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33 条记录 (耗时 0.02 秒)

    Light emitting diode package
    12.
    发明授权
    Light emitting diode package 失效
    发光二极管封装

    公开(公告)号：US08084778B2

    公开(公告)日：2011-12-27

    申请号：US12571751

    申请日：2009-10-01

    申请人： Ho Sun Paek ,  Hak Hwan Kim ,  Young Jin Lee ,  Hyung Kun Kim ,  Suk Ho Jung

    发明人： Ho Sun Paek ,  Hak Hwan Kim ,  Young Jin Lee ,  Hyung Kun Kim ,  Suk Ho Jung

    IPC分类号： H01L33/00

    CPC分类号： H01L33/642 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/1815 ,  H01L2924/00014

    摘要： There is provided an LED package having high heat dissipation efficiency. An LED package according to an aspect of the invention may include: a package body including a first groove portion being recessed into the package body and provided as a mounting area on the top of the package body; first and second lead frames arranged on a lower surface of the first groove portion while parts of the first and second lead frames are exposed; an LED chip mounted onto the lower surface of the first groove portion and electrically connected to the first and second lead frames; and a plurality of heat dissipation patterns provided on the bottom of the package body and formed of carbon nanotubes.

    摘要翻译： 提供了具有高散热效率的LED封装。 根据本发明的一个方面的LED封装可以包括：封装主体，包括凹入到封装体中的第一凹槽部分，并且作为安装区域设置在封装主体的顶部; 第一引线框架和第二引线框架布置在第一槽部分的下表面上，同时第一和第二引线框架的一部分被暴露; LED芯片安装在第一槽部分的下表面上并电连接到第一和第二引线框架; 以及设置在包装体的底部并由碳纳米管形成的多个散热图案。

    LED DEVICE HAVING ADJUSTABLE COLOR TEMPERATURE
    13.
    发明申请
    LED DEVICE HAVING ADJUSTABLE COLOR TEMPERATURE 审中-公开
    具有可调节颜色温度的LED装置

    公开(公告)号：US20140168965A1

    公开(公告)日：2014-06-19

    申请号：US14236369

    申请日：2011-08-16

    申请人： Kyung Mi Moon ,  Young Jin Lee ,  Jung Hye Chae ,  Hyung Kun Kim

    发明人： Kyung Mi Moon ,  Young Jin Lee ,  Jung Hye Chae ,  Hyung Kun Kim

    IPC分类号： F21K99/00

    CPC分类号： F21V23/0442 ,  H05B33/0857

    摘要： An LED device according to an embodiment of the present invention may include a first LED light source unit including at least one first white LED and emitting white light of a first color temperature; a second LED light source unit including at least one second white LED and emitting white light of a second color temperature different from the first color temperature; and a variable resistor connected to at least one of the first LED light source unit and the second LED light source unit, being configured to control a current supplied to the at least one of the first LED light source unit and the second LED light source unit.

    摘要翻译： 根据本发明的实施例的LED装置可以包括：第一LED光源单元，其包括至少一个第一白色LED和发射第一色温的白光; 第二LED光源单元，其包括至少一个第二白色LED并发射与第一色温不同的第二色温的白光; 以及连接到第一LED光源单元和第二LED光源单元中的至少一个的可变电阻器，被配置为控制提供给第一LED光源单元和第二LED光源单元中的至少一个的电流 。

    AC driven light emitting device
    14.
    发明授权
    AC driven light emitting device 有权
    交流驱动发光装置

    公开(公告)号：US08736181B2

    公开(公告)日：2014-05-27

    申请号：US13215619

    申请日：2011-08-23

    申请人： Young Jin Lee ,  Hyung Kun Kim ,  Kyung Mi Moon

    发明人： Young Jin Lee ,  Hyung Kun Kim ,  Kyung Mi Moon

    IPC分类号： H05B37/02

    CPC分类号： H05B33/0821 ,  H05B33/0806

    摘要： There is provided an alternating current (AC) driven light emitting device including a plurality of LED arrays connected in series, each having a structure in which a plurality of LEDs are electrically connected to form a two-terminal circuit and emit light by a bidirectional voltage when an AC voltage is applied to the two-terminal circuit; and a switching device connected to at least one of the plurality of LED arrays and controlling a total driving voltage with respect to the plurality of LED arrays. The AC driven light emitting device permits operation from a low driving voltage Vf while having a high driving voltage at a high voltage Vf, thereby achieving excellence in terms of power factor, THD, and energy efficiency.

    摘要翻译： 提供了一种包括串联连接的多个LED阵列的交流（AC）驱动的发光器件，每个LED阵列具有多个LED电连接以形成两端电路并通过双向电压发光的结构 当对两端电路施加交流电压时; 以及连接到所述多个LED阵列中的至少一个并且控制相对于所述多个LED阵列的总驱动电压的开关装置。 交流驱动发光器件允许从低驱动电压Vf进行操作，同时具有高电压Vf的高驱动电压，从而在功率因数，THD和能量效率方面实现卓越。

    Led package module
    16.
    发明授权
    Led package module 有权
    LED封装模块

    公开(公告)号：US08278671B2

    公开(公告)日：2012-10-02

    申请号：US13404924

    申请日：2012-02-24

    申请人： Suk Ho Jung ,  Hyung Kun Kim ,  Hak Hwan Kim ,  Young Jin Lee ,  Ho Sun Paek

    发明人： Suk Ho Jung ,  Hyung Kun Kim ,  Hak Hwan Kim ,  Young Jin Lee ,  Ho Sun Paek

    IPC分类号： H01L33/00

    CPC分类号： H01L25/0753 ,  H01L33/486 ,  H01L33/504 ,  H01L33/508 ,  H01L2224/48091 ,  H01L2224/48235 ,  H01L2924/00014

    摘要： An LED package module according to an aspect of the invention may include: a substrate having predetermined electrodes thereon; a plurality of LED chips mounted onto the substrate, separated from each other at predetermined intervals, and electrically connected to the electrodes; a first color resin portion molded around at least one of the plurality of LED chips; a second color resin portion molded around all of the LED chips except for the LED chip around which the first color resin portion is molded, and having a different color from the first color resin portion; and a third color resin portion encompassing both the first color resin portion and the second color resin portion and having a different color from the first color resin portion and the second color resin portion.

    摘要翻译： 根据本发明的一个方面的LED封装模块可以包括：其上具有预定电极的基板; 安装在基板上的多个LED芯片，以预定间隔彼此分开，并与电极电连接; 围绕所述多个LED芯片中的至少一个模制的第一颜色树脂部分; 围绕除了第一着色树脂部分成型的LED芯片之外的所有LED芯片的第二颜色树脂部分模制，并且具有与第一着色树脂部分不同的颜色; 以及第三颜色树脂部分，其包围第一着色树脂部分和第二颜色树脂部分，并且具有与第一着色树脂部分和第二着色树脂部分不同的颜色。

    LIGHT EMITTING DIODE PACKAGE
    18.
    发明申请
    LIGHT EMITTING DIODE PACKAGE 失效
    发光二极管封装

    公开(公告)号：US20100171143A1

    公开(公告)日：2010-07-08

    申请号：US12571751

    申请日：2009-10-01

    申请人： Ho Sun PAEK ,  Hak Hwan Kim ,  Young Jin Lee ,  Hyung Kun Kim ,  Suk Ho Jung

    发明人： Ho Sun PAEK ,  Hak Hwan Kim ,  Young Jin Lee ,  Hyung Kun Kim ,  Suk Ho Jung

    IPC分类号： H01L33/00

    CPC分类号： H01L33/642 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/1815 ,  H01L2924/00014

    摘要： There is provided an LED package having high heat dissipation efficiency. An LED package according to an aspect of the invention may include: a package body including a first groove portion being recessed into the package body and provided as a mounting area on the top of the package body; first and second lead frames arranged on a lower surface of the first groove portion while parts of the first and second lead frames are exposed; an LED chip mounted onto the lower surface of the first groove portion and electrically connected to the first and second lead frames; and a plurality of heat dissipation patterns provided on the bottom of the package body and formed of carbon nanotubes.

    摘要翻译： 提供了具有高散热效率的LED封装。 根据本发明的一个方面的LED封装可以包括：封装主体，包括凹入到封装体中的第一凹槽部分，并且作为安装区域设置在封装主体的顶部; 第一引线框架和第二引线框架布置在第一槽部分的下表面上，同时第一和第二引线框架的一部分被暴露; LED芯片安装在第一槽部分的下表面上并电连接到第一和第二引线框架; 以及设置在包装体的底部并由碳纳米管形成的多个散热图案。

    LED PACKAGE MODULE
    19.
    发明申请
    LED PACKAGE MODULE 有权
    LED封装模块

    公开(公告)号：US20100090231A1

    公开(公告)日：2010-04-15

    申请号：US12571754

    申请日：2009-10-01

    申请人： Suk Ho JUNG ,  Hyung Kun Kim ,  Hak Hwan Kim ,  Young Jin Lee ,  Ho Sun Paek

    发明人： Suk Ho JUNG ,  Hyung Kun Kim ,  Hak Hwan Kim ,  Young Jin Lee ,  Ho Sun Paek

    IPC分类号： H01L33/00

    CPC分类号： H01L25/0753 ,  H01L33/486 ,  H01L33/504 ,  H01L33/508 ,  H01L2224/48091 ,  H01L2224/48235 ,  H01L2924/00014

    摘要： An LED package module according to an aspect of the invention may include: a substrate having predetermined electrodes thereon; a plurality of LED chips mounted onto the substrate, separated from each other at predetermined intervals, and electrically connected to the electrodes; a first color resin portion molded around at least one of the plurality of LED chips; a second color resin portion molded around all of the LED chips except for the LED chip around which the first color resin portion is molded, and having a different color from the first color resin portion; and a third color resin portion encompassing both the first color resin portion and the second color resin portion and having a different color from the first color resin portion and the second color resin portion. Accordingly, a reduction in luminous efficiency of an LED caused by yellowing is prevented to thereby increase luminous efficiency and achieve a reduction in size.

    摘要翻译： 根据本发明的一个方面的LED封装模块可以包括：其上具有预定电极的基板; 安装在基板上的多个LED芯片，以预定间隔彼此分开，并与电极电连接; 围绕所述多个LED芯片中的至少一个模制的第一颜色树脂部分; 围绕除了第一着色树脂部分成型的LED芯片之外的所有LED芯片的第二颜色树脂部分模制，并且具有与第一着色树脂部分不同的颜色; 以及第三颜色树脂部分，其包围第一着色树脂部分和第二颜色树脂部分，并且具有与第一着色树脂部分和第二着色树脂部分不同的颜色。 因此，防止由黄化引起的LED的发光效率的降低，从而提高发光效率并实现尺寸的减小。

    Light emitting diode package
    20.
    发明授权
    Light emitting diode package 有权
    发光二极管封装

    公开(公告)号：US07973328B2

    公开(公告)日：2011-07-05

    申请号：US12204095

    申请日：2008-09-04

    申请人： Hyung Kun Kim

    发明人： Hyung Kun Kim

    IPC分类号： H01L33/00

    CPC分类号： H01L33/505 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

    摘要： There is provided a light emitting diode (LED) package in which a phosphor layer encapsulating an LED chip is formed uniformly to facilitate a process. The LED package includes: a package body having a mounting area; a holding part mounted on the mounting area to expose a portion of the mounting area; an LED chip mounted on the mounting area, the LED chip surrounded by the holding part to emit light; and a phosphor layer held by the holding part to seal a space defined by the holding part, the phosphor layer converting a wavelength of the light from the LED chip.

    摘要翻译： 提供了一种发光二极管（LED）封装，其中均匀地形成封装LED芯片的荧光体层以便于处理。 LED封装包括：具有安装区域的封装体; 保持部，安装在所述安装区域上，以暴露所述安装区域的一部分; 安装在安装区域上的LED芯片，由保持部分包围的LED芯片发光; 以及由所述保持部保持的荧光体层，以密封由所述保持部限定的空间，所述荧光体层转换来自所述LED芯片的光的波长。