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公开(公告)号：US08847080B2
公开(公告)日：2014-09-30
申请号：US13378110
申请日：2010-06-03
申请人： Yoshihisa Warashina
发明人： Yoshihisa Warashina
IPC分类号： H05K1/09 , H01L23/14 , H01L23/498 , H01L23/13 , H01L27/146
CPC分类号： H01L23/147 , H01L23/13 , H01L23/49822 , H01L23/49827 , H01L23/49872 , H01L27/14636 , H01L2224/16225 , H01L2924/157 , H01L2924/3011
摘要： In a multilayer wiring board, a low resistance silicon substrate having a predetermined resistivity and a high resistance silicon substrate having a resistivity higher than the predetermined resistivity are stacked while interposing an insulating layer therebetween. The low resistance silicon substrate is provided with an electric passage part surrounded by a ring-shaped groove, while a wiring film electrically connected to the electric passage part through an opening of the insulating layer is disposed on a rear face of the high resistance silicon substrate and an inner face of a recess. Since the high resistance silicon substrate is thus provided with the wiring film, an optical semiconductor element and an electronic circuit element which differ from each other in terms of the number and positions of electrode pads can be electrically connected to each other on the front and rear face sides of the multilayer wiring board.
摘要翻译： 在多层布线板中，层叠具有预定电阻率的低电阻硅基板和具有比预定电阻率高的电阻率的高电阻硅基板，同时在其间插入绝缘层。 低电阻硅基板设置有被环状槽包围的电通路部分，而通过绝缘层的开口电连接到电通路部分的布线膜设置在高电阻硅衬底的背面上 和凹部的内表面。 由于高电阻硅衬底因此设置有布线膜，所以在电极焊盘的数量和位置方面彼此不同的光半导体元件和电子电路元件可以在前后互相电连接 多层布线板的正面。
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公开(公告)号：US07433554B2
公开(公告)日：2008-10-07
申请号：US10589604
申请日：2005-02-15
CPC分类号： G02B6/43 , G02B6/4214 , H05K1/0274
摘要： An optical wiring board by which an optical waveguide can be easily aligned with a light emitting element and a light detecting element. The optical wiring board (1) is provided with a substrate (10). On the substrate (10), a plurality of recessed parts (12) are formed, and the optical waveguide (13) is formed between the recessed parts (12). In the recessed part (12), a light receiving/emitting member (30), which is mounted on an inserting part (22) on a base member (20), is arranged. In the inserting member (22), reflecting planes (26, 27) are formed on inclined planes, and an optical path of the optical waveguide (13) matches with that of a light detecting part (34) and a light emitting part (37) in the light receiving/emitting member (30) via the reflecting planes (26, 27).
摘要翻译： 光学布线基板，光波导可以容易地与发光元件和光检测元件对准。 光配线板（1）设置有基板（10）。 在基板（10）上形成有多个凹部（12），在凹部（12）之间形成有光波导（13）。 在凹部（12）中，设置有安装在基部构件（20）上的插入部（22）上的受光/发射构件（30）。 在插入构件（22）中，反射面（26,27）形成在倾斜面上，光波导（13）的光路与光检测部（34）和发光部（37）的光路一致 ）经由反射面（26,27）在光接收/发射构件（30）中。
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13.发明申请公开(公告)号：US20050100293A1
公开(公告)日：2005-05-12
申请号：US10984748
申请日：2004-11-10
申请人： Yoshihisa Warashina , Yasuji Hoshino , Kei Tabata , Shogo Iyama
发明人： Yoshihisa Warashina , Yasuji Hoshino , Kei Tabata , Shogo Iyama
IPC分类号： G02B6/36 , H01L31/0203 , H01L31/032 , H01L31/18 , H01S5/022
CPC分类号： H01L25/167 , H01L31/0203 , H01L2224/48137 , H01L2224/48195 , H01L2924/3011 , H01S5/02212 , H01S5/0427 , H01S5/06226 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： The present invention relates to a high-frequency signal transmitting optical module which can easily realize a high-frequency signal transmission by use of a semiconductor optical device to which a highly versatile metal can package has been applied. In the high-frequency signal transmitting optical module, after fixing, to a rear surface of a stem of the metal can package, fixing portions of the linear outer leads by laser welding, the end portions of the outer leads are bent. By this, the outer leads can be easily attached to the semiconductor optical device. On both sides of the respective lead pins of the semiconductor optical device, since the outer leads extending along these are attached to the rear surface of the stem, ground regions are continuously provided on both sides of the respective lead pins by the stem and respective outer leads, whereby TEM wave transmission lines are formed. Accordingly, high-frequency signals can be transmitted to the semiconductor optical device.
摘要翻译： 高频信号发送光模块技术领域本发明涉及一种高频信号发送光模块，其可以通过使用已经应用了高通用金属罐封装的半导体光学器件来容易地实现高频信号传输。 在高频信号发送光学模块中，在通过激光焊接固定到金属罐的杆的后表面之后，通过激光焊接固定线状外部引线的一部分，使外部引线的端部弯曲。 由此，能够容易地将外部引线安装在半导体光学元件上。 在半导体光学器件的各个引脚的两侧上，由于沿着这些引线延伸的外引线附着到杆的后表面，接地区域通过杆和相应的外部连续地设置在各个引脚的两侧 引线，由此形成TEM波传输线。 因此，高频信号可以传输到半导体光学器件。
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公开(公告)号：US06880985B2
公开(公告)日：2005-04-19
申请号：US10459702
申请日：2003-06-12
IPC分类号： G02B6/42 , H01L31/0232 , H01L33/58 , G02B6/36
CPC分类号： G02B6/4204 , G02B6/4292
摘要： In optical module 10, light emitted from laser diode (hereinafter referred to as “LD”) 42 is collimated into parallel light beam by ball lens 44 and then travels through ball lens 26 to be focused on core 104 of optical fiber 100. Since the light passing between ball lenses 44 and 26 is the parallel light beam as described above, allowance is enlarged for axial misalignment between the optical axes of ball lens 44 and ball lens 26. This enables the light from LD 42 to be focused on core 102 of optical fiber 100 even if there occurs axial misalignment between the optical axes of optical fiber 100 and LD 42 due to a factor resulting from fitting of ferrule 102 into sleeve 14 or the like. Accordingly, there is no need for alignment in a work of mounting optoelectronic device 28, i.e., LD 42 in housing 12.
摘要翻译： 在光学模块10中，由激光二极管（以下称为“LD”）42发射的光被球透镜44准直成平行光束，然后穿过球透镜26聚焦在光纤100的核心104上。由于 在球透镜44和26之间通过的光是如上所述的平行光束，球面透镜44和球透镜26的光轴之间的轴向偏移的容限被扩大了。这使得来自LD 42的光能够聚焦在 即使光纤100和LD42的光轴之间出现轴向未对准，由于将套圈102装配到套筒14等中的因素，光纤100也是如此。 因此，在安装光电子器件28（即，壳体12中的LD 42）的工作中不需要对准。
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公开(公告)号：US5109358A
公开(公告)日：1992-04-28
申请号：US423203
申请日：1989-10-17
申请人： Yoshihiko Mizushima , Kazutoshi Nakajima , Toru Hirohata , Takashi Iida , Yoshihisa Warashina , Kenichi Sugimoto , Hirofumi Kan
发明人： Yoshihiko Mizushima , Kazutoshi Nakajima , Toru Hirohata , Takashi Iida , Yoshihisa Warashina , Kenichi Sugimoto , Hirofumi Kan
CPC分类号： G11C11/42
摘要： An optical flip-flop circuit which includes an electrical power source for providing an electrical signal, a light-receiving element provided in series with the power source for switching the electrical signal in response to an optical signal, a light-emitting element for emitting the optical signal in response to the electric signal, an electrical signal path between the light-receiving element and the light-emitting element, whereby the electrical signal passes from the power source to the light-emitting element in response to the optical signal received by the light-receiving element, a light path for directing the optical signal from the light-emitting element to the light-receiving element, wherein the light path and the electrical signal path form a signal loop through which a signal circulates, said circulating signal comprising the electrical signal through the electrical signal path portion of the signal loop and the optical signal through the light path portion of the signal loop, and input/output means for providing an input optical signal to the light-receiving element and for emitting a portion of the optical signal directed by the light path.
摘要翻译： 一种光学触发器电路，其包括用于提供电信号的电源，与电源串联设置的光接收元件，用于响应光信号切换电信号;发光元件，用于发射 响应于电信号的光信号，光接收元件和发光元件之间的电信号路径，由此电信号响应于由光接收元件和发光元件接收的光信号而从电源传递到发光元件 光接收元件，用于将光信号从发光元件引导到光接收元件的光路，其中光路和电信号路径形成信号循环通过的信号回路，所述循环信号包括 通过信号环路的电信号路径部分的电信号和通过信号的光路部分的光信号 环路和输入/输出装置，用于向光接收元件提供输入光信号，并用于发射由光路引导的光信号的一部分。
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公开(公告)号：US09253418B2
公开(公告)日：2016-02-02
申请号：US14005882
申请日：2012-03-09
申请人： Yoshihisa Warashina , Jun Suzuki
发明人： Yoshihisa Warashina , Jun Suzuki
IPC分类号： G01J5/00 , G01J5/10 , H04N5/33 , G01J1/44 , G01J5/22 , H04N5/217 , G01J5/24 , G01J5/06 , G01J5/20 , H04N5/357
CPC分类号： H04N5/33 , G01J1/44 , G01J5/00 , G01J5/10 , G01J5/22 , G01J5/24 , G01J2001/444 , G01J2005/0048 , G01J2005/0077 , G01J2005/066 , G01J2005/202 , H04N5/217 , H04N5/357
摘要： Provided is an infrared image sensor for detecting infrared rays. The infrared image sensor includes a light-receiving unit including a pixel region in which a plurality of pixels are arranged and at least one reference pixel; a difference circuit for acquiring a first differential signal that is a differential signal between a signal of one pixel contained in the pixel region and a signal of the reference pixel and a second differential signal that is a differential signal between signals of two predetermined pixels out of the pixels contained in the pixel region; and a pixel signal calculating unit that calculates a signal of each of the pixels on the basis of the first differential signal and the second differential signal.
摘要翻译： 提供了一种用于检测红外线的红外图像传感器。 红外图像传感器包括：光接收单元，包括其中布置多个像素的像素区域和至少一个参考像素; 差分电路，用于获取作为像素区域中包含的一个像素的信号与参考像素的信号之间的差分信号的第一差分信号和作为两个预定像素的信号之间的差分信号的第二差分信号 包含在像素区域中的像素; 以及像素信号计算单元，其基于第一差分信号和第二差分信号来计算每个像素的信号。
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公开(公告)号：US20120132460A1
公开(公告)日：2012-05-31
申请号：US13378110
申请日：2010-06-03
申请人： Yoshihisa Warashina
发明人： Yoshihisa Warashina
IPC分类号： H05K1/03
CPC分类号： H01L23/147 , H01L23/13 , H01L23/49822 , H01L23/49827 , H01L23/49872 , H01L27/14636 , H01L2224/16225 , H01L2924/157 , H01L2924/3011
摘要： In a multilayer wiring board 1, a low resistance silicon substrate 2 having a predetermined resistivity and a high resistance silicon substrate 4 having a resistivity higher than the predetermined resistivity are stacked while interposing an insulating layer 3 therebetween. The low resistance silicon substrate 2 is provided with an electric passage part 6 surrounded by a ring-shaped groove 5, while a wiring film 13 electrically connected to the electric passage part 6 through an opening 8 of the insulating layer 3 is disposed on a rear face 4b of the high resistance silicon substrate 4 and an inner face 11a of a recess 11. Since the high resistance silicon substrate 4 is thus provided with the wiring film 13, an optical semiconductor element 20 and an electronic circuit element 30 which differ from each other in terms of the number and positions of electrode pads can be electrically connected to each other on the front and rear face sides of the multilayer wiring board 1.
摘要翻译： 在多层布线基板1中，层叠具有预定电阻率的低电阻硅基板2和电阻率高于预定电阻率的高电阻硅基板4，同时在其间插入绝缘层3。 低电阻硅基板2设置有被环状槽5包围的电通路部分6，而通过绝缘层3的开口8电连接到电通路部分6的布线膜13设置在后部 高电阻硅衬底4的表面4b和凹部11的内表面11a。由于高电阻硅衬底4因此设置有布线膜13，光学半导体元件20和电子电路元件30与每个 电极焊盘的数量和位置方面的其他方面可以在多层布线基板1的正面和背面侧彼此电连接。
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公开(公告)号：US07486846B2
公开(公告)日：2009-02-03
申请号：US10589605
申请日：2005-02-15
IPC分类号： G02B6/26
CPC分类号： G02B6/4246
摘要： An optical transmitting and receiving module, with which there is no need to provide a submount for disposing a photodiode on a substrate and with which spatial restrictions can be made small, is provided. An optical transmitting and receiving module 1 has a light transmitting substrate 10. A filter groove 13 is formed on a top surface of light transmitting substrate 10, and a dielectric multilayer film filter 23 is set in filter groove 13. An optical fiber 21 and a laser diode 25 are disposed at opposite positions across dielectric multilayer film filter 23. Also, a photodiode 26 is disposed on a rear surface side of light transmitting substrate 10. Photodiode 26 is positioned directly below a line connecting optical fiber 21 and laser diode 25.
摘要翻译： 一种光发送和接收模块，其不需要提供用于在基板上设置光电二极管的基座，并且可以使空间限制较小。 光收发模块1具有透光基板10.在透光基板10的顶面形成有过滤槽13，在滤波槽13内设置电介质多层膜滤波器23.光纤21和 激光二极管25设置在跨越电介质多层膜滤光器23的相对位置。另外，在透光基板10的背面侧设置光电二极管26.光电二极管26位于连接光纤21和激光二极管25的直线下方。
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公开(公告)号：US20070286549A1
公开(公告)日：2007-12-13
申请号：US10589605
申请日：2005-02-15
CPC分类号： G02B6/4246
摘要： An optical transmitting and receiving module, with which there is no need to provide a submount for disposing a photodiode on a substrate and with which spatial restrictions can be made small, is provided. An optical transmitting and receiving module 1 has a light transmitting substrate 10. A filter groove 13 is formed on a top surface of light transmitting substrate 10, and a dielectric multilayer film filter 23 is set in filter groove 13. An optical fiber 21 and a laser diode 25 are disposed at opposite positions across dielectric multilayer film filter 23. Also, a photodiode 26 is disposed on a rear surface side of light transmitting substrate 10. Photodiode 26 is positioned directly below a line connecting optical fiber 21 and laser diode 25.
摘要翻译： 一种光发送和接收模块，其不需要提供用于在基板上设置光电二极管的基座，并且可以使空间限制较小。 光收发模块1具有透光基板10.在透光基板10的顶面形成有过滤槽13，在滤波槽13内设置电介质多层膜滤波器23.光纤21和 激光二极管25设置在跨越电介质多层膜滤光器23的相对位置。另外，在透光基板10的背面侧设置光电二极管26.光电二极管26位于连接光纤21和激光二极管25的直线下方。
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20.发明授权公开(公告)号：US07226219B2
公开(公告)日：2007-06-05
申请号：US10984748
申请日：2004-11-10
申请人： Yoshihisa Warashina , Yasuji Hoshino , Kei Tabata , Shogo Iyama
发明人： Yoshihisa Warashina , Yasuji Hoshino , Kei Tabata , Shogo Iyama
CPC分类号： H01L25/167 , H01L31/0203 , H01L2224/48137 , H01L2224/48195 , H01L2924/3011 , H01S5/02212 , H01S5/0427 , H01S5/06226 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： The present invention relates to a high-frequency signal transmitting optical module which can easily realize a high-frequency signal transmission by use of a semiconductor optical device to which a highly versatile metal can package has been applied. In the high-frequency signal transmitting optical module, after fixing, to a rear surface of a stem of the metal can package, fixing portions of the linear outer leads by laser welding, the end portions of the outer leads are bent. By this, the outer leads can be easily attached to the semiconductor optical device. On both sides of the respective lead pins of the semiconductor optical device, since the outer leads extending along these are attached to the rear surface of the stem, ground regions are continuously provided on both sides of the respective lead pins by the stem and respective outer leads, whereby TEM wave transmission lines are formed. Accordingly, high-frequency signals can be transmitted to the semiconductor optical device.
摘要翻译： 高频信号发送光模块技术领域本发明涉及一种高频信号发送光模块，其可以通过使用已经应用了高通用金属罐封装的半导体光学器件来容易地实现高频信号传输。 在高频信号发送光学模块中，在通过激光焊接固定到金属罐的杆的后表面之后，通过激光焊接固定线状外部引线的一部分，使外部引线的端部弯曲。 由此，能够容易地将外部引线安装在半导体光学元件上。 在半导体光学器件的各个引脚的两侧上，由于沿着这些引线延伸的外引线附着到杆的后表面，接地区域通过杆和相应的外部连续地设置在各个引脚的两侧 引线，由此形成TEM波传输线。 因此，高频信号可以传输到半导体光学器件。
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