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    Process for producing optical semiconductor device
    2.
    发明授权
    Process for producing optical semiconductor device 有权
    光半导体装置的制造方法

    公开(公告)号：US07951623B2

    公开(公告)日：2011-05-31

    申请号：US12202456

    申请日：2008-09-02

    申请人： Noriaki Harada ,  Ryuuichi Kimura ,  Kouji Akazawa

    发明人： Noriaki Harada ,  Ryuuichi Kimura ,  Kouji Akazawa

    IPC分类号： H01L21/00

    CPC分类号： C08G59/24 ,  C08G59/4215 ,  C09D163/00 ,  H01L33/52 ,  Y10T428/31663

    摘要： The present invention relates to a process for producing an optical semiconductor device, the process including: disposing a sheet for optical-semiconductor-element encapsulation including a resin sheet A and a plurality of resin layers B discontinuously embedded in the resin sheet A and a plurality of optical semiconductor elements mounted on a substrate in such a way that each of the plurality of optical semiconductor elements faces either one of the plurality of resin layers B; and followed by embedding each of the plurality of optical semiconductor elements in either one of the plurality of resin layers B. According to the process of the invention, optical semiconductor elements can be embedded at once. As a result, an optical semiconductor device which is excellent in LED element protection and durability can be easily obtained. Consequently, the optical semiconductor device obtained can have a prolonged life.

    摘要翻译： 本发明涉及一种光半导体器件的制造方法，该方法包括：将不连续地嵌入树脂片A中的树脂片A和多个树脂层B的光半导体元件封装用片材配置成多个， 以使得所述多个光学半导体元件中的每一个面对所述多个树脂层B中的任一个的方式安装在基板上的光半导体元件; 然后将多个光学半导体元件中的每一个嵌入到多个树脂层B中的任一个中。根据本发明的方法，可以一次嵌入光学半导体元件。 结果，可以容易地获得LED元件保护和耐久性优异的光半导体装置。 因此，获得的光半导体器件可以具有延长的寿命。

    Resin sheet for encapsulating optical semiconductor element and optical semiconductor device
    4.
    发明授权
    Resin sheet for encapsulating optical semiconductor element and optical semiconductor device 有权
    用于封装光学半导体元件和光学半导体器件的树脂片

    公开(公告)号：US07781794B2

    公开(公告)日：2010-08-24

    申请号：US12409782

    申请日：2009-03-24

    申请人： Ichiro Suehiro ,  Kouji Akazawa ,  Hideyuki Usui

    发明人： Ichiro Suehiro ,  Kouji Akazawa ,  Hideyuki Usui

    IPC分类号： H01L33/00

    CPC分类号： H01L21/561 ,  H01L24/97 ,  H01L33/44 ,  H01L33/483 ,  H01L33/52 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01L2224/73265 ,  H01L2924/12041 ,  H01L2924/181 ,  Y10T428/24851 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

    摘要： The present invention provides a resin sheet for encapsulating an optical semiconductor element, the resin sheet containing an encapsulation resin layer, an adhesive resin layer, a metal layer and a protective resin layer, in which the encapsulation resin layer and the metal layer adhered onto the adhesive resin layer are disposed adjacently to each other, the protective resin layer is laminated on the encapsulation resin layer and the metal layer so as to cover both the encapsulation resin layer and the metal layer, and the encapsulation resin layer has a taper shape expanding toward the protective resin layer; and an optical semiconductor device containing an optical semiconductor element encapsulated by using the resin sheet. The optical semiconductor element encapsulation resin sheet of the invention can be suitably used for back lights of liquid crystal screens, traffic signals, large-sized outdoor displays, billboards and the like.

    摘要翻译： 本发明提供一种用于封装光学半导体元件的树脂片，含有密封树脂层的树脂片，粘合树脂层，金属层和保护树脂层，其中密封树脂层和金属层粘附到 粘合树脂层彼此相邻地设置，保护树脂层层叠在密封树脂层和金属层上以覆盖密封树脂层和金属层两者，并且密封树脂层具有朝向 保护树脂层; 以及包含通过使用树脂片封装的光半导体元件的光学半导体器件。 本发明的光半导体元件封装树脂片可以适用于液晶屏，交通信号灯，大型室外显示器，广告牌等的背光。

    Pressure-sensitive adhesive sheet and method of processing articles
    5.
    发明申请
    Pressure-sensitive adhesive sheet and method of processing articles 审中-公开
    压敏粘合片和加工制品的方法

    公开(公告)号：US20070059903A1

    公开(公告)日：2007-03-15

    申请号：US11514504

    申请日：2006-09-01

    申请人： Kohei Yano ,  Kouji Akazawa ,  Yoshinori Yoshida ,  Tomohiro Kontani

    发明人： Kohei Yano ,  Kouji Akazawa ,  Yoshinori Yoshida ,  Tomohiro Kontani

    IPC分类号： H01L21/30

    CPC分类号： H01L21/6835 ,  B24B37/30 ,  C09J2203/326 ,  C09J2205/31 ,  C09J2433/003 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/6834

    摘要： To provide a pressure-sensitive adhesive that is used in processing an article such as a semiconductor wafer, the pressure-sensitive adhesive sheet is one that has a base, an intermediate layer and a pressure-sensitive adhesive layer in order, wherein the intermediate layer has an elastic modulus at elongation at 23° C. of 1 MPa or more and 100 MPa or less, the intermediate layer includes an acrylic polymer obtained by polymerization of a (meth) acrylic monomer mixture containing 1% by weight or more and 20% by weight or less of a nitrogen-containing acrylic monomer, the acrylic polymer containing 20% by weight or less of a polymer component having a molecular weight of 100,000 or less, and the base includes at least one film having an elastic modulus at in tension at 23° C. of 0.6 GPa or more.

    摘要翻译： 为了提供用于加工诸如半导体晶片的物品的压敏粘合剂，压敏粘合片是依次具有基底，中间层和压敏粘合剂层的粘合片，其中中间层 在23℃的伸长率下的弹性模量为1MPa以上至100MPa以下，中间层包含通过聚合含有1重量％以上且20重量％以上的（甲基）丙烯酸单体混合物而得到的丙烯酸类聚合物， 以下的含氮丙烯酸类单体，所述丙烯酸类聚合物含有20重量％以下的分子量为100,000以下的聚合物成分，所述基材包括至少一层在拉伸下具有弹性模量的膜 在23℃下为0.6GPa以上。

    Modified polyaluminosiloxane
    6.
    发明授权
    Modified polyaluminosiloxane 有权
    改性聚铝硅氧烷

    公开(公告)号：US07777356B2

    公开(公告)日：2010-08-17

    申请号：US12364731

    申请日：2009-02-03

    申请人： Hiroyuki Katayama ,  Kouji Akazawa

    发明人： Hiroyuki Katayama ,  Kouji Akazawa

    IPC分类号： H01L23/29

    CPC分类号： C08G77/58 ,  C09D183/14

    摘要： A modified polyaluminosiloxane obtained by treating a polyaluminosiloxane with a silane coupling agent represented by the formula (I): wherein each of R1, R2 and R3 is independently an alkyl group or an alkoxy group; X is a methacryloxy group, a glycidoxy group, an amino group, a vinyl group or a mercapto group, with proviso that at least two of R1, R2 and R3 are alkoxy groups. The photosemiconductor element encapsulating material of the present invention is suitably used for, for example, photosemiconductor devices mounted with blue or white LED elements (backlights for liquid crystal displays, traffic lights, outdoor big displays, advertisement sign boards, and the like).

    摘要翻译： 通过用式（I）表示的硅烷偶联剂处理聚铝硅氧烷获得的改性聚铝硅氧烷：其中R1，R2和R3各自独立地为烷基或烷氧基; X是甲基丙烯酰氧基，缩水甘油氧基，氨基，乙烯基或巯基，条件是R 1，R 2和R 3中的至少两个是烷氧基。 本发明的光半导体元件封装材料适合用于例如安装有蓝色或白色LED元件的光半导体器件（液晶显示器的背光灯，交通灯，户外大显示器，广告牌等）。

    Pressure-sensitive adhesive sheet and method of processing articles
    7.
    发明申请
    Pressure-sensitive adhesive sheet and method of processing articles 审中-公开
    压敏粘合片和加工制品的方法

    公开(公告)号：US20070054469A1

    公开(公告)日：2007-03-08

    申请号：US11514454

    申请日：2006-09-01

    申请人： Kohei Yano ,  Kouji Akazawa ,  Yoshinori Yoshida ,  Tomohiro Kontani

    发明人： Kohei Yano ,  Kouji Akazawa ,  Yoshinori Yoshida ,  Tomohiro Kontani

    IPC分类号： H01L21/30

    CPC分类号： C09J7/29 ,  C09J2201/162 ,  C09J2203/326 ,  C09J2433/006

    摘要： To provide a pressure-sensitive adhesive sheet, which is used in processing an article such as a semiconductor wafer, the pressure-sensitive adhesive sheet has a base, an intermediate layer and a pressure-sensitive adhesive layer in this order, wherein the intermediate layer has an elastic modulus in tension at 23° C. of 10 MPa or more and 100 Mpa or less, the intermediate layer includes an acrylic-based polymer obtained by polymerization of a mixture containing 70 to 99 parts by weight of a (meth)acrylate monomer and 1 to 30 parts by weight of an unsaturated carboxylic acid based on 100 parts by weight of total monomers, and the base includes at least one film having an elastic modulus in tension at 23° C. of 0.6 GPa or more.

    摘要翻译： 为了提供用于加工诸如半导体晶片的物品的压敏粘合片，该压敏粘合片依次具有基底，中间层和压敏粘合剂层，其中中间层 在23℃下的拉伸弹性模量为10MPa以上至100Mpa以下，中间层包含通过聚合含有70〜99重量份的（甲基）丙烯酸酯的混合物而得到的丙烯酸系聚合物 单体和1〜30重量份的不饱和羧酸，基于100重量份的总单体，并且所述基材包括至少一种在23℃下的拉伸弹性模量为0.6GPa以上的膜。