphere in which a monoblock getter with a first getter layer is arranged. The first getter layer presents at least first and second getter areas which have different activation temperatures. The second getter area is formed on an adjustment sub-layer of the getter material activation temperature.

摘要翻译： 该结构包括在受控气氛下的封闭空腔，其中布置了具有第一吸气剂层的整体吸气剂。 第一吸气剂层至少呈现具有不同活化温度的第一和第二吸气剂区域。 第二吸气剂区域形成在吸气剂材料活化温度的调整子层上。

公开(公告)号：US09309110B2

公开(公告)日：2016-04-12

申请号：US12494123

申请日：2009-06-29

申请人： Stephane Caplet ,  Xavier Baillin ,  Jean-Louis Pornin

发明人： Stephane Caplet ,  Xavier Baillin ,  Jean-Louis Pornin

IPC分类号： H01L21/00 ,  B81C1/00

CPC分类号： B81C1/00285 ,  B81C2203/0136 ,  B81C2203/0145

摘要： A method of encapsulating a microelectronic device arranged on a substrate, comprising at least the following steps: a) formation of a portion of sacrificial material covering at least one part of the microelectronic device, the volume of which occupies a space intended to form at least one part of a cavity in which the device is intended to be encapsulated; b) deposition of a layer based on at least one getter material, covering at least one part of the portion of sacrificial material; c) formation of at least one orifice through at least the layer of getter material, forming an access to the portion of sacrificial material; d) elimination of the portion of sacrificial material via the orifice, forming the cavity in which the microelectronic device is encapsulated; and e) sealing of the cavity.

摘要翻译： 一种封装布置在衬底上的微电子器件的方法，至少包括以下步骤：a）形成覆盖微电子器件的至少一部分的牺牲材料的一部分，其体积占据至少形成的空间 腔体的一部分，其中装置旨在被包封; b）沉积基于至少一种吸气材料的层，覆盖牺牲材料部分的至少一部分; c）通过至少所述吸气材料层形成至少一个孔口，形成对所述牺牲材料部分的通路; d）通过孔口消除部分牺牲材料，形成其中封装有微电子器件的腔体; 和e）密封腔。

公开(公告)号：US09181088B2

公开(公告)日：2015-11-10

申请号：US13218763

申请日：2011-08-26

申请人： Henri Sibuet ,  Xavier Baillin ,  Nicolas Sillon

发明人： Henri Sibuet ,  Xavier Baillin ,  Nicolas Sillon

IPC分类号： B32B15/01 ,  B81C3/00 ,  H01L23/10

CPC分类号： B81C3/001 ,  B81C2203/0109 ,  B81C2203/035 ,  H01L23/10 ,  H01L2224/8181 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/1461 ,  Y10T428/31678 ,  H01L2924/00

摘要： An assembly of two objects integral with each other through at least one linking element provided between both objects, said linking element including at least a first material portion comprising intermetallic compounds of a phase formed with a first brazing metal and a second metal the melting point of which is higher than that of the first brazing metal, said linking element further including at least a second material portion composed of at least a third metal, said second material portion contacting both objects.

摘要翻译： 两个物体的组合通过设置在两个物体之间的至少一个连接元件彼此成一体，所述连接元件至少包括第一材料部分，该第一材料部分包含与第一钎焊金属形成的相的金属间化合物和第二金属， 其高于第一钎焊金属，所述连接元件还包括至少由至少第三金属构成的第二材料部分，所述第二材料部分接触两个物体。

公开(公告)号：US09041174B2

公开(公告)日：2015-05-26

申请号：US12917965

申请日：2010-11-02

申请人： Xavier Baillin

发明人： Xavier Baillin

IPC分类号： H01L23/26 ,  B81B7/00

CPC分类号： B81B7/0038 ,  H01L23/26 ,  H01L2924/0002 ,  H01L2924/00

摘要： The structure comprises a closed cavity under a controlled atmosphere in which a monoblock getter with a first getter layer is arranged. The first getter layer presents at least first and second getter areas which have different activation temperatures. The second getter area is formed on an adjustment sub-layer of the getter material activation temperature.

摘要翻译： 该结构包括在受控气氛下的封闭空腔，其中布置了具有第一吸气剂层的整体吸气剂。 第一吸气剂层至少呈现具有不同活化温度的第一和第二吸气剂区域。 第二吸气剂区域形成在吸气剂材料活化温度的调整子层上。

公开(公告)号：US08962069B2

公开(公告)日：2015-02-24

申请号：US13605019

申请日：2012-09-06

申请人： Jean-Louis Pornin ,  Xavier Baillin ,  Charlotte Gillot ,  Laurent Vandroux

发明人： Jean-Louis Pornin ,  Xavier Baillin ,  Charlotte Gillot ,  Laurent Vandroux

IPC分类号： B05D5/12 ,  B29C41/20 ,  B81C1/00 ,  H01L23/053 ,  H01L23/31

CPC分类号： B29C41/20 ,  B81C1/00285 ,  B81C2203/0136 ,  B81C2203/0145 ,  H01L23/053 ,  H01L23/315 ,  H01L2924/0002 ,  H01L2924/00

摘要： A process for making an encapsulation structure comprising the following steps: 1) make at least one portion of material capable of releasing at least one gas when said material is heated, the portion of material communicating with the inside of a hermetically closed cavity of the encapsulation structure, 2) heat all or part of said portion of material such that at least part of the gas is released from said portion of material in the cavity, and in which said portion of material capable of releasing at least one gas when said material is heated comprises elements trapped in said portion of material, said trapped elements being released from said portion of material in gaseous form when said material is heated.

摘要翻译： 一种制造封装结构的方法，包括以下步骤：1）当所述材料被加热时，使材料的至少一部分能够释放至少一种气体，所述材料部分与封装的气密封闭腔的内部连通 结构，2）加热所述部分材料的全部或部分，使得至少部分气体从空腔中的所述材料部分释放，并且其中当所述材料为所述材料时能够释放至少一种气体的所述材料部分 被加热的元件被捕获在材料的所述部分中，当所述材料被加热时，所述被捕获元件从气态形式的所述材料部分释放。