公开(公告)号：US20070066201A1

公开(公告)日：2007-03-22

申请号：US11556011

申请日：2006-11-02

申请人： Liang-Yuh Chen ,  Yuchun Wang ,  Yan Wang ,  Alain Duboust ,  Daniel Carl ,  Ralph Wadensweiler ,  Manoocher Birang ,  Paul Butterfield ,  Rashid Mavliev ,  Stan Tsai

发明人： Liang-Yuh Chen ,  Yuchun Wang ,  Yan Wang ,  Alain Duboust ,  Daniel Carl ,  Ralph Wadensweiler ,  Manoocher Birang ,  Paul Butterfield ,  Rashid Mavliev ,  Stan Tsai

IPC分类号： B23F21/03

CPC分类号： B82Y30/00 ,  B24B37/046 ,  B24B37/24 ,  B24B37/26 ,  B24D3/34

摘要： An article of manufacture and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including polishing article comprising a body having at least a partially conductive surface adapted to polish the substrate. A plurality of perforations may be formed in the polishing article for flow of material therethrough. An electrode is also exposed to the polishing surface by at least a portion of the plurality of perforations. The article of manufacture may also include a polishing surface having a plurality of grooves, wherein a portion of the plurality of grooves intersect with a portion of the plurality of perforations.

摘要翻译： 提供了一种用于平坦化基板表面的制造和设备。 在一个方面，提供了一种用于抛光衬底的制品，所述衬底包括抛光制品，所述抛光制品包括具有适于抛光所述衬底的至少部分导电表面的主体。 可以在抛光制品中形成多个穿孔，以使材料流过其中。 电极还通过多个穿孔的至少一部分暴露于抛光表面。 制品还可以包括具有多个凹槽的抛光表面，其中多个凹槽的一部分与多个穿孔的一部分相交。

公开(公告)号：US06988942B2

公开(公告)日：2006-01-24

申请号：US10894756

申请日：2004-07-20

申请人： Liang-Yuh Chen ,  Yuchun Wang ,  Yan Wang ,  Alain Duboust ,  Daniel A. Carl ,  Ralph Wadensweiler ,  Manoocher Birang ,  Paul D. Butterfield ,  Rashid Mavliev ,  Stan D. Tsai

发明人： Liang-Yuh Chen ,  Yuchun Wang ,  Yan Wang ,  Alain Duboust ,  Daniel A. Carl ,  Ralph Wadensweiler ,  Manoocher Birang ,  Paul D. Butterfield ,  Rashid Mavliev ,  Stan D. Tsai

IPC分类号： B24D11/00

CPC分类号： H01L21/32125 ,  B23H5/08 ,  B24B37/22 ,  B24B37/24 ,  B24B37/26 ,  B24B53/017 ,  B24B57/02 ,  B82Y30/00 ,  Y10T428/24273 ,  Y10T428/24355 ,  Y10T428/24628 ,  Y10T428/24917

摘要： An article of manufacture and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including polishing article comprising a body having at least a partially conductive surface adapted to polish the substrate and a mounting surface. A plurality of perforations may be formed in the polishing article for flow of material therethrough. In another aspect, a polishing article for polishing a substrate includes a body having a polishing surface and a conductive element disposed therein. The conductive element may have a contact surface that extends beyond a plane defined by the polishing surface. The polishing surface may have one or more pockets formed therein. The conductive element may be disposed in each of the polishing pockets.

公开(公告)号：US07137879B2

公开(公告)日：2006-11-21

申请号：US11393220

申请日：2006-03-30

申请人： Liang-Yuh Chen ,  Yuchun Wang ,  Yan Wang ,  Alain Duboust ,  Daniel A. Carl ,  Ralph Wadensweiler ,  Manoocher Birang ,  Paul D. Butterfield ,  Rashid Mavliev ,  Stan D. Tsai

发明人： Liang-Yuh Chen ,  Yuchun Wang ,  Yan Wang ,  Alain Duboust ,  Daniel A. Carl ,  Ralph Wadensweiler ,  Manoocher Birang ,  Paul D. Butterfield ,  Rashid Mavliev ,  Stan D. Tsai

IPC分类号： B24D3/34 ,  B24D11/00 ,  B24D17/00

CPC分类号： B82Y30/00 ,  B24B37/046 ,  B24B37/24 ,  B24B37/26 ,  B24D3/34

摘要： An article of manufacture and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including polishing article comprising a body having at least a partially conductive surface adapted to polish the substrate and a mounting surface. A plurality of perforations may be formed in the polishing article for flow of material therethrough. In another aspect, a polishing article for polishing a substrate includes a body having a polishing surface and a conductive element disposed therein. The conductive element may have a contact surface that extends beyond a plane defined by the polishing surface. The polishing surface may have one or more pockets formed therein. The conductive element may be disposed in each of the polishing pockets.

公开(公告)号：US06899804B2

公开(公告)日：2005-05-31

申请号：US10032275

申请日：2001-12-21

申请人： Alain Duboust ,  Lizhong Sun ,  Feng Q. Liu ,  Yuchun Wang ,  Yan Wang ,  Siew Neo ,  Liang-Yuh Chen

发明人： Alain Duboust ,  Lizhong Sun ,  Feng Q. Liu ,  Yuchun Wang ,  Yan Wang ,  Siew Neo ,  Liang-Yuh Chen

IPC分类号： B23H3/08 ,  B23H5/08 ,  B24B37/04 ,  C09G1/04 ,  C25F3/02 ,  H01L21/321 ,  H01L21/3213 ,  C25F3/00

CPC分类号： B23H3/08 ,  B23H5/08 ,  B24B37/0056 ,  B24B37/044 ,  B24B37/046 ,  C09G1/04 ,  C25F3/02 ,  H01L21/32125 ,  H01L21/32134

摘要： An electrolyte composition and method for planarizing a surface of a wafer using the electrolyte composition is provided. In one aspect, the electrolyte composition includes ammonium dihydrogen phosphate, diammonium hydrogen phosphate, or a mixture thereof. The composition has a pH between about 3 and about 10 which is environmentally friendly and does not present hazardous operation concerns. The composition may further comprise one or more additives selected from a group consisting of benzotriazole, ammonium citrate, ethlylenediamine, tetraethylenepentamine, triethylenetetramine, diethylenetriamine, amino acids, ammonium oxalate, ammonia, ammonium succinate, and citric acid.

摘要翻译： 提供了一种电解质组合物和使用电解质组合物对晶片的表面进行平面化的方法。 一方面，电解质组合物包括磷酸二氢铵，磷酸氢二铵或其混合物。 该组合物的pH为约3至约10，这是环境友好的并且不存在危险的操作问题。 组合物还可以包含一种或多种选自苯并三唑，柠檬酸铵，乙二胺，四亚乙基五胺，三亚乙基四胺，二亚乙基三胺，氨基酸，草酸铵，氨，琥珀酸铵和柠檬酸的添加剂。

公开(公告)号：US07311592B2

公开(公告)日：2007-12-25

申请号：US11556011

申请日：2006-11-02

申请人： Liang-Yuh Chen ,  Yuchun Wang ,  Yan Wang ,  Alain Duboust ,  Daniel A. Carl ,  Ralph Wadensweiler ,  Manoocher Birang ,  Paul D. Butterfield ,  Rashid Mavliev ,  Stan D. Tsai

发明人： Liang-Yuh Chen ,  Yuchun Wang ,  Yan Wang ,  Alain Duboust ,  Daniel A. Carl ,  Ralph Wadensweiler ,  Manoocher Birang ,  Paul D. Butterfield ,  Rashid Mavliev ,  Stan D. Tsai

IPC分类号： B24D3/34 ,  B24D11/00 ,  B24D17/00

CPC分类号： B82Y30/00 ,  B24B37/046 ,  B24B37/24 ,  B24B37/26 ,  B24D3/34

摘要： An article of manufacture and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including polishing article comprising a body having at least a partially conductive surface adapted to polish the substrate. A plurality of perforations may be formed in the polishing article for flow of material therethrough. An electrode is also exposed to the polishing surface by at least a portion of the plurality of perforations. The article of manufacture may also include a polishing surface having a plurality of grooves, wherein a portion of the plurality of grooves intersect with a portion of the plurality of perforations.

摘要翻译： 提供了一种用于平坦化基板表面的制造和设备。 在一个方面，提供了一种用于抛光衬底的制品，所述衬底包括抛光制品，所述抛光制品包括具有适于抛光所述衬底的至少部分导电表面的主体。 可以在抛光制品中形成多个穿孔，以使材料流过其中。 电极还通过多个穿孔的至少一部分暴露于抛光表面。 制品还可以包括具有多个凹槽的抛光表面，其中多个凹槽的一部分与多个穿孔的一部分相交。

公开(公告)号：US20060172671A1

公开(公告)日：2006-08-03

申请号：US11393220

申请日：2006-03-30

申请人： Liang-Yuh Chen ,  Yuchun Wang ,  Yan Wang ,  Alain Duboust ,  Daniel Carl ,  Ralph Wadensweiler ,  Manoocher Birang ,  Paul Butterfield ,  Rashid Mavliev ,  Stan Tsai

发明人： Liang-Yuh Chen ,  Yuchun Wang ,  Yan Wang ,  Alain Duboust ,  Daniel Carl ,  Ralph Wadensweiler ,  Manoocher Birang ,  Paul Butterfield ,  Rashid Mavliev ,  Stan Tsai

IPC分类号： B23F21/03

CPC分类号： B82Y30/00 ,  B24B37/046 ,  B24B37/24 ,  B24B37/26 ,  B24D3/34

摘要： An article of manufacture and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including polishing article comprising a body having at least a partially conductive surface adapted to polish the substrate and a mounting surface. A plurality of perforations may be formed in the polishing article for flow of material therethrough. In another aspect, a polishing article for polishing a substrate includes a body having a polishing surface and a conductive element disposed therein. The conductive element may have a contact surface that extends beyond a plane defined by the polishing surface. The polishing surface may have one or more pockets formed therein. The conductive element may be disposed in each of the polishing pockets.

公开(公告)号：US07066800B2

公开(公告)日：2006-06-27

申请号：US10033732

申请日：2001-12-27

申请人： Liang-Yuh Chen ,  Yuchun Wang ,  Yan Wang ,  Alain Duboust ,  Daniel A. Carl ,  Ralph Wadensweiler ,  Manoocher Birang ,  Paul D. Butterfield ,  Rashid Mavliev ,  Stan D. Tsai

发明人： Liang-Yuh Chen ,  Yuchun Wang ,  Yan Wang ,  Alain Duboust ,  Daniel A. Carl ,  Ralph Wadensweiler ,  Manoocher Birang ,  Paul D. Butterfield ,  Rashid Mavliev ,  Stan D. Tsai

IPC分类号： B24D11/00

CPC分类号： H01L21/32125 ,  B23H5/08 ,  B24B37/22 ,  B24B37/24 ,  B24B37/26 ,  B24B53/017 ,  B24B57/02 ,  B82Y30/00 ,  Y10T428/24273 ,  Y10T428/24355 ,  Y10T428/24628 ,  Y10T428/24917

摘要： An article of manufacture and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including polishing article comprising a body having at least a partially conductive surface adapted to polish the substrate and a mounting surface. A plurality of perforations may be formed in the polishing article for flow of material therethrough. In another aspect, a polishing article for polishing a substrate includes a body having a polishing surface and a conductive element disposed therein. The conductive element may have a contact surface that extends beyond a plane defined by the polishing surface. The polishing surface may have one or more pockets formed therein. The conductive element may be disposed in each of the polishing pockets.

公开(公告)号：US08639377B2

公开(公告)日：2014-01-28

申请号：US12267526

申请日：2008-11-07

申请人： Kun Xu ,  Feng Q Liu ,  Yuchun Wang ,  Abraham Ravid ,  Wen-Chiang Tu

发明人： Kun Xu ,  Feng Q Liu ,  Yuchun Wang ,  Abraham Ravid ,  Wen-Chiang Tu

IPC分类号： G06F19/00 ,  F04B19/16 ,  F04D27/02 ,  F04D23/00

CPC分类号： G01B11/0683 ,  B24B37/005 ,  H01L45/06 ,  H01L45/1233 ,  H01L45/144 ,  H01L45/1683

摘要： Methods of determining thickness and phase of a GST layer on a semiconductor substrate are described using intensity spectra within the infra-red range. In particular, techniques for using certain transmission at certain frequencies are disclosed for faster thickness and phase determination in an in-line or standalone metrology/monitoring system for CMP processes.

摘要翻译： 使用在红外范围内的强度光谱来描述确定半导体衬底上的GST层的厚度和相位的方法。 特别地，公开了在某些频率下使用某些传输的技术，用于在用于CMP工艺的在线或独立计量/监测系统中更快的厚度和相位确定。

公开(公告)号：US20050269665A1

公开(公告)日：2005-12-08

申请号：US10861007

申请日：2004-06-04

申请人： Ian Wylie ,  Heinz Busta ,  David Schroeder ,  J. Steckenrider ,  Yuchun Wang

发明人： Ian Wylie ,  Heinz Busta ,  David Schroeder ,  J. Steckenrider ,  Yuchun Wang

IPC分类号： H01L21/48 ,  H01L21/768 ,  H01L21/98 ,  H01L23/34 ,  H01L23/473 ,  H01L25/065 ,  H01L29/00 ,  H01L29/06

CPC分类号： H01L23/473 ,  H01L21/4882 ,  H01L21/76898 ,  H01L25/0657 ,  H01L25/50 ,  H01L2225/06513 ,  H01L2225/06524 ,  H01L2225/06541 ,  H01L2225/06582 ,  H01L2225/06589 ,  H01L2225/06593 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

摘要： A three-dimensional integrated circuit that provides reduced interconnect signal delay over known 2-dimensional systems. The three-dimensional integrated circuit also allows improved circuit cooling. The three-dimensional integrated circuit comprises two or more electrically connected integrated circuits, separated by a cooling channel.

摘要翻译： 一种三维集成电路，可在已知的二维系统上提供缩短的互连信号延迟。 三维集成电路还可以改善电路冷却。 三维集成电路包括由冷却通道隔开的两个或更多个电连接的集成电路。

公开(公告)号：US06537144B1

公开(公告)日：2003-03-25

申请号：US09505899

申请日：2000-02-17

申请人： Stan D. Tsai ,  Yuchun Wang ,  Kapila Wijekoon ,  Rajeev Bajaj ,  Fred C. Redeker

发明人： Stan D. Tsai ,  Yuchun Wang ,  Kapila Wijekoon ,  Rajeev Bajaj ,  Fred C. Redeker

IPC分类号： B24D1100

CPC分类号： B24B37/26 ,  B24B53/017 ,  H01L21/3212

摘要： Dishing in chemical mechanical polishing (CMP) is reduced by introducing a material that balances electrochemical forces. In a first embodiment of the invention, a polishing pad having copper material in grooves on the polishing pad surface is used in the polishing process to reduce dishing. In a second embodiment of the invention, the polishing pad has perforations with copper fillings. In a third embodiment of the invention, a copper retaining ring on the polishing head introduces copper material to the CMP process to reduce dishing. In a fourth embodiment of the invention, a conditioning plate of copper is used in the polishing apparatus. In a fifth embodiment of the invention, additional copper features are placed on the substrate to be polished. The polishing of the additional features introduces copper steadily through the polishing process. In a sixth embodiment of the invention, copper compounds are added to the polish slurry.