公开(公告)号：US08299848B2

公开(公告)日：2012-10-30

申请号：US12694008

申请日：2010-01-26

申请人： Isao Sugaya ,  Kazuya Okamoto

发明人： Isao Sugaya ,  Kazuya Okamoto

IPC分类号： H01L25/00

CPC分类号： H01L23/34 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/36 ,  H01L23/473 ,  H01L25/0657 ,  H01L2224/0554 ,  H01L2224/05573 ,  H01L2224/05611 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2225/06541 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： Provided is a multi-layered semiconductor apparatus with improved heat diffusion and improved heat release. The multi-layered semiconductor apparatus (100) includes a plurality of layered semiconductor chips (20-1, 20-2) that each include at least one circuit region, and the circuit regions are arranged such that heat generated by the circuit regions as a result of the circuit regions being driven is spread out. The multi-layered semiconductor apparatus (100) further comprises a heat releasing section (50) that releases the heat generated by the circuit regions, and the circuit regions are arranged such that there is less thermal resistance between the heat releasing section and circuit regions that generate a greater amount of heat per unit area.

摘要翻译： 提供了一种具有改进的热扩散和改进的放热的多层半导体装置。 多层半导体装置（100）包括多个分层半导体芯片（20-1,20-2），每个半导体芯片包括至少一个电路区域，并且电路区域被布置成使得由电路区域产生的热量作为 驱动电路区域的结果展开。 所述多层半导体装置（100）还包括释放由所述电路区域产生的热的放热部（50），所述电路区域配置成使得所述散热部与所述电路区之间的热阻较小， 每单位面积产生更大的热量。

公开(公告)号：US20100201432A1

公开(公告)日：2010-08-12

申请号：US12694008

申请日：2010-01-26

申请人： Isao Sugaya ,  Kazuya Okamoto

发明人： Isao Sugaya ,  Kazuya Okamoto

IPC分类号： G05F1/10 ,  H01L23/34

CPC分类号： H01L23/34 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/36 ,  H01L23/473 ,  H01L25/0657 ,  H01L2224/0554 ,  H01L2224/05573 ,  H01L2224/05611 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2225/06541 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： Provided is a multi-layered semiconductor apparatus with improved heat diffusion and improved heat release. The multi-layered semiconductor apparatus (100) includes a plurality of layered semiconductor chips (20-1, 20-2) that each include at least one circuit region, and the circuit regions are arranged such that heat generated by the circuit regions as a result of the circuit regions being driven is spread out. The multi-layered semiconductor apparatus (100) further comprises a heat releasing section (50) that releases the heat generated by the circuit regions, and the circuit regions are arranged such that there is less thermal resistance between the heat releasing section and circuit regions that generate a greater amount of heat per unit area.

摘要翻译： 提供了一种具有改进的热扩散和改进的放热的多层半导体装置。 多层半导体装置（100）包括多个分层半导体芯片（20-1,20-2），每个半导体芯片包括至少一个电路区域，并且电路区域被布置成使得由电路区域产生的热量作为 驱动电路区域的结果展开。 所述多层半导体装置（100）还包括释放由所述电路区域产生的热量的散热部（50），所述电路区域配置成使得所述散热部与所述电路区域之间的热阻较小， 每单位面积产生更大的热量。

公开(公告)号：US08436680B2

公开(公告)日：2013-05-07

申请号：US13528220

申请日：2012-06-20

申请人： Isao Sugaya ,  Kazuya Okamoto

发明人： Isao Sugaya ,  Kazuya Okamoto

IPC分类号： H01L25/00

CPC分类号： H01L23/34 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/36 ,  H01L23/473 ,  H01L25/0657 ,  H01L2224/0554 ,  H01L2224/05573 ,  H01L2224/05611 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2225/06541 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： Provided is a multi-layered semiconductor apparatus with improved heat diffusion and improved heat release. The multi-layered semiconductor apparatus (100) includes a plurality of layered semiconductor chips (20-1, 20-2) that each include at least one circuit region, and the circuit regions are arranged such that heat generated by the circuit regions as a result of the circuit regions being driven is spread out. The multi-layered semiconductor apparatus (100) further comprises a heat releasing section (50) that releases the heat generated by the circuit regions, and the circuit regions are arranged such that there is less thermal resistance between the heat releasing section and circuit regions that generate a greater amount of heat per unit area.

摘要翻译： 提供了一种具有改进的热扩散和改进的放热的多层半导体装置。 多层半导体装置（100）包括多个分层半导体芯片（20-1,20-2），每个半导体芯片包括至少一个电路区域，并且电路区域被布置成使得由电路区域产生的热量作为 驱动电路区域的结果展开。 所述多层半导体装置（100）还包括释放由所述电路区域产生的热的放热部（50），所述电路区域配置成使得所述散热部与所述电路区之间的热阻较小， 每单位面积产生更大的热量。

公开(公告)号：US20120214290A1

公开(公告)日：2012-08-23

申请号：US13355247

申请日：2012-01-20

申请人： Isao Sugaya ,  Junichi Chonan ,  Hidehiro Maeda ,  Keiichi Tanaka ,  Tomoyuki Yasuda

发明人： Isao Sugaya ,  Junichi Chonan ,  Hidehiro Maeda ,  Keiichi Tanaka ,  Tomoyuki Yasuda

IPC分类号： H01L21/02 ,  H01L21/683

CPC分类号： H01L21/67092

摘要： Provided is a substrate holder pair comprising a first substrate holder that has a first holding portion holding a first substrate; a second substrate holder that has a second holding portion holding a second substrate to be bonded with the first substrate and that, together with the first substrate holder, sandwiches the first substrate and the second substrate; an engaging member that causes the first substrate holder to engage with the second substrate holder; and a dust inhibiting section inhibits dust generated by the engaging of the engaging member from entering between the first holding portion and the second holding portion.

摘要翻译： 提供了一种衬底保持器对，其包括具有保持第一衬底的第一保持部分的第一衬底保持器; 第二基板保持器，具有保持与第一基板接合的第二基板的第二保持部，并且与第一基板保持件一起夹着第一基板和第二基板; 接合构件，其使所述第一基板保持件与所述第二基板保持器接合; 并且防尘部防止由接合构件的接合而产生的灰尘进入第一保持部和第二保持部之间。

公开(公告)号：US20050142989A1

公开(公告)日：2005-06-30

申请号：US11002655

申请日：2004-12-03

申请人： Susumu Hoshino ,  Isao Sugaya

发明人： Susumu Hoshino ,  Isao Sugaya

IPC分类号： B24B37/20 ,  B24B37/22 ,  B24B37/26 ,  B24D13/14 ,  H01L21/304 ,  B24B1/00

CPC分类号： B24B37/26

摘要： The polishing body 4 is attached to a substrate 5. The polishing body 4 has a structure in which a polishing pad 6, a hard elastic member 7 and a soft member 8 are laminated in that order from the side of the polishing surface. For example, an IC1000 (commercial name) manufactured by Rodel, Inc. is used as the polishing pad 6. For example, a stainless steel plate is used as the hard elastic member 7. A Suba400 (commercial name) manufactured by Rodel, Inc. is used as the soft member 8. The polishing pad 6 has grooves 6 in the polishing surface side. The residual thickness d of the areas of the grooves 6a in the polishing pad 6 is set so as to satisfy the condition 0 mm

摘要翻译： 抛光体4附着在基板5上。 研磨体4具有抛光垫6，硬弹性构件7和软构件8从研磨面的一侧依次层叠的结构。 例如，使用由Rodel，Inc。制造的IC1000（商业名称）作为抛光垫6。 例如，使用不锈钢板作为硬质弹性体7。 使用由Rodel，Inc。制造的Suba400（商品名）作为软构件8。 研磨垫6在研磨面侧具有槽6。 抛光垫6中的槽6a的区域的残余厚度d被设定为满足0mm

公开(公告)号：US20050000943A1

公开(公告)日：2005-01-06

申请号：US10853172

申请日：2004-05-26

申请人： Isao Sugaya ,  Akinori Ito ,  Isao Komatsu

发明人： Isao Sugaya ,  Akinori Ito ,  Isao Komatsu

IPC分类号： B24B37/04 ,  B24B37/30 ,  H01L21/304 ,  C23F1/00

CPC分类号： B24B37/30

摘要： The processing apparatus in accordance with the present invention comprises an object holding unit for holding a processing object, a tool holding unit for holding a tool for processing the processing object, and a relative movement mechanism for causing relative movement of the processing object held in the object holding unit and the tool held in the tool holding unit, while maintaining contact therebetween. The object holding unit and/or the tool holding unit are composed of a plurality of support plates of almost flat shape having elastic property which are arranged in a row.

摘要翻译： 根据本发明的处理装置包括用于保持处理对象的物体保持单元，用于保持用于处理对象的处理工具的工具保持单元和用于使保持在处理对象中的处理对象的相对移动的相对移动机构 物体保持单元和保持在工具保持单元中的工具，同时保持其间的接触。 物体保持单元和/或工具保持单元由具有弹性特性的大致平坦形状的多个支撑板组成，排列成一列。

公开(公告)号：US08436465B2

公开(公告)日：2013-05-07

申请号：US12529925

申请日：2008-03-03

申请人： Isao Sugaya

发明人： Isao Sugaya

IPC分类号： H01L23/34 ,  H01L21/00

CPC分类号： H01L23/34 ,  H01L21/768 ,  H01L23/4334 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0554 ,  H01L2224/05573 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： At least a part of a heat radiation member (9) connected to a DRAM (11) for radiating heat of the DRAM (11) is exposed from a protection member (4) arranged to surround the DRAM and the heat radiation member (9) so as to protect the DRAM (11). Thus, it is possible to provide a semiconductor device having a preferable heat radiation performance.

公开(公告)号：US08370789B2

公开(公告)日：2013-02-05

申请号：US12879826

申请日：2010-09-10

申请人： Isao Sugaya ,  Takahiro Horikoshi ,  Kazuya Okamoto

发明人： Isao Sugaya ,  Takahiro Horikoshi ,  Kazuya Okamoto

IPC分类号： G06F17/50 ,  B29C65/00 ,  B29C65/78 ,  B32B37/00 ,  B32B41/00 ,  B65C9/00

CPC分类号： G06F17/5081 ,  G06F17/5068 ,  H01L21/67092 ,  H01L24/75 ,  H01L25/50 ,  H01L2224/16 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/7592 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01074 ,  H01L2924/01082

摘要： The terminals that oppose each other when substrates are bonded are designed to be reliably joined. Comprised in a semiconductor device design system are a numerical value acquiring part, which acquires the respective numerical values of a plurality of calculation parameters, a junction estimating part, which, in the case in which a plurality of substrates has been pressed at a prescribed pressure so that the bump front end faces come into contact, estimates whether or not the respective mutually opposing bumps will be joined based on the respective numerical values of the calculation parameters acquired by the numerical value acquiring part, and a change processing part, which, in the case in which it has been estimated by the junction estimating part that any of the bumps will not be joined, gives a warning or performs processing so as to change the numerical value of at least one calculation parameter among the plurality of calculation parameters.

摘要翻译： 当接合基板时彼此相对的端子被设计成可靠地接合。 包含在半导体器件设计系统中的数值获取部分获取多个计算参数的相应数值，结点估计部分，在多个基板已按规定压力被按压的情况下 使得凸起前端面接触，基于由数值获取部获取的计算参数的各个数值，估计相应的相对的凸块是否被接合;以及变化处理部，其在 由结点估计部估计出任何凸块不会接合的情况，给出警告或进行处理，以便改变多个计算参数中的至少一个计算参数的数值。

公开(公告)号：US08183686B2

公开(公告)日：2012-05-22

申请号：US12530093

申请日：2008-03-03

申请人： Isao Sugaya

发明人： Isao Sugaya

IPC分类号： H01L23/34

CPC分类号： H01L23/4334 ,  H01L23/427 ,  H01L25/18 ,  H01L2225/06589 ,  H01L2924/15321

摘要： Between a logic LSI (4) arranged on one side of a DRAM (1) and jointed to the DRAM and a radiating member (6) arranged on the other side of the DRAM (1) for irradiating the heats of the DRAM (1) and the logic LSI (4), there is disposed a heat bypass passage (5), which extends inbetween while bypassing the DRAM (1). Thus, it is possible to provide a semiconductor device, which can irradiate the heat generated from the logic LSI such as CPU or GPU thereby to reduce the temperature rise and the temperature distribution.

摘要翻译： 在布置在DRAM（1）的一侧并连接到DRAM的逻辑LSI（4）和布置在DRAM（1）的另一侧上用于照射DRAM（1）的热量的散热构件（6） 和逻辑LSI（4），设置有一个绕过DRAM（1）的热旁路通道（5）。 因此，可以提供能够照射由诸如CPU或GPU的逻辑LSI产生的热量的半导体器件，从而降低温度升高和温度分布。

公开(公告)号：US20110288674A1

公开(公告)日：2011-11-24

申请号：US13112719

申请日：2011-05-20

申请人： Isao Sugaya ,  Satoru Sanada ,  Hidehiro Maeda ,  Masahiro Yoshihashi ,  Mikio Ushijima

发明人： Isao Sugaya ,  Satoru Sanada ,  Hidehiro Maeda ,  Masahiro Yoshihashi ,  Mikio Ushijima

IPC分类号： G06F17/00 ,  B23Q7/00 ,  B23Q3/00

CPC分类号： H01L21/67092 ,  H01L21/67276 ,  H01L21/67294 ,  Y10T29/49998

摘要： Management of the holding member that holds the semiconductor substrate is efficiently implemented. Provided is a holding member management apparatus that manages a substrate holding member that holds a semiconductor substrate in a manufacturing apparatus that manufactures a stacked semiconductor apparatus by joining a plurality of semiconductor substrates; comprising a history storing part that stores the usage history of the substrate holding member in association with identification information that specifies the substrate holding member and a holding member specifying part that specifies and outputs identification information of the substrate holding member whose usage is to be suspended based on the usage history stored in the history storing part.

摘要翻译： 有效地实施保持半导体基板的保持构件的管理。 提供一种保持构件管理装置，其通过接合多个半导体衬底来管理在制造半导体装置的制造装置中保持半导体衬底的衬底保持构件; 包括历史存储部分，其与用于指定基板保持部件的识别信息相关联地存储基板保持部件的使用历史;以及保持部件指定部，其指定并输出其使用被暂停的基板保持部件的识别信息 关于存储在历史存储部分中的使用历史。