公开(公告)号：US07976952B2

公开(公告)日：2011-07-12

申请号：US11358886

申请日：2006-02-21

申请人： Yoshinori Yoshida ,  Kouji Akazawa ,  Tomohiro Kontani ,  Kohei Yano

发明人： Yoshinori Yoshida ,  Kouji Akazawa ,  Tomohiro Kontani ,  Kohei Yano

IPC分类号： B32B27/32 ,  B32B27/36 ,  B32B27/40

CPC分类号： H01L21/6836 ,  B32B27/40 ,  C08G18/6208 ,  C08L33/06 ,  C08L2666/04 ,  C09J7/29 ,  C09J175/04 ,  C09J2201/162 ,  C09J2203/326 ,  C09J2433/006 ,  C09J2475/006 ,  H01L2221/68327 ,  Y10T428/31504 ,  Y10T428/31565 ,  Y10T428/31573

摘要： To provide a pressure-sensitive adhesive sheet used during processing articles such as semiconductor wafers and laminate sheet used for such a pressure-sensitive adhesive sheet, which does not contaminate or break the semiconductor wafers during the processing and can minimize the curl of the articles due to residual stress of the pressure-sensitive adhesive sheet, a multi-layer sheet includes a composite film containing a urethane polymer and a vinyl-based polymer as effective components and a first film made of a material different from that of the composite film, wherein the urethane polymer is formed from a polyolefin diol and a polyisocyanate. A pressure-sensitive adhesive sheet is obtained by providing a pressure-sensitive adhesive layer on at least one side of the multi-layer sheet.

摘要翻译： 为了提供在加工制品例如半导体晶片和用于这种压敏粘合片的层叠片材中使用的压敏粘合片，其在处理期间不会污染或破坏半导体晶片，并且可以使物品的卷曲最小化 对于压敏粘合片的残余应力，多层片材包括含有聚氨酯聚合物和乙烯基类聚合物作为有效成分的复合膜和由与复合膜不同的材料制成的第一膜，其中 聚氨酯聚合物由聚烯烃二醇和多异氰酸酯形成。 通过在多层片材的至少一面上设置压敏粘合剂层来获得压敏粘合片。

公开(公告)号：US07951623B2

公开(公告)日：2011-05-31

申请号：US12202456

申请日：2008-09-02

申请人： Noriaki Harada ,  Ryuuichi Kimura ,  Kouji Akazawa

发明人： Noriaki Harada ,  Ryuuichi Kimura ,  Kouji Akazawa

IPC分类号： H01L21/00

CPC分类号： C08G59/24 ,  C08G59/4215 ,  C09D163/00 ,  H01L33/52 ,  Y10T428/31663

摘要： The present invention relates to a process for producing an optical semiconductor device, the process including: disposing a sheet for optical-semiconductor-element encapsulation including a resin sheet A and a plurality of resin layers B discontinuously embedded in the resin sheet A and a plurality of optical semiconductor elements mounted on a substrate in such a way that each of the plurality of optical semiconductor elements faces either one of the plurality of resin layers B; and followed by embedding each of the plurality of optical semiconductor elements in either one of the plurality of resin layers B. According to the process of the invention, optical semiconductor elements can be embedded at once. As a result, an optical semiconductor device which is excellent in LED element protection and durability can be easily obtained. Consequently, the optical semiconductor device obtained can have a prolonged life.

摘要翻译： 本发明涉及一种光半导体器件的制造方法，该方法包括：将不连续地嵌入树脂片A中的树脂片A和多个树脂层B的光半导体元件封装用片材配置成多个， 以使得所述多个光学半导体元件中的每一个面对所述多个树脂层B中的任一个的方式安装在基板上的光半导体元件; 然后将多个光学半导体元件中的每一个嵌入到多个树脂层B中的任一个中。根据本发明的方法，可以一次嵌入光学半导体元件。 结果，可以容易地获得LED元件保护和耐久性优异的光半导体装置。 因此，获得的光半导体器件可以具有延长的寿命。

公开(公告)号：US07781794B2

公开(公告)日：2010-08-24

申请号：US12409782

申请日：2009-03-24

申请人： Ichiro Suehiro ,  Kouji Akazawa ,  Hideyuki Usui

发明人： Ichiro Suehiro ,  Kouji Akazawa ,  Hideyuki Usui

IPC分类号： H01L33/00

CPC分类号： H01L21/561 ,  H01L24/97 ,  H01L33/44 ,  H01L33/483 ,  H01L33/52 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01L2224/73265 ,  H01L2924/12041 ,  H01L2924/181 ,  Y10T428/24851 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： The present invention provides a resin sheet for encapsulating an optical semiconductor element, the resin sheet containing an encapsulation resin layer, an adhesive resin layer, a metal layer and a protective resin layer, in which the encapsulation resin layer and the metal layer adhered onto the adhesive resin layer are disposed adjacently to each other, the protective resin layer is laminated on the encapsulation resin layer and the metal layer so as to cover both the encapsulation resin layer and the metal layer, and the encapsulation resin layer has a taper shape expanding toward the protective resin layer; and an optical semiconductor device containing an optical semiconductor element encapsulated by using the resin sheet. The optical semiconductor element encapsulation resin sheet of the invention can be suitably used for back lights of liquid crystal screens, traffic signals, large-sized outdoor displays, billboards and the like.

摘要翻译： 本发明提供一种用于封装光学半导体元件的树脂片，含有密封树脂层的树脂片，粘合树脂层，金属层和保护树脂层，其中密封树脂层和金属层粘附到 粘合树脂层彼此相邻地设置，保护树脂层层叠在密封树脂层和金属层上以覆盖密封树脂层和金属层两者，并且密封树脂层具有朝向 保护树脂层; 以及包含通过使用树脂片封装的光半导体元件的光学半导体器件。 本发明的光半导体元件封装树脂片可以适用于液晶屏，交通信号灯，大型室外显示器，广告牌等的背光。

公开(公告)号：US07777356B2

公开(公告)日：2010-08-17

申请号：US12364731

申请日：2009-02-03

申请人： Hiroyuki Katayama ,  Kouji Akazawa

发明人： Hiroyuki Katayama ,  Kouji Akazawa

IPC分类号： H01L23/29

CPC分类号： C08G77/58 ,  C09D183/14

摘要： A modified polyaluminosiloxane obtained by treating a polyaluminosiloxane with a silane coupling agent represented by the formula (I): wherein each of R1, R2 and R3 is independently an alkyl group or an alkoxy group; X is a methacryloxy group, a glycidoxy group, an amino group, a vinyl group or a mercapto group, with proviso that at least two of R1, R2 and R3 are alkoxy groups. The photosemiconductor element encapsulating material of the present invention is suitably used for, for example, photosemiconductor devices mounted with blue or white LED elements (backlights for liquid crystal displays, traffic lights, outdoor big displays, advertisement sign boards, and the like).

摘要翻译： 通过用式（I）表示的硅烷偶联剂处理聚铝硅氧烷获得的改性聚铝硅氧烷：其中R1，R2和R3各自独立地为烷基或烷氧基; X是甲基丙烯酰氧基，缩水甘油氧基，氨基，乙烯基或巯基，条件是R 1，R 2和R 3中的至少两个是烷氧基。 本发明的光半导体元件封装材料适合用于例如安装有蓝色或白色LED元件的光半导体器件（液晶显示器的背光灯，交通灯，户外大显示器，广告牌等）。

公开(公告)号：US06258426B1

公开(公告)日：2001-07-10

申请号：US09350887

申请日：1999-07-12

申请人： Shouji Yamamoto ,  Yoshio Nakagawa ,  Tatsuya Kubozono ,  Kouji Akazawa ,  Kouichi Hashimoto ,  Takahiro Fukuoka

发明人： Shouji Yamamoto ,  Yoshio Nakagawa ,  Tatsuya Kubozono ,  Kouji Akazawa ,  Kouichi Hashimoto ,  Takahiro Fukuoka

IPC分类号： C09J702

CPC分类号： H01L21/6835 ,  C09J7/201 ,  C09J7/22 ,  C09J7/38 ,  C09J2201/122 ,  C09J2203/326 ,  C09J2205/31 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2924/3025 ,  Y10S428/913 ,  Y10T428/14 ,  Y10T428/1405 ,  Y10T428/1414 ,  Y10T428/1438 ,  Y10T428/1467 ,  Y10T428/1476 ,  Y10T428/1486 ,  Y10T428/24479

摘要： An ultraviolet curing pressure-sensitive adhesive sheet prepared by forming an ultraviolet curing pressure-sensitive adhesive layer on at least one surface of a substrate film and adhering a separator to the surface of the ultraviolet curing pressure-sensitive adhesive layer, wherein the separator has an ultraviolet transmittance at a wavelength of 300 to 400 nm of 65% or lower. The separator is obtained by forming a layer containing an ultraviolet absorber on the surface of the substrate film opposite the surface adhering to the pressure-sensitive adhesive layer or incorporating an ultraviolet absorber in the film. The ultraviolet curing pressure-sensitive adhesive sheet is useful as a semiconductor-protective pressure-sensitive adhesive sheet and a semiconductor wafer-fixing sheet, which can be used without causing a curing reaction with the exposure of a slight amount of ultraviolet rays from a surrounding environment at the standby for adhering wafers.

摘要翻译： 一种紫外线固化型粘合片，其通过在基材膜的至少一个表面上形成紫外线固化型粘合剂层并将隔膜粘附到紫外线固化型粘合剂层的表面而制备，其中，隔膜具有 波长300〜400nm的紫外线透过率为65％以下。 通过在与膜片相粘合的表面相反的表面上形成含有紫外线吸收剂的层或者在该膜上并入紫外线吸收剂而形成隔膜。紫外线固化型粘合片可用作 半导体保护压敏粘合片和半导体晶片固定片，其可以在待机时暴露来自周围环境的少量紫外线而不引起固化反应而使用，用于粘合晶片。

公开(公告)号：US08021756B2

公开(公告)日：2011-09-20

申请号：US12547136

申请日：2009-08-25

申请人： Ichiro Suehiro ,  Hiroyuki Katayama ,  Kouji Akazawa ,  Hideyuki Usui

发明人： Ichiro Suehiro ,  Hiroyuki Katayama ,  Kouji Akazawa ,  Hideyuki Usui

IPC分类号： B32B9/04

CPC分类号： B29D11/00365 ,  G02B1/041 ,  G02B3/0031 ,  Y10T428/31663 ,  C08L83/14

摘要： The present invention provides a microlens array produced by molding a resin obtained by reacting a silicon compound with a boron compound or an aluminum compound, in which the silicon compound is represented by the following formula (I): in which R1 and R2 each independently represent an alkyl group, a cycloalkyl group, an alkenyl group, an alkynyl group, or an aryl group, in which a plurality of R1's are the same or different and a plurality of R2's are the same or different; X represents a hydroxy group, an alkoxy group, an alkyl group, a cycloalkyl group, an alkenyl group, an alkynyl group, or an aryl group; and n is 4 to 250. This microlens array has excellent heat resistance and light resistance even when applied to LEDs having an increased power and to LEDs emitting blue light having a short wavelength.

摘要翻译： 本发明提供一种微透镜阵列，其通过将硅化合物与硼化合物或铝化合物反应而获得的树脂模塑而成，其中硅化合物由下式（I）表示：其中R1和R2各自独立地表示 烷基，环烷基，烯基，炔基或芳基，其中多个R 1相同或不同，多个R 2相同或不同; X表示羟基，烷氧基，烷基，环烷基，烯基，炔基或芳基; n为4〜250。这种微透镜阵列即使应用于具有增加的功率的LED以及发射具有短波长的蓝光的LED也具有优异的耐热性和耐光性。

公开(公告)号：US20090227757A1

公开(公告)日：2009-09-10

申请号：US12364731

申请日：2009-02-03

申请人： Hiroyuki KATAYAMA ,  Kouji Akazawa

发明人： Hiroyuki KATAYAMA ,  Kouji Akazawa

IPC分类号： C08G77/22

CPC分类号： C08G77/58 ,  C09D183/14

摘要： A modified polyaluminosiloxane obtained by treating a polyaluminosiloxane with a silane coupling agent represented by the formula (I): wherein each of R1, R2 and R3 is independently an alkyl group or an alkoxy group; X is a methacryloxy group, a glycidoxy group, an amino group, a vinyl group or a mercapto group, with proviso that at least two of R1, R2 and R3 are alkoxy groups. The photosemiconductor element encapsulating material of the present invention is suitably used for, for example, photosemiconductor devices mounted with blue or white LED elements (backlights for liquid crystal displays, traffic lights, outdoor big displays, advertisement sign boards, and the like).

摘要翻译： 通过用式（I）表示的硅烷偶联剂处理聚铝硅氧烷获得的改性聚铝硅氧烷：其中R1，R2和R3各自独立地为烷基或烷氧基; X是甲基丙烯酰氧基，缩水甘油氧基，氨基，乙烯基或巯基，条件是R 1，R 2和R 3中的至少两个是烷氧基。 本发明的光半导体元件封装材料适合用于例如安装有蓝色或白色LED元件的光半导体器件（液晶显示器的背光灯，交通灯，户外大显示器，广告牌等）。