公开(公告)号：US09181088B2

公开(公告)日：2015-11-10

申请号：US13218763

申请日：2011-08-26

申请人： Henri Sibuet ,  Xavier Baillin ,  Nicolas Sillon

发明人： Henri Sibuet ,  Xavier Baillin ,  Nicolas Sillon

IPC分类号： B32B15/01 ,  B81C3/00 ,  H01L23/10

CPC分类号： B81C3/001 ,  B81C2203/0109 ,  B81C2203/035 ,  H01L23/10 ,  H01L2224/8181 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/1461 ,  Y10T428/31678 ,  H01L2924/00

摘要： An assembly of two objects integral with each other through at least one linking element provided between both objects, said linking element including at least a first material portion comprising intermetallic compounds of a phase formed with a first brazing metal and a second metal the melting point of which is higher than that of the first brazing metal, said linking element further including at least a second material portion composed of at least a third metal, said second material portion contacting both objects.

摘要翻译： 两个物体的组合通过设置在两个物体之间的至少一个连接元件彼此成一体，所述连接元件至少包括第一材料部分，该第一材料部分包含与第一钎焊金属形成的相的金属间化合物和第二金属， 其高于第一钎焊金属，所述连接元件还包括至少由至少第三金属构成的第二材料部分，所述第二材料部分接触两个物体。

公开(公告)号：US08692385B2

公开(公告)日：2014-04-08

申请号：US13311146

申请日：2011-12-05

申请人： Aurélie Thuaire ,  Xavier Baillin ,  Nicolas Sillon

发明人： Aurélie Thuaire ,  Xavier Baillin ,  Nicolas Sillon

IPC分类号： H01L23/52 ,  B82Y10/00

CPC分类号： H01L21/76898

摘要： Device for connecting nano-objects to external electrical systems, and method for producing the device.According to the invention, which applies in particular to molecular characterization, a device including the following is produced: an upper layer equipped with upper contact pads to be connected to a nano-object; a lower layer, equipped with lower contact pads to be connected to an external electrical system; above the lower layer, a bonding layer including electrical through-vias in contact with the lower pads; and, between the bonding layer and the upper layer, at least two layers equipped with conductive lines and electrical vias, for connecting the upper pads to the lower pads.

摘要翻译： 用于将纳米物体连接到外部电气系统的装置以及用于制造该装置的方法。 根据本发明，其特别适用于分子表征，产生包括以下的器件：上层，其具有要连接到纳米物体的上接触焊盘; 下层，配有要连接到外部电气系统的下接触焊盘; 在所述下层之上，包括与所述下垫接触的电通孔的接合层; 并且在所述接合层和所述上层之间，具有至少两层配备有导线和电气通孔的层，用于将所述上焊盘连接到所述下焊盘。

公开(公告)号：US20120161333A1

公开(公告)日：2012-06-28

申请号：US13311146

申请日：2011-12-05

申请人： Aurelie THUAIRE ,  Xavier Baillin ,  Nicolas Sillon

发明人： Aurelie THUAIRE ,  Xavier Baillin ,  Nicolas Sillon

IPC分类号： H01L23/522 ,  H01L21/768

CPC分类号： H01L21/76898

摘要： Device for connecting nano-objects to external electrical systems, and method for producing the device.According to the invention, which applies in particular to molecular characterization, a device including the following is produced: an upper layer (16) equipped with upper contact pads (8) to be connected to a nano-object (2); a lower layer (18), equipped with lower contact pads (12) to be connected to an external electrical system (4); above the lower layer, a bonding layer (20) including electrical through-vias (22) in contact with the lower pads; and, between the bonding layer and the upper layer, at least two layers (22, 24) equipped with conductive lines (25) and electrical vias (26), for connecting the upper pads to the lower pads.

摘要翻译： 用于将纳米物体连接到外部电气系统的装置以及用于制造该装置的方法。 根据本发明，其特别适用于分子表征，产生了包括以下的器件：上层（16），其配备有要连接到纳米物体（2）的上接触焊盘（8）; 下层（18），其配备有连接到外部电气系统（4）的下接触焊盘（12）; 在下层上方，包括与下垫接触的电通孔（22）的接合层（20） 并且在所述接合层和所述上层之间具有至少两个配备有导线（25）和电气通孔（26）的层（22,24），用于将所述上焊盘连接到所述下焊盘。

公开(公告)号：US08912620B2

公开(公告)日：2014-12-16

申请号：US13544032

申请日：2012-07-09

申请人： Christine Ferrandon ,  Xavier Baillin

发明人： Christine Ferrandon ,  Xavier Baillin

IPC分类号： H01L31/058 ,  B81B7/00

CPC分类号： B81B7/0038 ,  Y10T428/183 ,  Y10T428/187

摘要： Getter structure comprising at least one getter portion arranged on a support and including at least two adjacent getter material parts arranged on the support one beside the other, with different thicknesses and of which the surface grain densities are different from one another.

摘要翻译： 吸气剂结构包括布置在支撑件上的至少一个吸气剂部分，并且包括布置在支撑件上的至少两个相邻的吸气剂材料部件，其具有不同的厚度，并且其表面颗粒密度彼此不同。

公开(公告)号：US20120328779A1

公开(公告)日：2012-12-27

申请号：US13530513

申请日：2012-06-22

申请人： Stéphane Caplet ,  Xavier Baillin

发明人： Stéphane Caplet ,  Xavier Baillin

IPC分类号： B05D5/00

CPC分类号： B81B7/0038

摘要： Process for making a device comprising at least the following steps: produce a getter structure comprising at least one portion of getter material permeable to gas covered by at least one protective layer hermetic to gas; hermetic encapsulation of the getter structure in a cavity; production of at least one local opening passing through the protective layer and forming an access to the portion of getter material permeable to gas.

摘要翻译： 制造装置的方法至少包括以下步骤：产生吸气剂结构，该吸气剂结构包括至少一部分吸气剂材料，所述吸气剂材料可透气至少一层气体保护层所覆盖的气体; 吸气剂结构在空腔中的气密封装; 产生通过保护层的至少一个局部开口，并形成通向气体的吸气剂材料部分的通路。

公开(公告)号：US08112882B2

公开(公告)日：2012-02-14

申请号：US12285623

申请日：2008-10-09

申请人： Xavier Baillin ,  Jean Brun ,  Thierry Enot ,  David Henry

发明人： Xavier Baillin ,  Jean Brun ,  Thierry Enot ,  David Henry

IPC分类号： H05K3/30

CPC分类号： B81C1/00269 ,  B81B2203/0315 ,  B81C2203/0118 ,  B81C2203/019 ,  H01L23/10 ,  H01L2924/0002 ,  Y10T29/49002 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49171 ,  Y10T29/49181 ,  Y10T29/49218 ,  H01L2924/00

摘要： A method for producing a structure includes bonding two substrates facing one another by crushing a closed peripheral sealing strip located between the two substrates, the closed peripheral sealing strip delineating a closed cavity between the substrates. A microsystem is disposed on one of the substrates within the closed cavity. Before crushing, the sealing strip includes perforated patterns delineating a plurality of voids inside the strip.

摘要翻译： 一种用于制造结构的方法包括通过破碎位于两个基板之间的封闭的外围密封条来封闭彼此面对的两个基板，封闭的外围密封条描绘出基板之间的封闭空腔。 微系统设置在闭合腔内的一个衬底上。 在破碎之前，密封条包括描绘带内的多个空隙的穿孔图案。

公开(公告)号：US08981544B2

公开(公告)日：2015-03-17

申请号：US13285289

申请日：2011-10-31

申请人： Xavier Baillin ,  Christine Ferrandon

发明人： Xavier Baillin ,  Christine Ferrandon

IPC分类号： H01L23/20 ,  H01L21/322 ,  H01L23/26 ,  H01L23/31 ,  B81B7/00

CPC分类号： H01L23/26 ,  B81B7/0038 ,  H01L23/315 ,  H01L2924/0002 ,  H01L2924/00

摘要： A packaging structure including at least one cavity wherein at least one micro-device is provided, the cavity being bounded by at least a first substrate and at least a second substrate integral with the first substrate through at least one bonding interface consisting of at least one metal or dielectric material, wherein at least one main face of the second substrate provided facing the first substrate is covered with at least one layer of at least one getter material, the bonding interface being provided between the first substrate and the layer of getter material.

摘要翻译： 包括至少一个空腔的包装结构，其中提供至少一个微器件，所述空腔由至少一个第一衬底和至少第二衬底限定，所述至少一个第二衬底通过至少一个结合界面，所述至少一个结合界面由至少一个 金属或电介质材料，其中所述第二基板的面向所述第一基板的至少一个主面被至少一层至少一种吸气材料覆盖，所述接合界面设置在所述第一基底和所述吸气剂材料层之间。

公开(公告)号：US20100193215A1

公开(公告)日：2010-08-05

申请号：US12679487

申请日：2008-10-09

申请人： Xavier Baillin

发明人： Xavier Baillin

IPC分类号： H05K5/06

CPC分类号： B81B7/0038 ,  H01L23/10 ,  H01L23/26 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/00

摘要： The structure comprises at least a device, for example a microelectronic chip, and at least a getter arranged in a cavity under a controlled atmosphere delineated by a substrate and a sealing cover. The getter comprises at least one preferably metallic getter layer, and an adjustment sub-layer made from pure metal, situated between the getter layer and the substrate, on which it is formed. The adjustment sub-layer is designed to modulate the activation temperature of the getter layer. The getter layer comprises two elementary getter layers.

摘要翻译： 该结构至少包括一个装置，例如微电子芯片，以及至少一个排气孔，该吸气剂被布置在由基板和密封盖所描绘的受控气氛下的空腔中。 吸气剂包括至少一个优选金属吸气剂层和由纯金属制成的调节子层，位于吸气剂层和衬底之间，其上形成有吸收剂层。 调整子层设计为调节吸气剂层的活化温度。 吸气剂层包括两个基本吸气剂层。

公开(公告)号：US20100003789A1

公开(公告)日：2010-01-07

申请号：US12494123

申请日：2009-06-29

申请人： Stephane CAPLET ,  Xavier Baillin ,  Jean-Louis Pornin

发明人： Stephane CAPLET ,  Xavier Baillin ,  Jean-Louis Pornin

IPC分类号： H01L21/56

CPC分类号： B81C1/00285 ,  B81C2203/0136 ,  B81C2203/0145

摘要： A method of encapsulating a microelectronic device arranged on a substrate, comprising at least the following steps: a) formation of a portion of sacrificial material covering at least one part of the microelectronic device, the volume of which occupies a space intended to form at least one part of a cavity in which the device is intended to be encapsulated; b) deposition of a layer based on at least one getter material, covering at least one part of the portion of sacrificial material; c) formation of at least one orifice through at least the layer of getter material, forming an access to the portion of sacrificial material; d) elimination of the portion of sacrificial material via the orifice, forming the cavity in which the microelectronic device is encapsulated; and e) sealing of the cavity.

摘要翻译： 一种封装布置在衬底上的微电子器件的方法，至少包括以下步骤：a）形成覆盖微电子器件的至少一部分的牺牲材料的一部分，其体积占据至少形成的空间 腔体的一部分，其中装置旨在被包封; b）沉积基于至少一种吸气材料的层，覆盖牺牲材料部分的至少一部分; c）通过至少所述吸气材料层形成至少一个孔口，形成对所述牺牲材料部分的通路; d）通过孔口消除部分牺牲材料，形成其中封装有微电子器件的腔体; 和e）密封腔。

公开(公告)号：US08956958B2

公开(公告)日：2015-02-17

申请号：US13883480

申请日：2011-10-31

申请人： Xavier Baillin

发明人： Xavier Baillin

IPC分类号： H01L21/332 ,  H01L23/58 ,  H01L21/322 ,  B81C1/00 ,  H01L21/50 ,  H01L23/10 ,  H01L23/26

CPC分类号： H01L21/3221 ,  B81C1/00285 ,  B81C2201/019 ,  B81C2203/0118 ,  B81C2203/036 ,  H01L21/50 ,  H01L23/10 ,  H01L23/26 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method for producing a substrate with buried layers of getter material, including: making a first stack including one layer of a first getter material, arranged on a first support; making a second stack including one layer of a second getter material, arranged on a second support; and bringing the first stack into contact with the second stack and performing thermocompression, the layers of the first and of the second getter material being arranged between the first and the second support, at a temperature greater than or equal to a lowest temperature among thermal activation temperatures of the first and of the second getter material, to bond the layers of the first and second getter materials together.

摘要翻译： 一种用于制造具有吸气材料掩埋层的衬底的方法，包括：制备包括一层第一吸气剂材料的第一堆叠，其布置在第一支撑件上; 制造第二堆叠，其包括布置在第二支撑件上的第二吸气剂材料层; 并且使所述第一叠层与所述第二堆叠接触并进行热压，所述第一和第二吸气材料的层被布置在所述第一和第二载体之间，其温度大于或等于热活化之间的最低温度 第一和第二吸气剂材料的温度，将第一和第二吸气剂材料的层粘合在一起。