Re-release adhesive and re-release adhesive sheet
    2.
    发明授权
    Re-release adhesive and re-release adhesive sheet 有权
    重新释放粘合剂并重新释放粘合片

    公开(公告)号:US07641966B2

    公开(公告)日:2010-01-05

    申请号:US10013543

    申请日:2001-12-13

    IPC分类号: B32B7/12 C08G18/00

    摘要: A curable re-release adhesive which, when subjected to a curing reaction caused by irradiation with radiation, shows a sufficient drop of adhesion and causes the adherend to be warped to a minimized extent as developed by the shrinkage force caused by the curing reaction. The re-release adhesive contains a radiation-reactive polymer including a main chain and a plurality of intramolecular side chains, each such side chain having a terminal carbon-carbon double bond, a chain length of 6 or more in terms of number of atoms, and the same or a different number of atoms as each other side chain in the polymer. The release adhesive shows a shrinkage force of 30 MPa or less as developed by a curing reaction upon irradiation. A re-release adhesive sheet is also disclosed, including a substrate film and an adhesive layer containing the re-release adhesive, provided on one surface thereof.

    摘要翻译: 一种可固化的再剥离粘合剂,当经受由辐射照射引起的固化反应时,表现出足够的粘附力降低,并且使被粘物由于由固化反应引起的收缩力而变形到最小程度。 再释放粘合剂含有包含主链和多个分子内侧链的辐射反应性聚合物,每个这样的侧链具有末端碳 - 碳双键,以原子数计为6个或更多个链长度, 并且与聚合物中每个其它侧链相同或不同数目的原子。 剥离粘合剂显示出通过照射时的固化反应产生的收缩力为30MPa以下。 还公开了一种再剥离粘合片,包括在其一个表面上设置有基底膜和含有再释放粘合剂的粘合剂层。

    COMPOSITION FOR NUCLEIC-ACID TRANSFECTION
    4.
    发明申请
    COMPOSITION FOR NUCLEIC-ACID TRANSFECTION 有权
    用于核酸转运的组合物

    公开(公告)号:US20090239222A1

    公开(公告)日:2009-09-24

    申请号:US12306620

    申请日:2007-06-29

    IPC分类号: C12Q1/68 C07C233/00

    CPC分类号: C12N15/88 A61K9/1272

    摘要: To provide a nucleic-acid-transfecting composition which exhibits low cytotoxicity, which facilitates a nucleic acid transfection into cells, and which improves expression of the nucleic acid in the cells.The invention provides a composition for transfecting a nucleic acid into a cell, including a compound represented by the following formula (I) (wherein each of R1 and R2, which are identical to or different from each other, represents a saturated or unsaturated hydrocarbon group; R3 represents a C1-6 alkyl group or a C1-6 hydroxyalkyl group; m is an integer from 1 to 10; and X represents a halogen atom), and a phospholipid.

    摘要翻译: 提供显示低细胞毒性的核酸转染组合物,其有助于核酸转染入细胞,并且其改善核酸在细胞中的表达。 本发明提供一种用于将核酸转染入细胞的组合物,包括由下式(I)表示的化合物(其中R 1和R 2各自彼此相同或不同,表示饱和或不饱和的烃基 R 3表示C 1-6烷基或C 1-6羟基烷基; m表示1〜10的整数,X表示卤素原子)和磷脂。

    Adhesive sheet roll for wafer processing
    5.
    发明授权
    Adhesive sheet roll for wafer processing 有权
    用于晶片加工的粘合片卷

    公开(公告)号:US07479317B2

    公开(公告)日:2009-01-20

    申请号:US11054826

    申请日:2005-02-10

    IPC分类号: B32B9/00 B32B33/00 D06N7/04

    摘要: An adhesive film in roll for wafer processing is constituted by laminated multiple layers including a base film, a radiation curing type adhesive layer, and a releasing film in this sequence, in which the arithmetic average roughness (Ra) of the side of the base film and/or releasing film opposite to the radiation curing type adhesive layer is 1 μm or more, and the weight of the radical polymerization initiator contained in the radiation curing type adhesive layer is less than 1000 ppm.

    摘要翻译: 用于晶片处理的辊用粘合膜由具有基膜,辐射固化型粘合剂层和脱模膜的层叠多层构成,其中基膜的侧面的算术平均粗糙度(Ra) 和/或与放射线固化型粘合剂层相反的释放膜为1μm以上,辐射固化型粘合剂层中所含的自由基聚合引发剂的重量小于1000ppm。

    Coin jamming detecting device in coin sorting machine
    6.
    发明授权
    Coin jamming detecting device in coin sorting machine 失效
    硬币分选机中的硬币干扰检测装置

    公开(公告)号:US4167949A

    公开(公告)日:1979-09-18

    申请号:US824301

    申请日:1977-08-12

    IPC分类号: G07D3/16 G07F3/04

    CPC分类号: G07D3/16

    摘要: A plurality of coin detecting switches are provided in the coin passages in a coin sorting machine so that jammed coins are located according to the following principle; when one coin detecting switch detects coins, and the succeeding coin detecting switch detects no coins, it is determined that coins are jammed therebetween.

    摘要翻译: 在硬币分拣机的硬币通道中设置有多个硬币检测开关,以便根据以下原理定位卡住的硬币; 当一个硬币检测开关检测到硬币,并且随后的硬币检测开关检测不到硬币时,确定硬币被卡住。

    Adhesive sheet roll for wafer processing
    8.
    发明申请
    Adhesive sheet roll for wafer processing 有权
    用于晶片加工的粘合片卷

    公开(公告)号:US20050191456A1

    公开(公告)日:2005-09-01

    申请号:US11054826

    申请日:2005-02-10

    摘要: To present an adhesive sheet roll for wafer processing excellent in storage stability, radiation curing property, and low contamination to wafer. To present an adhesive sheet for wafer processing prepared by cutting the adhesive sheet roll for wafer processing, and an adhesive sheet with semiconductor wafer. To present a manufacturing method of semiconductor device using adhesive sheet for wafer processing or adhesive sheet with semiconductor wafer, and a semiconductor device obtained in this manufacturing method. An adhesive film for roll wafer processing which laminating multiple layers of laminated film stacking up base film, radiation curing type adhesive layer, and releasing film in this sequence, in which the arithmetic average roughness (Ra) of the other surface of the side of the base film and/or releasing film contacting with the radiation curing type adhesive layer is 1 μm or more, and the weight of the radical polymerization initiator contained in the radiation curing type adhesive layer is less than 1000 ppm.

    摘要翻译: 提供用于晶片处理的粘合片卷,其具有优异的储存稳定性,辐射固化性能和对晶片的低污染。 呈现通过切割用于晶片加工的粘合片卷制备的用于晶片加工的粘合片,以及具有半导体晶片的粘合片。 介绍使用晶片加工用粘合片或半导体晶片的半导体器件的制造方法以及在该制造方法中获得的半导体器件。 一种用于辊晶片处理的粘合膜,其中以层叠多层叠层膜叠层基膜,辐射固化型粘合剂层和脱模膜,其中该层的另一面的算术平均粗糙度(Ra) 与辐射固化型粘合剂层接触的基膜和/或脱模膜为1μm以上,辐射固化型粘合剂层中所含的自由基聚合引发剂的重量小于1000ppm。

    Image forming apparatus with changeable toner returning electric field application period
    9.
    发明授权
    Image forming apparatus with changeable toner returning electric field application period 失效
    具有可变色调剂返回电场应用期的图像形成装置

    公开(公告)号:US06591072B2

    公开(公告)日:2003-07-08

    申请号:US09984692

    申请日:2001-10-31

    IPC分类号: G03G1500

    CPC分类号: G03G15/0241 G03G2215/022

    摘要: An image forming apparatus includes an image bearing member; a charger for electrically charging the image bearing member; an electrostatic image forming device for forming an electrostatic image by selectively discharging a surface of the charged image bearing member; a developer for developing the electrostatic image formed on the image bearing member into a toner image; a transfer device for transferring the toner image from the image bearing member onto a transfer material; wherein the charger is capable of collecting residual toner from the image bearing member after an image transfer operation; an electric field forming device forms an electric field between the charger and the image bearing member to transfer the toner in the charger to the image bearing member; and a controller controls a length of time during which the electric field forming device forms the electric field, wherein the controller controls the length of time substantially in accordance with wear of a surface of the image bearing member.

    摘要翻译: 图像形成装置包括:图像承载部件; 用于对图像承载部件进行充电的充电器; 静电图像形成装置,用于通过选择性地排出带电图像承载部件的表面来形成静电图像; 用于将形成在图像承载部件上的静电图像显影成调色剂图像的显影剂; 用于将调色剂图像从图像承载部件转印到转印材料上的转印装置; 其中所述充电器能够在图像转印操作之后从所述图像承载部件收集残余调色剂; 电场形成装置在充电器和图像承载部件之间形成电场,以将充电器中的调色剂转印到图像承载部件; 并且控制器控制电场形成装置形成电场的时间长度,其中控制器基本上根据图像承载部件的表面的磨损控制时间长度。

    Process for the collective removal of resist material and side wall protective film
    10.
    发明授权
    Process for the collective removal of resist material and side wall protective film 失效
    用于集体除去抗蚀剂材料和侧壁保护膜的方法

    公开(公告)号:US06436220B1

    公开(公告)日:2002-08-20

    申请号:US09367099

    申请日:1999-08-10

    IPC分类号: B32B3120

    摘要: The present invention is intended to collectively remove unnecessary resist material and side wall protective film after dry etching by side wall protection process, making it possible to simplify the process for the preparation of semiconductors, etc. The process according to the present invention comprises removing unnecessary resist material (3) left behind after dry etching by side wall protection process with a resist pattern (3) present on a semiconductor substrate (2) as a mask and side wall protective film (4) deposited on the side wall (22) of pattern, said process comprising the steps of applying an pressure-sensitive adhesive sheet (1) to said substrate (2), heating the pressure-sensitive adhesive layer (1) under pressure so that the pressure-sensitive adhesive (11) comes in contact with up to the side wall (4) of pattern, and then collectively peeling said pressure-sensitive adhesive sheet (1), said resist material (3) and said side wall protective film (4) off said substrate.

    摘要翻译: 本发明旨在通过侧壁保护工艺在干蚀刻之后集中地去除不需要的抗蚀剂材料和侧壁保护膜,从而可以简化制备半导体等的工艺。根据本发明的方法包括去除不必要的 在作为掩模的半导体基板(2)上存在的抗蚀剂图案(3)通过侧壁保护处理在干蚀刻后留下的抗蚀剂材料(3)和沉积在侧壁(22)上的侧壁保护膜(4) 所述方法包括以下步骤:将压敏粘合片(1)施加到所述基底(2)上,在压力下加压压敏粘合剂层(1),使得压敏粘合剂(11)接触 直到图案的侧壁(4),然后将所述压敏粘合片(1),所述抗蚀剂材料(3)和所述侧壁保护膜(4)从所述基体上共同剥离 te。