公开(公告)号：US11156640B2

公开(公告)日：2021-10-26

申请号：US16175341

申请日：2018-10-30

Applicant: FormFactor, Inc.

Inventor： Mukesh Selvaraj ,  January Kister

IPC: G01R1/073 ,  G01R1/067 ,  G01R3/00

Abstract: Probes are connected to the space transformer via multiple carrier plates. Electrical contacts from the probes to the space transformer are by way of spring tail features on the probes that connect to the space transformer and not to the carrier plates. In other words, the carrier plates are purely mechanical in function. This configuration can significantly reduce probe array fabrication time relative to sequential placement of individual probes on the space transformer. Multiple probe carrier plates can be populated with probes in parallel, and the final sequential assembly of carrier plates onto the space transformer has a greatly reduced operation count. Deviations of the space transformer from flatness can be compensated for.

公开(公告)号：US11047879B2

公开(公告)日：2021-06-29

申请号：US16600142

申请日：2019-10-11

Applicant: FormFactor, Inc.

Inventor： Gavin Neil Fisher ,  Thomas Reiner Thaerigen ,  Peter McCann ,  Rodney Jones ,  Koby L. Duckworth

IPC: G01R31/01 ,  G01R1/067 ,  G01R35/00 ,  G01R31/28 ,  G01R1/073

Abstract: Probe systems and methods are disclosed herein. The methods include directly measuring a distance between a first manipulated assembly and a second manipulated assembly, contacting first and second probes with first and second contact locations, providing a test signal to an electrical structure, and receiving a resultant signal from the electrical structure. The methods further include characterizing at least one of a probe system and the electrical structure based upon the distance. In one embodiment, the probe systems include a measurement device configured to directly measure a distance between a first manipulated assembly and a second manipulated assembly. In another embodiment, the probe systems include a probe head assembly including a platen, a manipulator operatively attached to the platen, a vector network analyzer (VNA) extender operatively attached to the manipulator, and a probe operatively attached to the VNA extender.

公开(公告)号：US20210190860A1

公开(公告)日：2021-06-24

申请号：US17111283

申请日：2020-12-03

Applicant: FormFactor, Inc.

Inventor： Masahiro Sameshima

IPC: G01R31/28 ,  G01R31/319 ,  G01R1/44

Abstract: Double-sided probe systems with thermal control systems and related methods. Thermally-controlled, double-sided probe systems include a probe assembly configured to test one or more devices under test (DUTs) of a substrate and a chuck configured to support the substrate. The probe assembly includes a thermal control system configured to at least partially control a substrate temperature of the substrate while the probe assembly tests the DUT(s). The chuck is configured to support the substrate such that the probe assembly has access to each of a first substrate side of the substrate and a second substrate side of the substrate while the substrate is operatively supported by the chuck. In some examples, methods of operating double-sided probe systems include regulating the substrate temperature with the thermal control system.

公开(公告)号：US10266402B2

公开(公告)日：2019-04-23

申请号：US13681967

申请日：2012-11-20

Applicant: FormFactor, Inc.

Inventor： Onnik Yaglioglu ,  Benjamin N. Eldridge ,  Alexander Slocum

IPC: B82Y30/00 ,  G01R1/067 ,  G01Q70/12 ,  G01R1/073

Abstract: Electrically conductive columns of intertwined carbon nanotubes embedded in a mass of material flexible, resilient electrically insulating material can be used as electrically conductive contact probes. The columns can extend between opposing sides of the mass of material. Terminals of a wiring substrate can extend into the columns and be electrically connected to an electrical interface to a tester that controls testing of a device under test. A pair of physically interlocked structures can coupling the mass of material to the wiring substrate. The pair can include a receptacle and a protrusion.

公开(公告)号：US10132833B2

公开(公告)日：2018-11-20

申请号：US14327254

申请日：2014-07-09

Applicant: FormFactor, Inc.

Inventor： Benjamin N. Eldridge

IPC: G01R1/06 ,  G01R1/067

Abstract: A multiple conduction path probe can provide an electrically conductive signal path from a first contact end to a second contact end. The probe can also include an electrically conductive secondary path and an electrically insulated gap between the signal path and the secondary path. A probe assembly can comprise multiple such probes disposed in passages in substantially parallel electrically conductive guide plates. In some configurations, the probe assembly can include one or more secondary probes disposed in passages of the conductive guide plates and electrically connected to one or both of the guide plates. Some of the probes can be electrically insulated from the guide plates and thus provide signal paths, and others of the probes can be electrically connected to the guide plates and thus provide secondary paths.

公开(公告)号：US09037432B2

公开(公告)日：2015-05-19

申请号：US13418532

申请日：2012-03-13

Applicant: Susumu Kaneko

Inventor： Susumu Kaneko

IPC: G01R31/00 ,  G01R31/302 ,  G01R1/073 ,  G01R31/28

CPC classification number: G01R31/3025 ,  G01R1/07378 ,  G01R31/2889

Abstract: A probe card assembly can include a wireless link to an external verifier (e.g., debugger). The wireless link can interface to a boundary scan interface of a controller on the probe card assembly. The wireless link can allow for verification of the probe card assembly while it is installed within a prober.

Abstract translation: 探针卡组件可以包括到外部验证器（例如，调试器）的无线链路。 无线链路可以连接到探针卡组件上的控制器的边界扫描接口。 无线链路可以允许探测卡组件在安装在探测器中时进行验证。

公开(公告)号：US08513965B2

公开(公告)日：2013-08-20

申请号：US12938164

申请日：2010-11-02

Applicant: Keith J. Breinlinger

Inventor： Keith J. Breinlinger

IPC: G01R31/20

CPC classification number: G01R31/2891

Abstract: A probe card assembly can comprise a first source of compliance and a second source of compliance. The probe card assembly can further comprise a controller, which can be configured to apportion a total compliance demand placed on the probe card assembly between the first source of compliance and the second source of compliance.

Abstract translation: 探针卡组件可以包括第一顺应源和第二顺应源。 探针卡组件还可以包括控制器，其可以被配置为在第一合格源和第二符合源之间分配放置在探针卡组件上的总顺从性要求。

公开(公告)号：USRE44407E1

公开(公告)日：2013-08-06

申请号：US12646661

申请日：2009-12-23

Applicant: January Kister

Inventor： January Kister

IPC: G01R31/20

CPC classification number: G01R1/07378 ,  G01R1/07357

Abstract: Method and apparatus for electrical testing of a device under test (DUT) that employs a connection board with signal contacts for applying test signals and a space transformer that has low pitch contacts arranged on one or more circumferential shelves that define an enclosure in the space transformer. The apparatus has a substrate with fine pitch contacts positioned such that these are within the enclosure. A set of wire bonds is used for pitch reduction by interconnecting the fine pitch contacts with the low pitch contacts arranged on the shelves. The probes are connected to the fine pitch contacts and are used to apply the test signals to a DUT by contacting its pads. In some embodiments, the fine pitch contacts may be embodied by plugs or by blind metal vias.

Abstract translation: 一种用于对被测设备（DUT）进行电气测试的方法和装置，该设备采用具有用于施加测试信号的信号触点的连接板和具有低间距触点的空间变压器，所述空间变压器布置在定义空间变压器中的外壳的一个或多个周向架上 。 该装置具有定位为使得它们在外壳内的细间距触点的基板。 通过将细间距触点与布置在搁架上的低音调触点相互连接，一组引线键被用于降低音调。 探头连接到细间距触点，并用于通过接触其焊盘将测试信号施加到DUT。 在一些实施例中，细间距触点可以由插头或盲金属通孔来实现。

公开(公告)号：US20130093450A1

公开(公告)日：2013-04-18

申请号：US13693971

申请日：2012-12-04

Applicant: FormFactor, Inc.

Inventor： January Kister

IPC: G01R1/073

CPC classification number: G01R1/07307 ,  G01R1/06733

Abstract: Improved probing of closely spaced contact pads is provided by an array of vertical probes having all of the probe tips aligned along a single contact line, while the probe bases are arranged in an array having two or more rows parallel to the contact line. With this arrangement of probes, the probe base thickness can be made greater than the contact pad spacing along the contact line, thereby advantageously increasing the lateral stiffness of the probes. The probe tip thickness is less than the contact pad spacing, so probes suitable for practicing the invention have a wide base section and a narrow tip section.

Abstract translation: 通过具有所有探针尖端沿着单个接触线对准的垂直探针的阵列提供紧密间隔的接触垫的改进的探测，而探针基底布置成平行于接触线的两行或更多行的阵列。 利用这种探针的布置，可以使探针基底厚度大于沿着接触线的接触垫间距，从而有利地增加探针的横向刚度。 探针尖端厚度小于接触垫间距，因此适用于实施本发明的探针具有宽的基部和窄的尖端部分。

公开(公告)号：US20130082729A1

公开(公告)日：2013-04-04

申请号：US13250756

申请日：2011-09-30

Applicant: Li Fan ,  Rui Xu

Inventor： Li Fan ,  Rui Xu

IPC: G01R1/067

CPC classification number: G01R1/06727 ,  G01R1/06744

Abstract: An electrically conductive probe can comprise a post to which a beam structure is attached. The beam structure can comprise a cantilevered portion that extends away from the post to a free end to which a contact structure can be attached. The cantilevered portion of the beam can include both a solid section and a hollow section. Multiple such probes can be used in a test contactor to make electrical connections with an electronic device such as a semiconductor die or dies to be tested.

Abstract translation: 导电探针可以包括梁结构附接到的柱。 梁结构可以包括悬臂部分，该悬臂部分从支柱延伸到可以连接接触结构的自由端。 梁的悬臂部分可以包括固体部分和中空部分。 多个这样的探针可以用于测试接触器中，以与电子设备（例如半导体管芯或要测试的管芯）形成电连接。