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公开(公告)号：US20250140583A1
公开(公告)日：2025-05-01
申请号：US18820118
申请日：2024-08-29
Applicant: AP SYSTEMS INC.
Inventor： Dae Ryong LEE , Sung Chul KIM , Sang Hyun JI , Chang Kyo KIM
IPC: H01L21/67
Abstract: The present disclosure relates to a heater block and an apparatus for heating a substrate having the same, and more particularly, to a heater block having excellent heat dissipation characteristics and capable of precisely controlling a heating temperature, and an apparatus for heating a substrate having the same. A heater block according to an exemplary embodiment includes a cooling plate provided with a cooling passage through which cooling water flows, a plurality of light emitting modules provided on a first surface of the cooling plate to emit light toward an object to be heated, and a plurality of power supply modules provided on a second surface of the cooling plate and electrically connected to the plurality of light emitting modules by passing through the cooling plate to supply power.
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公开(公告)号：US11774370B2
公开(公告)日：2023-10-03
申请号：US17507797
申请日：2021-10-21
Applicant: AP SYSTEMS INC.
Inventor： Yong Soo Moon , Hahn Joo Yoon , Chan Ho Hong , Seung Hwan Lee , Oh Seung Kwon
CPC classification number: G01N21/95 , G01N21/8806 , G01K13/00
Abstract: Provided are an apparatus for processing a substrate and a method for measuring a temperature of the substrate. The apparatus for processing the substrate includes a temperature measurement part and a light-transmitting shield plate. The temperature measurement part includes a light source, a light receiving part configured to receive reflected light reflected by the substrate or the shield plate among the light irradiated from the light source, and a radiant light emitted from the substrate to measure a quantity of the reflected light and an intensity of the radiant light and a temperature calculation part configured to calculate the temperature of the substrate, to which a contamination level of the shield plate is reflected, by using the quantity of the reflected light and the intensity of the radiant light.
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公开(公告)号：US11136670B2
公开(公告)日：2021-10-05
申请号：US15870756
申请日：2018-01-12
Applicant: AP SYSTEMS INC.
Inventor： Sang Hyun Ji , Chang Kyo Kim
IPC: C23C16/455 , C23C16/52 , C23C16/40
Abstract: A gas spraying apparatus according to the embodiment of the present invention includes a spray part disposed and aligned on one side outside a substrate in the width direction of the substrate, and having a plurality of nozzles for spraying gas toward the substrate, and a spray control unit for automatically controlling whether or not each of a plurality of nozzles sprays gas such that a gas density distribution type in the width direction of the substrate becomes a targeted gas density distribution type by the gas sprayed through the plurality of nozzles. Therefore, according to the embodiment of the present invention, it is easy to carry out the process with a plurality of types of process types or a plurality of types of gas density distribution types, and a time for adjusting the open or close operation of the plurality of nozzles can be shortened.
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公开(公告)号：US10985040B2
公开(公告)日：2021-04-20
申请号：US16132218
申请日：2018-09-14
Applicant: AP SYSTEMS INC.
Inventor： Sang Hyun Ji , Yong Soo Moon , Gun Bum Lee
Abstract: A substrate treatment method in accordance with an exemplary embodiment includes: heating a substrate, for a substrate treatment process, so that a temperature of the substrate reaches a target temperature; calculating the temperature of the substrate using a sensor located facing the substrate while heating the substrate; and controlling an operation of a heating part configured to heat the substrate according to the temperature calculated from the calculating the temperature, wherein the calculating the temperature comprises: measuring a total radiant energy (Et) radiated from the substrate using the sensor; calculating a corrected total emissivity (εt0) by applying a correction value for correcting the total emissivity (εt) which is the emissivity of the radiant energy (Et); and calculating the temperature (Ts) of the substrate using the total radiant energy (Et) and the corrected total emissivity (εt0).
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15.发明申请公开(公告)号：US20180202035A1
公开(公告)日：2018-07-19
申请号：US15743944
申请日：2016-08-04
Applicant: AP SYSTEMS INC.
Inventor： Jong-Kab Park , Bo-Ram Kim , Jun-Gyu Hur , Doh-Hoon KIM
IPC: C23C14/04 , B23K26/352
CPC classification number: C23C14/042 , B23K26/352 , G03F7/0957 , G03F7/12 , H01L21/027 , H01L21/0338 , H01L21/31 , H01L51/0011 , Y10S148/143
Abstract: The present invention discloses a method of manufacturing a shadow mask, wherein hybrid processing is used to form a mask pattern on the shadow mask, the method includes: forming a wet-etched pattern by performing wet etching from above a base; and forming a laser-processed pattern that continues from the wet-etched pattern, by performing laser processing from above the base or from below the base on which the wet-etched pattern is formed. The present invention uses hybrid processing including wet etching and laser processing for manufacturing a shadow mask. The method has an effect on solving the productivity degradation of the conventional laser processing and provides a shadow mask with high quality using wet etching.
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Patent Agency Ranking
公开(公告)号：US09568372B2
公开(公告)日：2017-02-14
申请号：US14173795
申请日：2014-02-05
Applicant: AP SYSTEMS INC.
Inventor： Sang Hyun Ji
CPC classification number: G01J5/522 , G01J5/0007 , G01J5/0893
Abstract: Disclosed is a calibrating apparatus which is adapted to remove a measurement deviation of a pyrometer, and more particularly, to an apparatus for calibrating a pyrometer, which calibrates a reference value so as to remove a deviation in a temperature measured in a pyrometer. The apparatus for calibrating a pyrometer includes a blackbody including a radiant space from which radiant energy is radiated, a body housing configured to receive the blackbody therein and including a light output wall having a light output port connected with the radiant space, a light output wall protecting cover comprising a transparent blocking plate disposed at a position opposite to the light output port so as to transmit a long wavelength of approximately 5 μm to approximately 20 μm may and configured to be coupled with the light output wall of the body housing, and a fixing member configured to fix the light output wall protecting cover to the light output wall of the body housing.
Abstract translation: 公开了一种校准装置，其适于去除高温计的测量偏差，更具体地，涉及用于校准高温计的装置，其校准参考值以消除在高温计中测量的温度的偏差。 用于校准高温计的装置包括黑体，其包括辐射能量辐射的辐射空间，被构造为在其中接收黑体的主体壳体，并且包括具有与辐射空间连接的光输出端口的光输出壁，光输出壁 保护盖包括设置在与光输出端口相对的位置处的透明阻挡板，以将大约5μm的长波长传输到大约20μm，并且可以被配置为与主体外壳的光输出壁相连，并且 固定构件，其构造成将光输出壁保护盖固定到主体壳体的光输出壁。
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公开(公告)号：US09431279B2
公开(公告)日：2016-08-30
申请号：US13895331
申请日：2013-05-15
Applicant: AP SYSTEMS INC.
Inventor： Chang-Kyo Kim , Sung-Chul Kim , Chang-Min Kwon , Ki-Nam Kim
CPC classification number: H01L21/67115
Abstract: The present invention relates to a heater block and a substrate treatment apparatus, and more particularly to a heater block to perform heat treatment on a substrate and a substrate treatment apparatus having the same. According to embodiments of the present invention, it is provided a heater block for a substrate treatment apparatus having heating lamps on its one side to transfer heat to a target subjected to heat treatment, the heating lamps having different arrangement patterns in a plurality of regions on said one side.
Abstract translation: 本发明涉及一种加热器块和基板处理装置，更具体地涉及对基板进行热处理的加热器块和具有该加热块的基板处理装置。 根据本发明的实施例，提供了一种用于基板处理装置的加热块，该基板处理装置的一侧具有加热灯，以将热量传递到经受热处理的目标，加热灯在多个区域中具有不同的布置图案 一方说
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公开(公告)号：US09318359B2
公开(公告)日：2016-04-19
申请号：US13886261
申请日：2013-05-02
Applicant: AP SYSTEMS INC.
Inventor： Il-Hwan Lim , Jang-Woo Shim , Chul-Soo Kim , Seung-Ae Choi
CPC classification number: H01L21/67115 , F27B17/0025 , H05B3/0047
Abstract: The present invention relates to an apparatus for heat-treating a substrate, and more particularly to an apparatus for substrate treatment to perform a heat treatment of a substrate for a flat panel display panel.An apparatus for substrate treatment according to an embodiment of the present invention comprises a processing chamber having a substrate treatment space; a heating housing having a heating lamp that emits radiant energy and a reflecting block that reflects radiant energy emitted from the heating lamp; and a window that maintains a sealing between the processing chamber and the heating housing and transmits the radiant energy to a substrate.
Abstract translation: 本发明涉及一种用于对基板进行热处理的装置，更具体地涉及用于对平板显示面板进行基板的热处理的基板处理装置。 根据本发明的实施例的用于基板处理的装置包括具有基板处理空间的处理室; 具有发射辐射能的加热灯的加热壳体和反射从加热灯发出的辐射能的反射块; 以及在处理室和加热壳体之间保持密封并将辐射能传递到基板的窗口。
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公开(公告)号：US20140345646A1
公开(公告)日：2014-11-27
申请号：US14255557
申请日：2014-04-17
Applicant: AP Systems Inc.
Inventor： Sung Ho Kwak , Min Young Cho
CPC classification number: G03F1/82 , B08B7/0042
Abstract: This invention relates to an apparatus and method for cleaning a photomask. This apparatus, suitable for use in removing an adhesive residue from a photomask, includes a photomask disposed such that a surface thereof on which an adhesive residue is left behind is directed downwards, a metal plate formed adjacent to the adhesive residue, and a laser generator for irradiating a laser onto the metal plate so that the adhesive residue is removed by heat generated from the metal plate.
Abstract translation: 本发明涉及一种清洁光掩模的装置和方法。 适用于从光掩模中去除粘合剂残留物的该装置包括光掩模，该光掩模被设置为使得其上残留有粘合剂残留物的表面向下指向，邻近粘合残渣形成的金属板，以及激光发生器 用于将激光照射到金属板上，使得通过从金属板产生的热量去除粘合剂残留物。
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公开(公告)号：US20250076906A1
公开(公告)日：2025-03-06
申请号：US18803348
申请日：2024-08-13
Applicant: AP SYSTEMS INC.
Inventor： Sang Hyun JI , Dae Ryong LEE , Yong Soo MOON
Abstract: The present disclosure relates to a power control device for temperature control capable of phase control compensation according to power fluctuations, a thermal processing system having the same, and a temperature control method for the thermal processing system. The power control device for temperature control includes a power control unit configured to control an amount of power supplied to a heating source by controlling a phase of AC power supplied from a power source and a power measurement unit connected to the power source and configured to measure the AC power, wherein the power control unit controls the phase of the AC power by compensating a phase angle according to a difference between a reference power value and the measured value measured by the power measurement unit.
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