公开(公告)号：US20100112809A1

公开(公告)日：2010-05-06

申请号：US11636264

申请日：2006-12-07

Applicant: Pavel Kornilovich ,  Yong Chen ,  Duncan Stewart ,  R. Stanley Williams ,  Philip J. Kuekes ,  Mehmet Fatih Yanik

Inventor： Pavel Kornilovich ,  Yong Chen ,  Duncan Stewart ,  R. Stanley Williams ,  Philip J. Kuekes ,  Mehmet Fatih Yanik

IPC: H01L21/768

CPC classification number: H01L21/76838 ,  B81C99/009 ,  B81C2201/0153 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002

Abstract: A mold with a protruding pattern is provided that is pressed into a thin polymer film via an imprinting process. Controlled connections between nanowires and microwires and other lithographically-made elements of electronic circuitry are provided. An imprint stamp is configured to form arrays of approximately parallel nanowires which have (1) micro dimensions in the X direction, (2) nano dimensions and nano spacing in the Y direction, and three or more distinct heights in the Z direction. The stamp thus formed can be used to connect specific individual nanowires to specific microscopic regions of microscopic wires or pads. The protruding pattern in the mold creates recesses in the thin polymer film, so the polymer layer acquires the reverse of the pattern on the mold. After the mold is removed, the film is processed such that the polymer pattern can be transferred on a metal/semiconductor pattern on the substrate.

Abstract translation: 提供具有突出图案的模具，其通过压印过程被压入薄聚合物膜。 提供了纳米线和微丝之间的控制连接以及电子电路的其它光刻元件。 打印印记被配置成形成大致平行的纳米线的阵列，其具有（1）X方向上的微尺寸，（2）在Y方向上的纳米尺寸和纳米间距，以及Z方向上的三个或更多个不同的高度。 如此形成的印章可以用于将特定的单个纳米线连接到微细线或垫的特定微观区域。 模具中的突出图案在薄聚合物膜中产生凹陷，因此聚合物层获得模具上图案的相反。 在除去模具之后，处理膜，使得聚合物图案可以在基底上的金属/半导体图案上转印。

公开(公告)号：US20090047478A1

公开(公告)日：2009-02-19

申请号：US12083829

申请日：2005-10-20

Applicant: Fengxiang Zhang ,  Hong Yee Low

Inventor： Fengxiang Zhang ,  Hong Yee Low

IPC: B32B3/00 ,  B28B11/08

CPC classification number: B29C59/02 ,  B81C99/0085 ,  B81C2201/0153 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  Y10T428/24479

Abstract: A method for forming hierarchical patterns on an article by nanoimprinting is disclosed. The method includes using a first mould to form a primary pattern on the article at a first temperature and a first pressure, the first temperature and the first pressure being able to reduce the elastic modulus of the article; and using a second mould to form a second pattern on the primary pattern at a second temperature that is below the article's glass transition temperature, the forming of the second pattern being at a second pressure.

Abstract translation: 公开了一种通过纳米压印在文章上形成分层图案的方法。 该方法包括使用第一模具在第一温度和第一压力下在制品上形成主要图案，第一温度和第一压力能够降低制品的弹性模量; 并且使用第二模具在低于制品的玻璃化转变温度的第二温度下在初级图案上形成第二图案，第二图案的形成处于第二压力。

公开(公告)号：US20090039563A1

公开(公告)日：2009-02-12

申请号：US12065246

申请日：2006-08-25

Applicant: Motoki Okinaka ,  Kazuhito Tsukagoshi ,  Yoshinobu Aoyagi

Inventor： Motoki Okinaka ,  Kazuhito Tsukagoshi ,  Yoshinobu Aoyagi

IPC: B29C59/16

CPC classification number: G03F7/0002 ,  B81C1/00031 ,  B81C1/00111 ,  B81C2201/0152 ,  B81C2201/0153 ,  B82Y10/00 ,  B82Y40/00 ,  H01L21/31 ,  H01L21/3121 ,  H01L21/316 ,  H01L21/76817

Abstract: A method of fine-pattern formation in which in forming a pattern, a fine pattern formed in a mold can be transferred to a pattering material in a short time at a low temperature and low pressure and, after the transfer of the fine pattern to the patterning material, the fine pattern formed in the patterning material does not readily deform. The method for fine-pattern formation comprises: a first step in which a mold having a fine structure with recesses/protrusions is pressed against a pattering material comprising a polysilane; a second step in which the patterning material is irradiated with ultraviolet to photooxidize the patterning material; a third in which the pressing of the mold against the patterning material is relieved and the mold is drawn from the pattering material; and a fourth step in which that surface of the patterning material to which the fine pattern has been transferred is irradiated with an oxygen plasma to oxidize the surface.

Abstract translation: 精细图案形成方法在形成图案时，在模具中形成的精细图案可以在低温低压下在短时间内转印到图案材料，并且在精细图案转印到 图案形成材料中形成的微细图案不容易变形。 精细图案形成方法包括：第一步骤，其中具有凹陷/突起的精细结构的模具被压在包含聚硅烷的图案材料上; 第二步骤，其中图案形成材料被紫外线照射以对图案材料进行光氧化; 第三，其中将模具压靠在图案形成材料上被释放并且模具从图案材料中拉出; 以及第四步骤，其中已经转印有精细图案的图案形成材料的表面用氧等离子体照射以氧化该表面。

公开(公告)号：US07256435B1

公开(公告)日：2007-08-14

申请号：US10453329

申请日：2003-06-02

Applicant: Pavel Kornilovich ,  Yong Chen ,  Duncan Stewart ,  R. Stanley Williams ,  Philip J. Kuekes ,  Mehmet Fatih Yanik

Inventor： Pavel Kornilovich ,  Yong Chen ,  Duncan Stewart ,  R. Stanley Williams ,  Philip J. Kuekes ,  Mehmet Fatih Yanik

IPC: H01L27/10

CPC classification number: H01L21/76838 ,  B81C99/009 ,  B81C2201/0153 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002

Abstract: A mold with a protruding pattern is provided that is pressed into a thin polymer film via an imprinting process. Controlled connections between nanowires and microwires and other lithographically-made elements of electronic circuitry are provided. An imprint stamp is configured to form arrays of approximately parallel nanowires which have (1) micro dimensions in the X direction, (2) nano dimensions and nano spacing in the Y direction, and three or more distinct heights in the Z direction. The stamp thus formed can be used to connect specific individual nanowires to specific microscopic regions of microscopic wires or pads. The protruding pattern in the mold creates recesses in the thin polymer film, so the polymer layer acquires the reverse of the pattern on the mold. After the mold is removed, the film is processed such that the polymer pattern can be transferred on a metal/semiconductor pattern on the substrate.

Abstract translation: 提供具有突出图案的模具，其通过压印过程被压入薄聚合物膜。 提供了纳米线和微丝之间的控制连接以及电子电路的其它光刻元件。 打印印记被配置成形成大致平行的纳米线的阵列，其具有（1）X方向上的微尺寸，（2）在Y方向上的纳米尺寸和纳米间距，以及Z方向上的三个或更多个不同的高度。 如此形成的印章可以用于将特定的单个纳米线连接到微细线或垫的特定微观区域。 模具中的突出图案在薄聚合物膜中产生凹陷，因此聚合物层获得模具上图案的相反。 在除去模具之后，处理膜，使得聚合物图案可以在基底上的金属/半导体图案上转印。

公开(公告)号：US20070110962A1

公开(公告)日：2007-05-17

申请号：US10572987

申请日：2004-09-23

Applicant: Joe Tien ,  Min Tang ,  Andrew Golden

Inventor： Joe Tien ,  Min Tang ,  Andrew Golden

IPC: B32B3/00

CPC classification number: B81C1/0046 ,  A61K9/0097 ,  B81B2201/0214 ,  B81B2201/06 ,  B81C99/0085 ,  B81C2201/0153 ,  B82Y30/00 ,  Y10T428/24479 ,  Y10T428/24612

Abstract: The present invention provides three-dimensional hydrogel structures patterned by a treated micropattern mold. The treated mold is capable of transferring the inverse of its micropattern to a hydrogel by contact during formation or polymerization of the structure from a precursor. The treated micropattern mold surface allows the mold to be separated from the hydrogel without collapsing the structure or irreparably damaging its micropattern. The transferred micropattern may yield individual features and/or interconnected channels in the hydrogel. The invention also provides a hydrogel network fabricated by interfacing at least two hydrogels in which one or more of the hydrogels may be a micropatterned structure. Micropatterned hydrogel structures can also be specifically aligned to interconnect their patterns. Structures or networks of the invention comprise hydrogels that can adhere together by chemically bonding and/or mechanically entangling.

Abstract translation: 本发明提供了通过处理的微图案模具图案化的三维水凝胶结构。 经处理的模具能够在从前体形成或聚合结构期间通过接触将其微图案的倒数转移到水凝胶。 经处理的微图案模具表面允许模具与水凝胶分离，而不会破坏结构或不可修复地损坏其微图案。 转移的微图案可以在水凝胶中产生单个特征和/或互连通道。 本发明还提供了一种水凝胶网络，其通过与至少两个水凝胶接合而制造，其中一个或多个水凝胶可以是微图案结构。 微图案化的水凝胶结构也可以特别对准以互连其图案。 本发明的结构或网络包括可通过化学键合和/或机械缠结而粘合在一起的水凝胶。

公开(公告)号：US20070063390A1

公开(公告)日：2007-03-22

申请号：US10562014

申请日：2004-06-22

Applicant: Tormen Massimo

Inventor： Tormen Massimo

IPC: B29C59/02

CPC classification number: G03F7/0002 ,  B29C33/02 ,  B81C99/0085 ,  B81C2201/0153 ,  B81C2201/036 ,  B82Y10/00 ,  B82Y40/00

Abstract: A lithographic process for forming a pattern in relief (20) on a mass (10) of polymeric material comprises the steps of: preparing the mass (10) of polymeric material and a die (12) having a surface region (14) facing towards the mass (10) of polymeric material and which reproduces in negative the pattern in relief (20); heating the die (12) and putting the mass (10) of polymeric material into contact with the die (12) in any temporal sequence, in such a way that the part of the mass (10) of polymeric material in contact with the surface zone (14) is subject to softening; and separating the die (12) from the mass (10) of polymeric material on the surface of which the pattern in relief (20) has been formed. The heating of at least one part of the die (12) is obtained by generation of thermal energy upon dissipation of another form of energy in at least one region (16) of the die (12).

Abstract translation: 用于在聚合物材料（10）上形成浮雕（20）中的图案的平版印刷工艺包括以下步骤：制备聚合物材料块（10）和模具（12），所述模具（12）具有面向 聚合物材料的质量（10）并且以凹凸（20）的形式呈现为负值; 加热模具（12）并将聚合材料的质量块（10）以任何时间顺序与模具（12）接触，使得聚合材料质量（10）的与表面接触的部分 区域（14）容易软化; 以及将模具（12）与形成有凹凸图案（20）的表面上的聚合材料块（10）分离。 模具（12）的至少一部分的加热通过在模具（12）的至少一个区域（16）中消散另一形式的能量时产生热能而获得。

公开(公告)号：US20070017631A1

公开(公告)日：2007-01-25

申请号：US11187407

申请日：2005-07-22

Applicant: Frank Xu

Inventor： Frank Xu

IPC: B32B37/00

CPC classification number: B32B37/14 ,  B32B38/06 ,  B81C1/0046 ,  B81C2201/0153 ,  B82Y10/00 ,  B82Y40/00 ,  C08L59/00 ,  C09J5/00 ,  C09J2205/31 ,  C09J2451/00 ,  G03F7/0002 ,  Y10T156/10

Abstract: The present invention provides a method adhering a layer to a substrate that features defining first and second interfaces by having a composition present between the layer and the substrate that forms covalent bonds to the layer and adheres to the substrate employing one or more of covalent bonds, ionic bonds and Van der Waals forces. In this manner, the strength of the adhering force of the layer to the composition is assured to be stronger than the adhering force of the layer to the composition formed from a predetermined adhering mechanism, i.e., an adhering mechanism that does not include covalent bonding.

Abstract translation: 本发明提供了一种通过使层与衬底之间存在的组合物与层形成共价键并且使用一种或多种共价键粘合到衬底上而将层粘附到基底上的方法，其特征在于限定第一和第二界面， 离子键和范德华力。 以这种方式，确保层对组合物的粘附力的强度比由预定粘合机构即不包括共价键的粘合机构形成的组合物的层的粘合力更强。

公开(公告)号：US20150037922A1

公开(公告)日：2015-02-05

申请号：US14345675

申请日：2012-09-22

Applicant: 1366 TECHNOLOGIES, INC.

Inventor： Emanuel M. Sachs

IPC: H01L31/18

CPC classification number: H01L31/18 ,  B29C33/40 ,  B29C33/42 ,  B29C33/424 ,  B29C43/021 ,  B29C2033/426 ,  B29C2043/025 ,  B29C2059/023 ,  B81C99/0085 ,  B81C2201/0153 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002

Abstract: A method for imparting a pattern to a flowable resist material on a substrate entails providing a resist layer so thin that during a stamp wedging process, the resist never completely fills the space between the substrate and the bottom surface of a stamp between wedge protrusions, leaving gap everywhere therebetween. A gap remains between the resist and the extended surface of the stamp. If the resist layer as deposited is somewhat thicker than the targeted amount, it will simply result in a smaller gap between resist and tool. The presence of a continuous gap assures that no pressure builds under the stamp. Thus, the force on the protrusions i determined only by the pressure above the stamp and is well controlled, resulting in well-controlled hole sizes. The gap prevents resist from being pumped entirely out of any one region, and thus prevents any regions from being uncovered of resist. The stamp can be pulsed in its contact with the substrate, repeatedly deforming the indenting protrusions. Several pulses clears away any scum layer better than does a single press, as measured by an etch test comparison of the degree to which a normal etch for a normal duration etches away substrate material. A method for imparting a pattern to a flowable resist material on a substrate entails providing a resist layer so thin that during a stamp wedging process, the resist never completely fills the space between the substrate and the bottom surface of a stamp between wedge protrusions, leaving a gap everywhere therebetween. A gap remains between the resist and the extended surface of the stamp.

Abstract translation: 将图案赋予基板上的可流动抗蚀剂材料的方法需要提供如此薄的抗蚀剂层，使得在印模楔入过程中，抗蚀剂不会完全填充基板与楔形凸起之间的印模的底表面之间的空间，留下 差距在其间。 在抗蚀剂和印模的延伸表面之间留有间隙。 如果沉积的抗蚀剂层比目标量稍厚一些，则将简单地导致抗蚀剂和工具之间的较小的间隙。 连续间隙的存在确保印章下没有压力。 因此，突起上的力i仅由压力上方的压力确定并且被良好地控制，导致良好控制的孔尺寸。 间隙防止抗蚀剂完全从任何一个区域泵出，从而防止任何区域不被抗蚀剂覆盖。 印模可以与基板接触地脉动，使压痕突起重复变形。 几个脉冲比单次压机更好地清除任何浮渣层，如通过蚀刻测试比较正常蚀刻对正常时间蚀刻掉的衬底材料的程度所测量的。 将图案赋予基板上的可流动抗蚀剂材料的方法需要提供如此薄的抗蚀剂层，使得在印模楔入过程中，抗蚀剂不会完全填充基板与楔形凸起之间的印模的底表面之间的空间，留下 在它们之间的差距。 在抗蚀剂和印模的延伸表面之间留有间隙。

公开(公告)号：US07928004B2

公开(公告)日：2011-04-19

申请号：US11671688

申请日：2007-02-06

Applicant: Robert Seidel ,  Carsten Peters ,  Frank Feustel

Inventor： Robert Seidel ,  Carsten Peters ,  Frank Feustel

IPC: H01L21/4763

CPC classification number: B81B7/0006 ,  B81C2201/0153 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  H01L21/28114 ,  H01L21/76224 ,  H01L21/76229 ,  H01L21/76804 ,  H01L21/76807 ,  H01L21/76817 ,  H01L21/76838 ,  H01L21/76852 ,  H01L21/76885 ,  H01L2221/1021

Abstract: By forming metallization structures on the basis of an imprint technique, in which via openings and trenches may be commonly formed, a significant reduction of process complexity may be achieved due to the omission of at least one further alignment process as required in conventional process techniques. Furthermore, the flexibility and efficiency of imprint lithography may be increased by providing appropriately designed imprint molds in order to provide via openings and trenches exhibiting an increased fill capability, thereby also improving the performance of the finally obtained metallization structures with respect to reliability, resistance against electromigration and the like.

Abstract translation: 通过基于压印技术形成金属化结构，其中可以通常形成通孔和沟槽，由于根据常规工艺技术所要求的至少一个进一步对准过程，可以实现工艺复杂性的显着降低。 此外，可以通过提供适当设计的压印模具来提高压印光刻的灵活性和效率，以便提供表现出增加的填充能力的通孔开口和沟槽，从而也提高了最终获得的金属化结构在可靠性，抗性 电迁移等。

公开(公告)号：US07803712B2

公开(公告)日：2010-09-28

申请号：US11636264

申请日：2006-12-07

Applicant: Pavel Kornilovich ,  Yong Chen ,  Duncan Stewart ,  R. Stanley Williams ,  Philip J. Kuekes ,  Mehmet Fatih Yanik

Inventor： Pavel Kornilovich ,  Yong Chen ,  Duncan Stewart ,  R. Stanley Williams ,  Philip J. Kuekes ,  Mehmet Fatih Yanik

IPC: H01L21/308

CPC classification number: H01L21/76838 ,  B81C99/009 ,  B81C2201/0153 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002

Abstract: A mold with a protruding pattern is provided that is pressed into a thin polymer film via an imprinting process. Controlled connections between nanowires and microwires and other lithographically-made elements of electronic circuitry are provided. An imprint stamp is configured to form arrays of approximately parallel nanowires which have (1) micro dimensions in the X direction, (2) nano dimensions and nano spacing in the Y direction, and three or more distinct heights in the Z direction. The stamp thus formed can be used to connect specific individual nanowires to specific microscopic regions of microscopic wires or pads. The protruding pattern in the mold creates recesses in the thin polymer film, so the polymer layer acquires the reverse of the pattern on the mold. After the mold is removed, the film is processed such that the polymer pattern can be transferred on a metal/semiconductor pattern on the substrate.