Abstract:
A connection unit for electrically connecting a DUT mounting board, on which an IC socket is mounted, with a testing apparatus for testing an electronic device inserted into the IC socket, the connection unit has a holding substrate provided to face the DUT mounting board and a connection-unit-side connector, which is provided on the holding substrate to be able to change a position of the connection-unit-side connector on the holding substrate, for being connected to a performance-board-side connector included in the DUT mounting board.
Abstract:
A scanning electron microscope with a length measurement function includes an electron gun for emitting an electron beam, a measurement target region setting unit for setting a measurement region for a pattern formed on a sample, a storing unit for storing the designated measurement region, a beam blanker unit for controlling an irradiation of the electron beam depending on the measurement region, and a control unit for extracting the designated measurement region from the storing unit, interrupting the electron beam with the beam blanker unit in a region other than the measurement region, irradiating the electron beam onto the sample in the measurement region, capturing an image of the measurement region, and measuring the pattern. The measurement region may be a pair of regions having the same areas as each other.
Abstract:
A single balanced mixer has a high degree of isolation between an IF signal and an RF signal and a high conversion efficiency. The single balanced mixer includes means for producing two local signals of same amplitude and opposite phase, a pair of mixing elements each receiving a corresponding one of the two local signals, a pair of strip lines for transmitting the input RF signal to the mixing elements. One end of each of the strip lines is connected to one another at a point where the RF signal is supplied and other end of each of the strip lines is connected to the corresponding mixing element. A length of each of the strip lines is one fourth of a wave length of the IF signal.
Abstract:
An electron-beam size measuring apparatus includes: electron beam irradiating means that irradiates an electron beam on a surface of a sample; detection means that detects electrons emitted from the sample; distance measurement means that measures the distance between the sample and a secondary electron control electrode of the detection means; a stage on which the sample is mounted; and control means which adjusts the height of the stage so that the distance measured by the distance measurement means would be equal to a predetermined fixed distance, which applies a control voltage to the secondary electron control electrode of the detection means, the control voltage predetermined so as to allow the sample surface potential to become constant with the sample positioned at the fixed distance, and which causes the electron beam to be irradiated by applying a predetermined accelerating voltage. The stage may include holding means that does not electrically connect the sample thereto, and moving means that moves the sample up and down.
Abstract:
A connection unit for electrically connecting a DUT mounting board, on which an IC socket is mounted, with a testing apparatus for testing an electronic device inserted into the IC socket, the connection unit has a holding substrate provided to face the DUT mounting board and a connection-unit-side connector, which is provided on the holding substrate to be able to change a position of the connection-unit-side connector on the holding substrate, for being connected to a performance-board-side connector included in the DUT mounting board.
Abstract:
In a tentative target value calculation section 28, a predetermined value is subtracted from (or added to) a target value Exp to calculate a tentative target value ExpB. In a binary search executing section 25, binary search is executed, and a searching region is limited to a certain region including this tentative target value ExpB. Next, in a sequential search executing section 29, the target value Exp is searched for in an increasing direction from the tentative target value ExpB which is a start point in the limited searching region. Accordingly, both drop prevention of measurement precision and reduction of searching time are achieved consistently, and a target value is securely and normally found in a case where a sequence constituting a searching object indicates an ascending-order sequence including a decrease in a part.
Abstract:
A probe card on which micro probe needles are arranged at high density and with high precision without need of a complicated structure or variation in needle height. A probe card 1 installed in a wafer tester includes a board 2 having a wiring pattern for transmitting a test signal to be impressed on a wafer under test, a built-up board 10 formed on the surface of the board 2, a comb-shaped silicon-made probe needle 20 arranged on the built-up board 10 and connected to the surface wiring pattern 11, and a flat portion 12 formed by plating on the surface wiring pattern 11 on the built-up board 10 and having a surface flattened by polishing. The probe needle 20 is loaded on the flat portion 12 and thus mounted on the board 2.
Abstract:
An electron-beam exposure system includes: density-per-area map generating means configured to divide a certain area on which an electron beam is irradiated into meshes, to figure out a ratio of an area of patterns to be irradiated on each divided region to an area of the divided region, thus to generate a density-per-area map; and proximity-effect correcting means configured to correct exposure of the electron beam by referring to the density-per-area map. The proximity-effect correcting means includes: product-sum arithmetic means which is configured to perform product-sum arithmetic on two-dimensional array data, and addition means which is configured to perform addition arithmetic on the two-dimensional array data; stores, in a first memory, two-dimensional array data on the density per area of the patterns; performs the product-sum arithmetic and the addition a predetermined number of times, and thus calculates the two-dimensional array data on the density per area by a linear conversion; and uses the resultant data as two-dimensional array data on exposure to be used for correcting a proximity effect.
Abstract:
Good device PASS/FAIL determination is realized by measuring timings of a cross point of differential clock signals CLK and a data signal DATA output from a DUT, and obtaining a relative phase difference between both signals. A semiconductor test apparatus comprises differential signal timing measurement means for outputting cross point information Tcross obtained by a timing of a cross point of one of differential signals, non-differential signal timing measurement means for outputting data change point information Tdata obtained by a timing of transition of a logic of the other non-differential signal output, phase difference calculation means for outputting a phase difference ΔT between the cross point information Tcross and the data change point information Tdata, and PASS/FAIL determination means for determining PASS/FAIL of a relative positional relationship of the DUT based on a predetermined threshold value.
Abstract:
A characteristic test of a DUT having a low transmission line driving capability can be performed with a simple configuration and low cost. An impedance matching circuit is connected between a transmission line and a DUT in an input-output circuit of a semiconductor test apparatus. The impedance matching circuit includes: a resistance; an analog computing unit which multiplies a voltage from one end of the resistance by a predetermined number, subtracts a voltage from the other end of the resistance from the voltage multiplied by the predetermined number and outputs a resultant voltage; and a buffer which outputs a signal from the analog computing unit with low impedance. The impedance matching circuit produces an output signal from the DUT with low impedance, thereby sufficiently driving the transmission line.