公开(公告)号：US20140300009A1

公开(公告)日：2014-10-09

申请号：US14084627

申请日：2013-11-20

Applicant: Zhen Ding Technology Co., Ltd.

Inventor： SHIH-PING HSU

IPC: H01L23/49 ,  H01L23/00

CPC classification number: H01L23/49 ,  H01L24/16 ,  H01L24/32 ,  H01L24/43 ,  H01L24/48 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/43 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/83104 ,  H01L2924/00014 ,  H01L2924/181 ,  H05K3/3436 ,  H05K3/4691 ,  H05K2201/10977 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: A package structure includes a flexible-rigid PCB and a chip. The flexible PCB includes a flexible PCB, a glue piece and an outer trace layer. The flexible PCB includes two bending portions and a fixing portion connected between the two bending portions, and includes an insulating layer and an inner trace layer formed on the insulating layer. The glue piece is adhered to the fixing portion. The outer trace layer is adhered to the glue piece and includes conductive pads. The fixing portion, the glue piece and the outer trace layer form a rigid portion, the bending portions form flexible portions. The chip is packaged on the rigid portion and includes electrode pads electrically connected to the conductive pads.

Abstract translation: 封装结构包括柔性刚性PCB和芯片。 柔性PCB包括柔性PCB，胶片和外部迹线层。 柔性PCB包括两个弯曲部分和连接在两个弯曲部分之间的固定部分，并且包括形成在绝缘层上的绝缘层和内部迹线层。 胶片粘附到固定部分。 外部痕迹层粘附到胶合片上并且包括导电垫。 固定部分，胶片和外部迹线层形成刚性部分，弯曲部分形成柔性部分。 芯片被封装在刚性部分上，并且包括电连接到导电焊盘的电极焊盘。

公开(公告)号：US20140061903A1

公开(公告)日：2014-03-06

申请号：US13777043

申请日：2013-02-26

Applicant: HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd. ,  ZHEN DING TECHNOLOGY CO., LTD.

Inventor： CHIEN-CHIH CHEN ,  HONG-XIA SHI ,  SHIH-PING HSU

IPC: H01L23/498 ,  H01L23/00

CPC classification number: H01L25/105 ,  H01L21/4853 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49833 ,  H01L24/11 ,  H01L24/29 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A method for manufacturing a package on package structure includes the steps of: providing a connection substrate comprising a main body and electrically conductive posts, the main body comprising a first surface and an opposite second surface, each electrically conductive post passing through the first and second surfaces, and each end of the two ends of the electrically conductive post protruding from the main body; arranging a first package device on a side of the first surface of the connection substrate, arranging a package adhesive on a side of the second surface of the connection substrate, thereby obtaining a semi-finished package on package structure; and arranging a second package device on a side of the package adhesive furthest from the first package device, thereby obtaining a package on package structure.

Abstract translation: 一种用于制造封装结构上的封装的方法包括以下步骤：提供包括主体和导电柱的连接衬底，所述主体包括第一表面和相对的第二表面，每个导电柱穿过第一和第二表面 表面，并且导电柱的两端的每个端部从主体突出; 在连接基板的第一表面的一侧上布置第一封装器件，在连接衬底的第二表面的一侧上布置封装粘合剂，从而获得封装结构上的半成品封装; 以及在距离所述第一包装装置最远的所述包装粘合剂的一侧布置第二包装装置，从而获得包装结构上的包装。

公开(公告)号：US20140000950A1

公开(公告)日：2014-01-02

申请号：US13925136

申请日：2013-06-24

Applicant: Zhen Ding Technology Co., Ltd.

Inventor： CHE-WEI HSU ,  SHIH-PING HSU

IPC: H05K1/11 ,  H05K3/46

CPC classification number: H05K1/11 ,  H05K3/429 ,  H05K3/4652 ,  Y10T29/49155

Abstract: A method for manufacturing a multi-layer circuit board includes steps of: providing three copper clad laminates; forming trace layers in each copper clad laminate by selectively removing portions of copper layer of each copper clad laminate to obtain three first circuit substrates; laminating a dielectric layer on two of the first circuit substrates to obtain two second circuit substrates; forming a metal bump on the trace layer he other one of the three first circuit substrate to obtain a third circuit substrate; stacking and laminating the third circuit substrate between the two second circuit substrate to obtain a multi-layer circuit board.

Abstract translation: 一种制造多层电路板的方法包括以下步骤：提供三层覆铜层压板; 通过选择性地去除每个覆铜层压板的铜层的部分，在每个覆铜层压板中形成迹线层，以获得三个第一电路基板; 在两个第一电路基板上层叠电介质层以获得两个第二电路基板; 在三个第一电路基板中的另一个上在迹线层上形成金属凸块，以获得第三电路基板; 在第二电路基板之间堆叠和层叠第三电路基板以获得多层电路板。