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公开(公告)号：US20230304181A1
公开(公告)日：2023-09-28
申请号：US18159343
申请日：2023-01-25
Applicant: Rohm and Haas Electronic Materials LLC
Inventor： Anne Hickey , Kristen M. Griffin
Abstract: A method of inhibiting tarnish formation of silver or silver alloy and corrosion of gold or gold alloy by applying a thin coating of bismuth on the silver, silver alloy, gold or gold alloy. The thin bismuth coating does not compromise the electrical performance of the silver, silver alloy, gold or gold alloy even after thermal aging.
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公开(公告)号：US11754927B2
公开(公告)日：2023-09-12
申请号：US16871228
申请日：2020-05-11
Applicant: Rohm and Haas Electronic Materials LLC
Inventor： Irvinder Kaur , Colin Liu , Xisen Hou , Kevin Rowell , Mingqi Li , Cheng-Bai Xu
IPC: G03F7/38 , G03F7/40 , C07C309/28 , H01L21/311 , H01L21/027 , C07C309/01 , C07C309/39
CPC classification number: G03F7/38 , C07C309/01 , C07C309/28 , C07C309/39 , G03F7/40 , H01L21/0273 , H01L21/31138
Abstract: Photoresist pattern trimming compositions comprise a polymer, an aromatic sulfonic acid, and an organic-based solvent system, wherein the aromatic sulfonic acid is of general formula (I):
wherein: Ar1 represents an aromatic group; R1 independently represents a halogen atom, hydroxy, substituted or unsubstituted alkyl, substituted or unsubstituted heteroalkyl, substituted or unsubstituted carbocyclic aryl, substituted or unsubstituted heterocyclic aryl, substituted or unsubstituted alkoxy, or a combination thereof, wherein adjacent R1 groups together optionally form a fused ring structure with Ar1; a represents an integer of 2 or more; and b represents an integer of 1 or more, provided that a+b is at least 3 and is not greater than the total number of available aromatic carbon atoms of Ar1, and two or more of R1 are independently a fluorine atom or a fluoroalkyl group bonded directly to an aromatic ring carbon atom.-
公开(公告)号：US11746184B2
公开(公告)日：2023-09-05
申请号：US17088817
申请日：2020-11-04
Applicant: Rohm and Haas Electronic Materials LLC
Inventor： Aaron A. Rachford , Charles R. Kinzie , Michael K. Gallagher , Christopher Gilmore , Young-Seok Kim
IPC: C08G61/12 , C07D403/10 , C07D487/04 , C07D495/14 , C07D498/04
CPC classification number: C08G61/124 , C07D403/10 , C07D487/04 , C07D495/14 , C07D498/04
Abstract: Disclosed is a bis-imide compound comprising two or more aryl moieties substituted with ethynyl moieties and the two or more aryl moieties each having one or more polar substituents. Further disclosed is a polymer composition comprising a copolymer polymerized from a monomer mixture of (a) one or more first monomers comprising a bis-imide compound comprising two or more aryl moieties substituted with ethynyl moieties and the two or more aryl moieties each having one or more polar substituents; and (b) one or more second monomers comprising two or more cyclopentadienone moieties. The polymer compositions exhibit favorable properties for use in electronics and displays applications.
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14.发明公开公开(公告)号：US20230160085A1
公开(公告)日：2023-05-25
申请号：US18153099
申请日：2023-01-11
Applicant: Rohm and Haas Electronic Materials LLC
Inventor： Youngmin Yoon , Miguel A. Rodriguez , Michael Lipschutz , Jamie Y. C. Chen , Kristen Griffin
IPC: C25D3/46
CPC classification number: C25D3/46
Abstract: Silver electroplating compositions deposit silver with low coefficients of friction on substrates, such as nickel, copper and copper alloys. The silver deposits have coefficients of friction of less than or equal to 1 in contrast to many conventional silver deposits which typically have coefficients of friction greater than 1, such as 1.5. The silver deposits also have improved wear resistance in contrast to silver deposited from many conventional silver electroplating baths. The low coefficients of friction and improved wear resistance of silver deposited from the silver electroplating compositions is especially suitable for connectors and electronics finishes. Preferably, the silver electroplating compositions are cyanide-free silver electroplating compositions.
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公开(公告)号：US20230124713A1
公开(公告)日：2023-04-20
申请号：US17504019
申请日：2021-10-18
Inventor： Michael MULZER , Kenneth HERNANDEZ , Andrew STELLA , Lujia BU , Jieqian ZHANG , Deyan WANG , Yinjie CEN
IPC: C09D133/08
Abstract: Disclosed is an actinic radiation curable (meth)acrylic composition for use in hardcoats for optical displays containing one or more multifunctional (meth)acrylate monomers, one or more Si-containing (meth)acrylate monomers, one or more UV radical initiators, one or more monomers to improve surface cure, nanoparticles, and one or more organic solvents. Coated hardcoat articles made from this composition exhibit improved properties for use in display applications.
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Patent Agency Ranking
16.发明授权公开(公告)号：US11578418B2
公开(公告)日：2023-02-14
申请号：US17592056
申请日：2022-02-03
Applicant: Rohm and Haas Electronic Materials LLC
Inventor： Youngmin Yoon , Miguel A. Rodriguez , Michael Lipschutz , Jamie Y. C. Chen , Kristen Griffin
IPC: C25D3/46
Abstract: Silver electroplating compositions deposit silver with low coefficients of friction on substrates, such as nickel, copper and copper alloys. The silver deposits have coefficients of friction of less than or equal to 1 in contrast to many conventional silver deposits which typically have coefficients of friction greater than 1, such as 1.5. The silver deposits also have improved wear resistance in contrast to silver deposited from many conventional silver electroplating baths. The low coefficients of friction and improved wear resistance of silver deposited from the silver electroplating compositions is especially suitable for connectors and electronics finishes. Preferably, the silver electroplating compositions are cyanide-free silver electroplating compositions.
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公开(公告)号：US11550217B2
公开(公告)日：2023-01-10
申请号：US15387788
申请日：2016-12-22
Applicant: ROHM AND HAAS ELECTRONIC MATERIALS LLC
Inventor： Emad Aqad , William Williams, III , James F. Cameron
IPC: G03F7/04 , G03F7/09 , G03F7/38 , G03F7/40 , C07C321/28 , C07C25/18 , G03F7/004 , G03F7/039 , C07C255/24 , C07C381/12 , C07C255/31 , C07C255/34 , G03F7/038 , G03F7/16 , G03F7/20 , G03F7/32 , C07C303/32
Abstract: A photoresist composition, including an acid-sensitive polymer and photoacid generator compound having Formula (I): wherein, EWG, Y, R, and M+ are the same as described in the specification.
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公开(公告)号：US20220214619A1
公开(公告)日：2022-07-07
申请号：US17564462
申请日：2021-12-29
Inventor： Joshua Kaitz , Brian Malbrecht , Deyan Wang , Michael Henry Howard, JR.
Abstract: A topcoat composition, comprising a polymer comprising a repeating unit derived from one or more monomers of formula (1); and a solvent, wherein Z1, Z2, R1, R2, and L are as described herein, and P is a polymerizable group.
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公开(公告)号：US20220204760A1
公开(公告)日：2022-06-30
申请号：US17139269
申请日：2020-12-31
Applicant: Rohm and Haas Electronic Materials LLC
Inventor： Mingqi Li , Irvinder Kaur
Abstract: Disclosed herein is a copolymer comprising first polymerized units of the formula (1); wherein: R1 is H or a substituted or unsubstituted C1-C6 alkyl group; and R2 is a substituted or unsubstituted C3-C20 alkyl group that optionally includes one or more of —O—, —S—, —N—, —C(O)—, or —C(O)O—, —N—C(O)—, —C(O)—NR—; wherein R is H or a substituted or unsubstituted C1-C6 alkyl group; and
second polymerized units of the formula (2): wherein: R3 is a substituted or unsubstituted C1-C6 alkyl group that optionally includes one or more of —O—, —N—, —S—, —C(O)—, or —C(O)O—; wherein the first polymerized units and the second polymerized units are chemically different, and the copolymer is free of fluorine.-
公开(公告)号：US11370964B2
公开(公告)日：2022-06-28
申请号：US16311254
申请日：2017-06-22
Applicant: Rohm and Haas Electronic Materials LLC
Inventor： Jaebum Joo , James C. Taylor , Tanya Singh-Rachford
Abstract: A polymer composite comprising: (a) quantum dots; (b) polymerized units of a compound of formula (I) wherein R1 is hydrogen or methyl and R2 is a C6-C20 aliphatic polycyclic substituent; and (c) a light stabilizer compound comprising two 1-alkyloxy-2,2,6,6-tetramethyl-4-piperidinyl substituents.
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