Semiconductor light emitting device
    2.
    发明授权
    Semiconductor light emitting device 有权
    半导体发光器件

    公开(公告)号:US08610162B2

    公开(公告)日:2013-12-17

    申请号:US13286807

    申请日:2011-11-01

    IPC分类号: H01L33/00

    摘要: A semiconductor light emitting device includes: first and second conductive type semiconductor layers; an active layer disposed between the first and second conductive type semiconductor layers; and first and second electrodes disposed on one surface of each of the first and second conductive type semiconductor layers, respectively, wherein at least one of the first and second electrodes includes a pad part and a finger part formed to extend from the pad part, and the end of the finger part has an annular shape. Because a phenomenon in which current is concentrated in a partial area of the finger part is minimized, tolerance to electrostatic discharge (ESD) can be strengthened and light extraction efficiency can be improved.

    摘要翻译: 半导体发光器件包括:第一和第二导电类型半导体层; 设置在所述第一和第二导电类型半导体层之间的有源层; 以及分别设置在每个第一和第二导电类型半导体层的一个表面上的第一和第二电极,其中第一和第二电极中的至少一个包括衬垫部分和形成为从衬垫部分延伸的指状部分,以及 手指部分的端部具有环形形状。 由于电流集中在手指部分的部分区域的现象最小化,因此可以增强对静电放电(ESD)的耐受性,并且可以提高光提取效率。

    METHOD OF MANUFACTURING GALLIUM NITRIDE BASED LIGHT EMITTING DIODE HAVING SURFACE IRREGULARITIES
    3.
    发明申请
    METHOD OF MANUFACTURING GALLIUM NITRIDE BASED LIGHT EMITTING DIODE HAVING SURFACE IRREGULARITIES 审中-公开
    制造具有表面不规则性的基于氮化镓的发光二极管的方法

    公开(公告)号:US20090258454A1

    公开(公告)日:2009-10-15

    申请号:US12490891

    申请日:2009-06-24

    IPC分类号: H01L21/20 H01L33/00

    CPC分类号: H01L33/22 H01L33/44

    摘要: An n-type GaN layer is formed on a substrate, and an active layer is formed on the n-type GaN layer. A p-type GaN layer is formed on the active layer, and portions of the p-type GaN layer and the active layer are mesa-etched so as to expose a portion of the n-type GaN layer. An irregularities forming layer is formed on the p-type GaN layer and a photosensitive film pattern for forming a surface irregularities pattern is formed on the irregularities forming layer. The irregularities forming layer is selectively wet-etched by using the photosensitive film pattern as an etching mask, thereby forming surface irregularities. A p-electrode is formed on the p-type GaN layer having the surface irregularities formed thereon, and an n-electrode is formed on the exposed n-type GaN layer.”

    摘要翻译: 在衬底上形成n型GaN层,在n型GaN层上形成有源层。 在有源层上形成p型GaN层,并且对p型GaN层和有源层的部分进行台面蚀刻,以暴露n型GaN层的一部分。 在p型GaN层上形成凹凸形成层,在凹凸形成层上形成用于形成表面凹凸图案的感光膜图案。 通过使用感光膜图案作为蚀刻掩模来选择性地湿法蚀刻不规则形成层,从而形成表面不规则。 在其上形成有表面凹凸的p型GaN层上形成p电极,在暴露的n型GaN层上形成n电极。

    Method of manufacturing gallium nitride based light emitting diode
    4.
    发明申请
    Method of manufacturing gallium nitride based light emitting diode 审中-公开
    制造氮化镓基发光二极管的方法

    公开(公告)号:US20070184568A1

    公开(公告)日:2007-08-09

    申请号:US11646406

    申请日:2006-12-28

    IPC分类号: H01L21/00

    CPC分类号: H01L33/22 H01L33/44

    摘要: Provided a method of manufacturing a GaN-based LED comprising forming an n-type GaN layer on a substrate; forming an active layer on the n-type GaN layer; forming a p-type GaN layer on the active layer; mesa-etching portions of the p-type GaN layer and the active layer so as to expose a portion of the n-type GaN layer; forming an irregularities forming layer on the p-type GaN layer; forming a photosensitive film pattern for forming a surface irregularities pattern on the irregularities forming layer; selectively wet-etching the irregularities forming layer by using the photosensitive film pattern as an etching mask, thereby forming surface irregularities; forming a p-electrode on the p-type GaN layer having the surface irregularities formed thereon; and forming an n-electrode on the exposed n-type GaN layer.

    摘要翻译: 提供一种制造GaN基LED的方法,包括在衬底上形成n型GaN层; 在n型GaN层上形成有源层; 在有源层上形成p型GaN层; 蚀刻p型GaN层和有源层的部分,以暴露n型GaN层的一部分; 在p型GaN层上形成凹凸形成层; 形成用于在所述凹凸形成层上形成表面凹凸图案的感光膜图案; 通过使用感光膜图案作为蚀刻掩模来选择性地湿法蚀刻不规则形成层,从而形成表面不规则; 在其上形成有表面凹凸的p型GaN层上形成p电极; 以及在暴露的n型GaN层上形成n电极。

    SEMICONDUCTOR LIGHT-EMITTING ELEMENT
    6.
    发明申请
    SEMICONDUCTOR LIGHT-EMITTING ELEMENT 审中-公开
    半导体发光元件

    公开(公告)号:US20140231859A1

    公开(公告)日:2014-08-21

    申请号:US14236582

    申请日:2011-08-01

    IPC分类号: H01L33/38 H01L33/62 H01L33/32

    摘要: A semiconductor light emitting device may include: a light emitting structure including an n-type semiconductor layer, a p-type semiconductor layer, and an active layer interposed therebetween; a first electrode connected to one of the n-type semiconductor layer and the p-type semiconductor layer; and a second electrode connected to the other of the n-type semiconductor layer and the p-type semiconductor layer. The first electrode may include a first electrode pad disposed in a central portion of one side of the light emitting structure and first to third branch electrodes connected to the first electrode pad, having a fork shape. The second electrode may include second and third electrode pads disposed separately in both corners of the other side opposing the one side and fourth to seventh branch electrodes connected thereto. The fourth and seventh branch electrodes may extend in an interdigitated manner between the first to third branch electrodes.

    摘要翻译: 半导体发光器件可以包括:包含n型半导体层,p型半导体层和插入其间的有源层的发光结构; 连接到所述n型半导体层和所述p型半导体层之一的第一电极; 以及与n型半导体层和p型半导体层中的另一方连接的第二电极。 第一电极可以包括设置在发光结构的一侧的中心部分中的第一电极焊盘和连接到具有叉形状的第一电极焊盘的第一至第三分支电极。 第二电极可以包括分别位于与一侧相对的另一侧的两个角部和与其连接的第四至第七分支电极的第二和第三电极焊盘。 第四和第七分支电极可以在第一至第三分支电极之间以叉指方式延伸。

    VERTICAL NITRIDE-BASED LIGHT EMITTING DIODE AND METHOD OF MANUFACTURING THE SAME
    8.
    发明申请
    VERTICAL NITRIDE-BASED LIGHT EMITTING DIODE AND METHOD OF MANUFACTURING THE SAME 审中-公开
    基于硝酸盐的垂直发光二极管及其制造方法

    公开(公告)号:US20100090246A1

    公开(公告)日:2010-04-15

    申请号:US12328142

    申请日:2008-12-04

    IPC分类号: H01L33/00 H01L21/18

    摘要: Provided is a vertical nitride-based LED including a first electrode; a first nitride semiconductor layer that is disposed on the first electrode; an active layer that is disposed on the first nitride semiconductor layer; a second nitride semiconductor layer that is disposed on the active layer; an ohmic contact pattern that is disposed on the second nitride semiconductor layer; a second electrode that is disposed on the ohmic contact pattern; and a bonding pad that is electrically connected to the second electrode and disposed on the second nitride semiconductor layer.

    摘要翻译: 提供了包括第一电极的垂直氮化物基LED; 设置在所述第一电极上的第一氮化物半导体层; 设置在所述第一氮化物半导体层上的有源层; 设置在所述有源层上的第二氮化物半导体层; 设置在所述第二氮化物半导体层上的欧姆接触图案; 设置在所述欧姆接触图案上的第二电极; 以及与第二电极电连接并设置在第二氮化物半导体层上的接合焊盘。

    Semiconductor light emitting device and manufacturing method thereof
    9.
    发明授权
    Semiconductor light emitting device and manufacturing method thereof 有权
    半导体发光器件及其制造方法

    公开(公告)号:US08969895B2

    公开(公告)日:2015-03-03

    申请号:US13225979

    申请日:2011-09-06

    摘要: A semiconductor light emitting device includes: a light emission structure in which a first conductive semiconductor layer, an active layer and a second conductive semiconductor layer are sequentially stacked; a first electrode formed on the first conductive semiconductor layer; an insulating layer formed on the second conductive semiconductor layer and made of a transparent material; a reflection unit formed on the insulating layer and reflecting light emitted from the active layer; a second electrode formed on the reflection unit; and a transparent electrode formed on the second conductive semiconductor layer, the transparent electrode being in contact with the insulating layer and the second electrode.

    摘要翻译: 一种半导体发光器件包括:发光结构,其中第一导电半导体层,有源层和第二导电半导体层依次层叠; 形成在所述第一导电半导体层上的第一电极; 形成在所述第二导电半导体层上并由透明材料制成的绝缘层; 反射单元,形成在所述绝缘层上并反射从所述有源层发射的光; 形成在反射单元上的第二电极; 以及形成在所述第二导电半导体层上的透明电极,所述透明电极与所述绝缘层和所述第二电极接触。