摘要:
The present invention relates to a Ni base alloy having sufficient strength at high temperatures and high corrosion resistance at high temperatures in a high-temperature composite corrosive environment in which chlorination or sulfidation occurs simultaneously with high-temperature oxidation, without excessive cooling or surface protection. According to the present invention, a Ni base alloy having high-temperature strength and corrosion resistance includes Cr in a range of from 25 to 40 weight %, Al in a range of from 1.5 to 2.5 weight %, C in a range of from 0.1 to 0.5 weight %, W of 15 weight % or less, Mn of 2.0 weight % or less, Si in a range of from 0.3 to 6 weight %, Fe of 5% or less, and Ni of rest except inevitable impurities. When strength at high temperatures is allowed to be small, W is in a range of from 0 to 8%, and Si is in a range of from 0.3 to 1% or from 1 to 6%. In order to enhance strength at high temperatures, W is in a range of from 8 to 15, and Si is in a range of from 0.3 to 1% or from 1 to 6%.
摘要:
An automatic air conditioning system for automotive vehicles with a variable displacement compressor comprises a sensor for detecting an intake air temperature, defined by a temperature of air flowing through an evaporator, placed just behind the evaporator, an intake pressure sensor for detecting an intake manifold pressure, and a CPU for determining whether the cooling requirements of the evaporator are satisfied on the basis of the intake air temperature compared to a predetermined value. The CPU controls the compressor in such a manner that the discharge volume of refrigerant discharged from the compressor is decreased only when the cooling requirements are met. Thus, the automatic air conditioning system prevents uncomfortably warm conditioned air from being discharged through a vent door under acceleration conditions.
摘要:
Provided is a circuit device in which encapsulating resin to encapsulate a circuit board is optimized in shape, and a method of manufacturing the circuit device. A hybrid integrated circuit device, which is a circuit device according to the present invention includes a circuit board, a circuit element mounted on a top surface of the circuit board, and encapsulating resin encapsulating the circuit element, and coating the top surface, side surfaces, and a bottom surface of the circuit board. In addition, the encapsulating resin is partly recessed and thereby provided with recessed areas at two sides of the circuit board. The providing of the recessed areas reduces the amount of resin to be used, and prevents the hybrid integrated circuit device from being deformed by the cure shrinkage of the encapsulating resin.
摘要:
To improve reliability of a circuit module by improving heat release performance and minimizing thermal influence on a device to be mounted, a base substrate having a first substrate mounted thereon is fitted into a lower portion of casing member, and a second substrate is installed in the upper portion of the casing member so that a spaced area can be provided. In addition, a drive device to be installed on the second substrate is positioned off the center of the second substrate.
摘要:
An automotive air tempering apparatus for use in an automotive vehicle having a duct through which air is directed into a passenger compartment. The apparatus comprises an air chilling unit including an evaporator provided in the duct and a compressor having a displacement variable for supplying a controlled amount of refrigerant to the evaporator for chilling the air in the duct. A control unit controls the displacement of the compressor to bring the refrigerant temperature to a target value when air is introduced into the duct from the atmosphere. The control unit controls the displacement of the compressor to bring the chilled air temperature to a target value when air is introduced into the duct from the passenger compartment.
摘要:
Provided is a circuit device capable of increasing the packaging density and also suppressing the thermal interference between incorporated circuit elements. In a hybrid integrated circuit device, a first circuit board and a second circuit board are incorporated into a case member being arranged in a way that the first circuit board is overlaid with the second circuit board. A first circuit element is arranged on the upper face of the first circuit board and a second circuit element is arranged on the upper face of the second circuit board. In addition, inside the case member, a hollow portion (internal space) which is not filled with a sealing resin is provided, and this hollow portion communicates with the outside through a communicating opening, which is provided by partially opening the case member.
摘要:
A rotary variable resistor includes a variable resistor body mounted to a console panel, a rotor shaft protruding outward from the variable resistor body, and a control knob coupled to an outer end of the rotor shaft. A single plate-shaped stopper is projectingly provided, along a rotational direction of the rotor shaft, on a front face of the variable resistor body from which the rotor shaft protrudes. First and second restricting portions are provided on the control knob side-by-side along the rotational direction of the rotor shaft to alternately abut against the stopper in defining an actual rotational angle of the rotor shaft.
摘要:
To provide a hybrid integrated circuit device in which the rear surface of a circuit board is exposed to the outside and a method of manufacturing the same. Here, leads are fixed to the surface of the circuit board along one side thereof. A method of manufacturing a hybrid integrated circuit device includes the steps of forming an electric circuit which includes a conductive pattern formed on a surface of a circuit board and a circuit element electrically connected to the conductive pattern, fixing a lead to a pad formed of the conductive pattern, housing the circuit board in a cavity of molds, and fixedly supporting the lead by clamping the lead between the molds, and performing sealing by filling inside of the cavity with sealing resin with the rear surface of the circuit board made in contact with an inside bottom surface of the molds.