公开(公告)号：US20070158793A1

公开(公告)日：2007-07-12

申请号：US11309812

申请日：2006-10-02

Applicant: SHIH-LUNG HUANG

Inventor： SHIH-LUNG HUANG

IPC: H01L23/495

CPC classification number: H01L21/6835 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An exemplary carrier structure (20) for carrying workpieces includes a body (23) and an adhesive tape (27). The body defines a receiving hole (21) therethrough for receiving one or more of the workpieces therein. The adhesive tape is attached to one side of the body and covers the receiving hole thereby allowing one or more of the workpieces to be received in the receiving hole and on the adhesive tape.

Abstract translation: 用于承载工件的示例性载体结构（20）包括主体（23）和胶带（27）。 主体限定穿过其中的接收孔（21），用于在其中接收一个或多个工件。 粘合带附着在主体的一侧并覆盖接收孔，从而允许一个或多个工件被容纳在接收孔和胶带上。

公开(公告)号：US20070126915A1

公开(公告)日：2007-06-07

申请号：US11595297

申请日：2006-11-10

Applicant: Steven Webster ,  Ying-Cheng Wu ,  Kun-Hsieh Liu

Inventor： Steven Webster ,  Ying-Cheng Wu ,  Kun-Hsieh Liu

IPC: H04N5/225

CPC classification number: H04N5/2253 ,  H04N5/2254

Abstract: An image sensor chip package method includes the following steps: firstly, a plurality of shaped conductors are provided. Secondly, plastics are injected to partially enclose the conductors, thereby forming a base. Some of the conductors are exposed outside of the base. Thirdly, a ring-like middle portion is further formed on the base by means of injection. The base and the middle portion cooperatively form a space. Fourthly, an image sensor having a plurality of pads is disposed in the space. Fifthly, a number of bonding wires are provided to connect the pads and the conductors. Finally, a cover is secured to the top of the middle portion via an adhesive glue, thereby hermetically sealing the space and allowing light beams to pass therethrough.

Abstract translation: 图像传感器芯片封装方法包括以下步骤：首先，多个形导体。 其次，注射塑料以部分地包封导体，从而形成基底。 一些导体暴露在基部外部。 第三，通过注射在基座上进一步形成环状中间部分。 底座和中间部分协同地形成一个空间。 第四，具有多个焊盘的图像传感器设置在该空间中。 第五，提供多个接合线来连接焊盘和导体。 最后，通过胶粘剂将盖固定到中间部分的顶部，从而气密地密封空间并允许光束通过。

公开(公告)号：US07646429B2

公开(公告)日：2010-01-12

申请号：US11595297

申请日：2006-11-10

Applicant: Steven Webster ,  Ying-Cheng Wu ,  Kun-Hsieh Liu

Inventor： Steven Webster ,  Ying-Cheng Wu ,  Kun-Hsieh Liu

IPC: H04N5/225

CPC classification number: H04N5/2253 ,  H04N5/2254

Abstract: A digital camera module packaging method includes: first, providing a carrier (20) including a base (21) defining a chamber (214) and a lead frame (23). The lead frame has a plurality of conduction pieces (233) embedded in the base. One end of each conduction piece is exposed at one surface of the base, and another end of the conduction piece is exposed at another surface of the base. An image sensor chip (30) with a photosensitive area (301) and a plurality of chip pads (302) is then mounted in the chamber. A plurality of wires (40) is then provided. Each wire electrically connects a corresponding chip pad of the image sensor chip and one exposed end of a corresponding conduction piece of the carrier. A holder (50) is then provided. The carrier is mounted to the holder. Finally, a lens module (70) is mounted on the holder.

Abstract translation: 一种数字照相机模块封装方法，包括：首先，提供一个载体（20），其包括限定腔室（214）和引线框架（23）的底座（21）。 引线框具有嵌入基座中的多个导电片（233）。 每个导电件的一端在基座的一个表面露出，并且导电件的另一端暴露在基座的另一个表面。 然后将具有感光区域（301）和多个芯片焊盘（302）的图像传感器芯片（30）安装在室中。 然后提供多根电线（40）。 每条导线将图像传感器芯片的相应芯片焊盘和载体的相应导电片的一个暴露端部电连接。 然后提供支架（50）。 承载件安装在支架上。 最后，镜头模块（70）安装在支架上。

公开(公告)号：US07614807B2

公开(公告)日：2009-11-10

申请号：US11669373

申请日：2007-01-31

Applicant: Ching-Lung Jao

Inventor： Ching-Lung Jao

IPC: G03B17/00 ,  G03B17/02

CPC classification number: G03B17/28 ,  G02B7/02 ,  G02B13/001 ,  H04N5/2251 ,  H04N5/2257

Abstract: An exemplary camera mechanism (8) includes a lens module (10), an image sensor module (20), an electronic module (30), and a transmission module (40). The image sensor module is mounted under the lens module. The electronic module is mounted to at least one of the lens module and the image sensor module. The transmission module has a main body (41), a first electronic connection end (43) and a second electronic connection end (45). The lens module and the image sensor module are mounted on the main body. The first electronic connection end is formed at a top end of the main body. The second electronic connection end is formed at a bottom end of the main body. The first electronic connection end is electrically connected to the electronic module and to the second electronic connection end, and the second electronic connection end is capable of being electrically connected to a mother board (50).

Abstract translation: 示例性相机机构（8）包括透镜模块（10），图像传感器模块（20），电子模块（30）和传输模块（40）。 图像传感器模块安装在镜头模块下方。 电子模块安装在透镜模块和图像传感器模块中的至少一个上。 传动模块具有主体（41），第一电子连接端（43）和第二电子连接端（45）。 镜头模块和图像传感器模块安装在主体上。 第一电子连接端形成在主体的顶端。 第二电子连接端形成在主体的底端。 第一电子连接端电连接到电子模块和第二电子连接端，并且第二电子连接端能够电连接到母板（50）。

公开(公告)号：US07502183B2

公开(公告)日：2009-03-10

申请号：US11618002

申请日：2006-12-29

Applicant: Ching-Lung Jao ,  Yu-Chieh Cheng

Inventor： Ching-Lung Jao ,  Yu-Chieh Cheng

IPC: G02B7/02 ,  G02B13/16

CPC classification number: G02B7/021 ,  G02B7/022 ,  H04N5/2254 ,  H04N5/2257

Abstract: A camera module (100) includes a lens module (10) and an image sensor (20), wherein the lens module includes a barrel (12), a plurality of lenses (14) and at least one spacer between each two neighboring lenses. The barrel includes an inner wall (122), the lenses and the spacer both are received in the barrel; the image sensor is located on an imaging plane of the plurality of lenses. At least one through slot (18) is defined in at least one item selected from the group consisting of lenses, spacer, and between the lenses and spacer. At least one groove (124) is defined between the inner wall of the barrel and the group consisting of the lenses, spacer and the image sensor. The at least one through slot communicates with at least one groove.

Abstract translation: 相机模块（100）包括透镜模块（10）和图像传感器（20），其中透镜模块包括镜筒（12），多个透镜（14）和每两个相邻透镜之间的至少一个间隔物。 桶包括内壁（122），透镜和间隔件都被容纳在桶中; 图像传感器位于多个透镜的成像平面上。 至少一个通孔（18）被限定在从由透镜，间隔物以及透镜和间隔物之间​​的组中选出的至少一个项目中。 在筒的内壁和由透镜，间隔物和图像传感器组成的组之间限定至少一个凹槽（124）。 所述至少一个通槽与至少一个凹槽连通。

公开(公告)号：US07408205B2

公开(公告)日：2008-08-05

申请号：US11525447

申请日：2006-09-22

Applicant: Steven Webster ,  Ying-Cheng Wu

Inventor： Steven Webster ,  Ying-Cheng Wu

IPC: H01L29/22 ,  H01L33/00 ,  H01L29/227 ,  H01L29/24 ,  H01L23/495 ,  H01L23/02

CPC classification number: H01L27/14618 ,  H01L24/73 ,  H01L27/14625 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15153 ,  H01L2924/15311 ,  H04N5/2257 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A digital camera module (200) includes a carrier (20), an image sensor chip (30), a number of wires (50), a holder (60), and a lens module (70). The carrier includes a base (21) and a leadframe (23) embedded in the base. The base includes a board (211), a sidewall (213) and a cavity (24). The leadframe includes a number of conductive leads (233) spaced from each other. Each lead has a first terminal portion (235), a second terminal portion (236), and an interconnecting portion (237) connecting the first and second terminal portions. The chip is mounted on the carrier, and has an active area (301). The wires electrically connect the chip and the leadframe. The holder is mounted to the carrier to close the cavity. The lens module is received in the holder and guides light to the active area of the chip.

Abstract translation: 数字照相机模块（200）包括载体（20），图像传感器芯片（30），多个电线（50），保持器（60）和透镜模块（70）。 载体包括嵌入基座中的基座（21）和引线框架（23）。 基座包括板（211），侧壁（213）和空腔（24）。 引线框架包括彼此间隔开的多个导电引线（233）。 每个引线具有连接第一和第二端子部分的第一端子部分（235），第二端子部分（236）和互连部分（237）。 芯片安装在载体上，并具有有效区域（301）。 导线将芯片和引线框架电连接。 保持器安装到载体以封闭空腔。 透镜模块被容纳在保持器中并将光引导到芯片的有效区域。

公开(公告)号：US07365421B2

公开(公告)日：2008-04-29

申请号：US11262876

申请日：2005-10-31

Applicant: Steven Webster ,  Ying-Cheng Wu ,  Kun-Hsieh Liu ,  Po-Chih Hsu

Inventor： Steven Webster ,  Ying-Cheng Wu ,  Kun-Hsieh Liu ,  Po-Chih Hsu

IPC: H01L23/12 ,  H01L23/48 ,  H01L23/52

CPC classification number: H01L23/49827 ,  H01L23/055 ,  H01L23/10 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05553 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/16195 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: An IC chip package includes a substrate (2), a chip (5), a plurality of bonding wires (52), and a cover (6). The substrate has a top surface, a receiving chamber (23) having an opening at the top surface, a plurality of solder pads (3) arranged around the top surface and respectively corresponding to the solder pads arranged at a bottom surface opposite to the top surface, and a plurality of vias (4) having conductive material electrically connecting the top solder pads with the bottom solder pads defined therein. The chip is mounted in the receiving chamber, and has a plurality of chip solder pads (51) arranged around a top surface thereof. The bonding wires respectively electrically connect the top solder pads of the substrate with the chip solder pads. The cover is fastened to the top surface of the substrate, and covers the opening.

Abstract translation: IC芯片封装包括基板（2），芯片（5），多个接合线（52）和盖（6）。 衬底具有顶表面，在顶表面具有开口的接收室（23），围绕顶表面布置的多个焊盘（3），并且分别对应于布置在与顶部相对的底表面处的焊盘 表面以及具有导电材料的多个通孔（4），其将顶部焊盘与其中限定的底部焊盘电连接。 芯片安装在接收室中，并且具有围绕其顶表面布置的多个芯片焊盘（51）。 接合线分别将衬底的顶部焊盘与芯片焊盘电连接。 盖被固定到基板的顶表面，并且覆盖开口。

公开(公告)号：US20080023808A1

公开(公告)日：2008-01-31

申请号：US11616835

申请日：2006-12-27

Applicant: CHIH-CHENG WU ,  CHANG-KUO YANG

Inventor： CHIH-CHENG WU ,  CHANG-KUO YANG

IPC: H01L23/02

CPC classification number: H01L27/14618 ,  H01L31/0203 ,  H01L31/02325 ,  H01L2224/48091 ,  H01L2224/8592 ,  H01L2924/00014

Abstract: A digital camera module (10) includes a chip package (20) and a lens module (50) mounted to the chip package. The package includes a carrier (21), a chip (23), a plurality of wires (24), an adhesive (26) and a cover (28). The carrier has a cavity (213) defined therein, an opening defined in a top surface, and a plurality of top contacts (215) arranged on the top surface around the opening. The chip is received in the cavity, and includes an active area (231) and a plurality of pads (233) disposed on a top surface thereof. The wires electrically connect each of the pads to a corresponding top contact of the carrier. The adhesive is applied to a peripheral circumference of the top surface of the chip around the active area. The cover is adhered to the adhesive, and encloses the active area of the chip cooperatively with the adhesive.

Abstract translation: 数字照相机模块（10）包括芯片封装（20）和安装到芯片封装的透镜模块（50）。 该包装包括载体（21），芯片（23），多个电线（24），粘合剂（26）和盖子（28）。 载体具有限定在其中的空腔（213），限定在顶表面中的开口和布置在开口周围的顶表面上的多个顶部触点（215）。 芯片被容纳在空腔中，并且包括设置在其顶表面上的有源区域（231）和多个焊盘（233）。 电线将每个焊盘电连接到载体的对应的顶部触点。 粘合剂被施加到围绕有源区域的芯片的顶表面的周围。 盖子粘附到粘合剂上，并且与粘合剂一起包围芯片的有效区域。

公开(公告)号：US20080023545A1

公开(公告)日：2008-01-31

申请号：US11616832

申请日：2006-12-27

Applicant: CHEN FENG ,  MING LEE

Inventor： CHEN FENG ,  MING LEE

IPC: G06K7/10

CPC classification number: G02B7/02 ,  G02B13/0015 ,  H04N5/2254 ,  H04N5/2257

Abstract: A lens module (200) includes a barrel (20), at least one lens (30) and an image sensing module (40). The lens received in the barrel. The image sensing module is mounted on a mounting end of the barrel and includes an image sensor (41), a top board (42), a carrier with a base board (43), and a filtering film (44). The image sensor is mounted on the base board. The top board is mounted on the carrier to enclose the image sensor. The filtering film is mounted on a surface of the top board.

Abstract translation: 透镜模块（200）包括镜筒（20），至少一个透镜（30）和图像感测模块（40）。 镜头在镜筒里收到。 图像感测模块安装在镜筒的安装端，并且包括图像传感器（41），顶板（42），具有基板（43）的载体和过滤膜（44）。 图像传感器安装在基板上。 顶板安装在载体上以封闭图像传感器。 过滤膜安装在顶板的表面上。

公开(公告)号：US20070236684A1

公开(公告)日：2007-10-11

申请号：US11644272

申请日：2006-12-21

Applicant: Ching-Lung Jao

Inventor： Ching-Lung Jao

IPC: G01B9/00

CPC classification number: G01M11/0214 ,  G01M11/0257

Abstract: A reflection-testing device for reflection testing of a lens module (12) includes a light source (18), which can emit light in an annular pattern, and an image capturer (16). The light source is provided around the top end of the lens module, and the image capturer is provided near the other end of the lens module for receiving an optical signal through the lens module. A reflection testing method is also disclosed.

Abstract translation: 用于透镜模块（12）的反射测试的反射测试装置包括可以发出环形图案的光的光源（18）和图像捕获器（16）。 光源设置在透镜模块的顶端周围，并且图像捕获器设置在透镜模块的另一端附近，用于通过透镜模块接收光信号。 还公开了一种反射测试方法。