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公开(公告)号：US20050051432A1
公开(公告)日：2005-03-10
申请号：US10498042
申请日：2002-12-11
CPC分类号： C25F7/00 , B23H3/02 , B23H5/08 , C25F3/00 , H01L21/32125
摘要： There is provided an electrolytic processing apparatus and method that can effect processing of a workpiece with high processing precision and can produce an intended form of processed workpiece with high accuracy of form. The electrolytic processing apparatus includes: a processing electrode which can come close to a workpiece; a feeding electrode for feeding electricity to the workpiece; an ion exchanger disposed in at least one of the space between the workpiece and the processing electrode and the space between the workpiece and the feeding electrode; a fluid supply section for supplying a fluid to the space between the workpiece and at least one of the processing electrode and the feeding electrode; and a power source for supplying an electric power between the processing electrode and the feeding electrode while arbitrarily controlling at least one of a voltage and an electric current.
摘要翻译： 提供了能够以高加工精度对工件进行加工的电解处理装置和方法，并且可以以高精度的形式产生加工工件的预期形式。 该电解处理装置包括：可接近工件的处理电极; 用于向工件供电的供电电极; 离子交换器，其设置在所述工件和所述处理电极之间的空间中的至少一个和所述工件与所述馈电电极之间的空间中; 流体供应部分，用于将流体供应到工件与处理电极和馈电电极中的至少一个之间的空间; 以及用于在任意地控制电压和电流中的至少一个的同时在所述处理电极和所述馈电电极之间提供电力的电源。
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12.发明授权公开(公告)号：US07569135B2
公开(公告)日：2009-08-04
申请号：US11723934
申请日：2007-03-22
申请人： Mitsuhiko Shirakashi , Masayuki Kumekawa , Hozumi Yasuda , Itsuki Kobata , Ikutaro Noji , Kaori Yoshida
发明人： Mitsuhiko Shirakashi , Masayuki Kumekawa , Hozumi Yasuda , Itsuki Kobata , Ikutaro Noji , Kaori Yoshida
CPC分类号： C25F7/00 , B23H3/00 , B23H3/04 , B23H3/08 , B23H5/08 , B24B37/04 , C25F3/00 , C25F5/00 , H01L21/32115 , H01L21/3212
摘要： The present invention replaces all or a portion of substrate processing by chemical-mechanical polishing with electrolytic processing using deionized water, ultrapure water or the like. An electrolytic processing apparatus comprises: a chemical-mechanical polishing section for chemically-mechanically polishing a surface of a substrate; an electrolytic processing section having a processing electrode and a feeding electrode, and also having an ion exchanger provided at least either between the substrate and the processing electrode or between the substrate and the feeding electrode, for electrolytically processing a surface of a workpiece under existence of a solution by applying a voltage between the processing electrode and the feeding electrode; and a top ring capable of freely moving between the chemical-mechanical polishing section and the processing electrode section.
摘要翻译： 本发明通过使用去离子水，超纯水等的电解处理通过化学机械抛光来代替基板处理的全部或一部分。 电解处理设备包括：化学机械抛光部分，用于对基材的表面进行化学机械抛光; 具有处理电极和供电电极的电解处理部分，并且还具有设置在基板和处理电极之间或者基板和供电电极之间的至少一个的离子交换器，用于在存在的工件的表面进行电解处理 通过在处理电极和馈电电极之间施加电压的解决方案; 以及能够在所述化学机械抛光部和所述处理电极部之间自由移动的顶环。
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13.发明申请公开(公告)号：US20070181432A1
公开(公告)日：2007-08-09
申请号：US11723934
申请日：2007-03-22
申请人： Mitsuhiko Shirakashi , Masayuki Kumekawa , Hozumi Yasuda , Itsuki Kobata , Ikutaro Noji , Kaori Yoshida
发明人： Mitsuhiko Shirakashi , Masayuki Kumekawa , Hozumi Yasuda , Itsuki Kobata , Ikutaro Noji , Kaori Yoshida
IPC分类号： C25D5/10
CPC分类号： C25F7/00 , B23H3/00 , B23H3/04 , B23H3/08 , B23H5/08 , B24B37/04 , C25F3/00 , C25F5/00 , H01L21/32115 , H01L21/3212
摘要： The present invention replaces all or a portion of substrate processing by chemical-mechanical polishing with electrolytic processing using deionized water, ultrapure water or the like. An electrolytic processing apparatus comprises: a chemical-mechanical polishing section for chemically-mechanically polishing a surface of a substrate; an electrolytic processing section having a processing electrode and a feeding electrode, and also having an ion exchanger provided at least either between the substrate and the processing electrode or between the substrate and the feeding electrode, for electrolytically processing a surface of a workpiece under existence of a solution by applying a voltage between the processing electrode and the feeding electrode; and a top ring capable of freely moving between the chemical-mechanical polishing section and the processing electrode section.
摘要翻译： 本发明通过使用去离子水，超纯水等的电解处理通过化学机械抛光来代替基板处理的全部或一部分。 电解处理设备包括：化学机械抛光部分，用于对基材的表面进行化学机械抛光; 具有处理电极和供电电极的电解处理部分，并且还具有设置在基板和处理电极之间或基板与供电电极之间的至少一个的离子交换器，用于在存在的工件的表面上电解处理 通过在处理电极和馈电电极之间施加电压的解决方案; 以及能够在所述化学机械抛光部和所述处理电极部之间自由移动的顶环。
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公开(公告)号：US20060234508A1
公开(公告)日：2006-10-19
申请号：US10513399
申请日：2003-05-16
IPC分类号： H01L21/302 , H01L21/461
CPC分类号： H01L21/02087 , B23H5/04 , B23H5/08 , B24B37/345 , C25F3/00 , C25F7/00 , H01L21/0209 , H01L21/32115 , H01L21/6708 , H01L21/6715 , H01L21/67173 , H01L21/67219 , H01L21/6723 , H01L21/7684 , H01L21/76843 , H01L21/76846 , H01L21/76849 , H01L21/76873
摘要： There is provided a substrate processing apparatus which can process a substrate by using an electrolytic processing method, while reducing a load upon a CMP processing to the least possible extent. The substrate processing apparatus of the present invention includes: an electrolytic processing unit (36) for electrolytically removing the surface of the substrate W having a to-be-processed film formed in said surface, said unit including a feeding section (373) that comes into contact with said surface of the substrate W; a bevel-etching unit (48) for etching away the to-be-processed film remaining unprocessed at the portion of the substrate that has been in contact with the feeding section (373) in the electrolytic processing unit (36); a chemical mechanical polishing unit (34) for chemically and mechanically polishing the surface of the substrate.
摘要翻译： 提供了一种基板处理装置，其可以通过使用电解处理方法来处理基板，同时尽可能减少CMP处理时的负载。 本发明的基板处理装置包括：电解处理单元，用于电解去除在所述表面上形成的待处理膜的基板W的表面，所述单元包括来自的进料部分（373） 与基板W的所述表面接触; 斜面蚀刻单元（48），用于在电解处理单元（36）中与已经与供电部分（373）接触的部分处去除未处理的被处理膜; 化学机械抛光单元（34），用于化学和机械地抛光衬底的表面。
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公开(公告)号：US06875335B2
公开(公告)日：2005-04-05
申请号：US10449515
申请日：2003-06-02
申请人： Yuzo Mori , Mitsuhiko Shirakashi , Takayuki Saito , Yasushi Toma , Akira Fukunaga , Itsuki Kobata
发明人： Yuzo Mori , Mitsuhiko Shirakashi , Takayuki Saito , Yasushi Toma , Akira Fukunaga , Itsuki Kobata
摘要： An anode as a workpiece, and a cathode opposed to the anode with a predetermined spacing are placed in ultrapure water. A catalytic material promoting dissociation of the ultrapure water and having water permeability is disposed between the workpiece and the cathode. A flow of the ultrapure water is formed inside the catalytic material, with a voltage being applied between the workpiece and the cathode, to decompose water molecules in the ultrapure water into hydrogen ions and hydroxide ions, and supply the resulting hydroxide ions to a surface of the workpiece, thereby performing removal processing of or oxide film formation on the workpiece through a chemical dissolution reaction or an oxidation reaction mediated by the hydroxide ions. Thus, clean processing can be performed by use of hydroxide ions in ultrapure water, with no impurities left behind on the processed surface of the workpiece.
摘要翻译： 将作为工件的阳极和与阳极相对的具有预定间隔的阴极置于超纯水中。 在工件和阴极之间设置促进超纯水的离解并具有透水性的催化材料。 在催化材料内部形成超纯水流，在工件和阴极之间施加电压，将超纯水中的水分子分解为氢离子和氢氧根离子，并将得到的氢氧根离子供给到 从而通过化学溶解反应或由氢氧根离子介导的氧化反应来进行工件的去除处理或氧化膜形成。 因此，可以通过在超纯水中使用氢氧根离子进行清洁处理，在工件的加工表面上不会留下杂质。
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公开(公告)号：US06743349B2
公开(公告)日：2004-06-01
申请号：US09897913
申请日：2001-07-05
申请人： Yuzo Mori , Mitsuhiko Shirakashi , Yasushi Toma , Itsuki Kobata , Takayuki Saito
发明人： Yuzo Mori , Mitsuhiko Shirakashi , Yasushi Toma , Itsuki Kobata , Takayuki Saito
IPC分类号： C25F316
摘要： An electrochemical machining apparatus comprises a machining chamber for holding ultrapure water, a cathode/anode immersed in the ultrapure water held in the machining chamber, and a workpiece holding portion for holding a workpiece at a predetermined distance from the cathode/anode so that a surface, to be machined, of the workpiece is brought into contact with the ultrapure water. The electrochemical machining apparatus further comprises an anode/cathode contact brought into contact with the workpiece held by the workpiece holding portion so that the workpiece serves as an anode/cathode, a catalyst having a strongly basic anion exchange function or a strongly acidic cation exchange function, a power source for applying a voltage between the cathode/anode and the workpiece, and a moving mechanism for relatively moving the workpiece and the catalyst. The catalyst is disposed between the cathode/anode and the workpiece held by the workpiece holding portion.
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公开(公告)号：US06602396B2
公开(公告)日：2003-08-05
申请号：US09996674
申请日：2001-11-30
申请人： Yuzo Mori , Mitsuhiko Shirakashi , Takayuki Saito , Yasushi Toma , Akira Fukunaga , Itsuki Kobata
发明人： Yuzo Mori , Mitsuhiko Shirakashi , Takayuki Saito , Yasushi Toma , Akira Fukunaga , Itsuki Kobata
IPC分类号： B23H300
摘要： An anode as a workpiece, and a cathode opposed to the anode with a predetermined spacing are placed in ultrapure water. A catalytic material promoting dissociation of the ultrapure water and having water permeability is disposed between the workpiece and the cathode. A flow of the ultrapure water is formed inside the catalytic material, with a voltage being applied between the workpiece and the cathode, to decompose water molecules in the ultrapure water into hydrogen ions and hydroxide ions, and supply the resulting hydroxide ions to a surface of the workpiece, thereby performing removal processing of or oxide film formation on the workpiece through a chemical dissolution reaction or an oxidation reaction mediated by the hydroxide ions. Thus, clean processing can be performed by use of hydroxide ions in ultrapure water, with no impurities left behind on the processed surface of the workpiece.
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公开(公告)号：US06368493B1
公开(公告)日：2002-04-09
申请号：US09645405
申请日：2000-08-25
申请人： Yuzo Mori , Mitsuhiko Shirakashi , Takayuki Saito , Yasushi Toma , Akira Fukunaga , Itsuki Kobata
发明人： Yuzo Mori , Mitsuhiko Shirakashi , Takayuki Saito , Yasushi Toma , Akira Fukunaga , Itsuki Kobata
IPC分类号： B23H300
摘要： An anode as a workpiece, and a cathode opposed to the anode with a predetermined spacing are placed in ultrapure water. A catalytic material promoting dissociation of the ultrapure water and having water permeability is disposed between the workpiece and the cathode. A flow of the ultrapure water is formed inside the catalytic material, with a voltage being applied between the workpiece and the cathode, to decompose water molecules in the ultrapure water into hydrogen ions and hydroxide ions, and supply the resulting hydroxide ions to a surface of the workpiece, thereby performing removal processing of or oxide film formation on the workpiece through a chemical dissolution reaction or an oxidation reaction mediated by the hydroxide ions. Thus, clean processing can be performed by use of hydroxide ions in ultrapure water, with no impurities left behind on the processed surface of the workpiece.
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公开(公告)号：US07255778B2
公开(公告)日：2007-08-14
申请号：US10828346
申请日：2004-04-21
申请人： Yuzo Mori , Mitsuhiko Shirakashi , Yasushi Toma , Itsuki Kobata , Takayuki Saito
发明人： Yuzo Mori , Mitsuhiko Shirakashi , Yasushi Toma , Itsuki Kobata , Takayuki Saito
摘要： An electrochemical machining apparatus comprises a machining chamber for holding ultrapure water, a cathode/anode immersed in the ultrapure water held in the machining chamber, and a workpiece holding portion for holding a workpiece at a predetermined distance from the cathode/anode so that a surface, to be machined, of the workpiece is brought into contact with the ultrapure water. The electrochemical machining apparatus further comprises an anode/cathode contact brought into contact with the workpiece held by the workpiece holding portion so that the workpiece serves as an anode/cathode, a catalyst having a strongly basic anion exchange function or a strongly acidic cation exchange function, a power source for applying a voltage between the cathode/anode and the workpiece, and a moving mechanism for relatively moving the workpiece and the catalyst. The catalyst is disposed between the cathode/anode and the workpiece held by the workpiece holding portion.
摘要翻译： 电化学加工装置包括用于保持超纯水的加工室，浸没在保持在加工室中的超纯水中的阴极/阳极和用于将工件保持在距离阴极/阳极预定距离的工件保持部分， 被加工的工件与超纯水接触。 电化学加工装置还包括阳极/阴极接触件，其与由工件保持部分保持的工件接触，使得工件用作阳极/阴极，具有强碱性阴离子交换功能或强酸性阳离子交换功能的催化剂 用于在阴极/阳极和工件之间施加电压的电源，以及用于相对移动工件和催化剂的移动机构。 催化剂设置在阴极/阳极和被工件保持部分保持的工件之间。
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公开(公告)号：US20080200100A1
公开(公告)日：2008-08-21
申请号：US11630512
申请日：2006-04-18
申请人： Tamami Takahashi , Mitsuhiko Shirakashi , Kenya Ito , Kazuyuki Inoue , Kenji Yamaguchi , Masaya Seki
发明人： Tamami Takahashi , Mitsuhiko Shirakashi , Kenya Ito , Kazuyuki Inoue , Kenji Yamaguchi , Masaya Seki
IPC分类号： B24B9/06 , H01L21/304 , B24B49/12
CPC分类号： H01L21/67219 , B24B9/065 , B24B49/04 , H01L21/302 , H01L21/461 , H01L21/67253 , H01L21/68707 , H01L21/68728
摘要： A substrate processing apparatus (1) includes first and second polishing units (70A, 70B) for polishing a peripheral portion of a substrate (W), a primary cleaning unit (100) for cleaning the substrate (W), a secondary cleaning and drying unit (110) for drying the substrate (W) cleaned in the primary cleaning unit (100), and a measurement unit (30) for measuring the peripheral portion of the substrate (W). The measurement unit (30) includes a mechanism for measurement required for polishing in the first and second polishing units (70A and 70B), such as a diameter measurement mechanism, a cross-sectional shape measurement mechanism, or a surface condition measurement mechanism.
摘要翻译： 一种基板处理装置（1）包括：用于研磨基板周边部分的第一和第二研磨单元（70A，70B）;用于清洗基板（W）的主清洁单元（100），二次清洗 以及用于干燥在主清洗单元（100）中清洁的基板（W）的干燥单元（110），以及用于测量基板（W）的周边部分的测量单元（30）。 测量单元（30）包括用于在第一和第二研磨单元（70A和70B）中抛光所需的测量机构，例如直径测量机构，横截面形状测量机构或表面状态测量机构 。
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