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    METHOD FOR RUST-PROOFING MOLD
    11.
    发明申请
    METHOD FOR RUST-PROOFING MOLD 有权
    保护模具的方法

    公开(公告)号：US20140287137A1

    公开(公告)日：2014-09-25

    申请号：US14350967

    申请日：2011-10-18

    申请人： Ikuo Yamauchi ,  Yuichi Furukawa

    发明人： Ikuo Yamauchi ,  Yuichi Furukawa

    IPC分类号： C23C22/74

    CPC分类号： C23C22/74 ,  B22C3/00 ,  B22C9/06 ,  B22C9/061 ,  B22D17/22 ,  C23C8/04 ,  C23C8/32 ,  C23C22/62 ,  C23C22/68 ,  C23C22/82 ,  C23C26/00

    摘要： A method for rust-proofing a mold, which is capable of reducing the time and the cost required for rust-proofing the mold. The method includes an iron hydroxide-forming step for forming iron hydroxide on a predetermined part of the surface of the mold, and a surface-treating step for forming a film covering the molding surface of the mold, and for changing the iron hydroxide formed on the mold into black rust, by heating the mold, under an oxygen-deficiency atmosphere, on which the iron hydroxide is formed in the iron hydroxide-forming step.

    摘要翻译： 一种防锈模具的方法，其能够减少模具防锈所需的时间和成本。 该方法包括在模具的表面的规定部分上形成氢氧化铁的氢氧化铁形成工序，以及形成覆盖模具成形面的膜的表面处理工序， 在形成氢氧化铁的步骤中，在缺氧气氛下加热模具，形成铁氢氧化物。

    Coating-forming liquid composition and coating-forming method therewith
    12.
    发明授权
    Coating-forming liquid composition and coating-forming method therewith 有权
    涂布液组合物及其涂布方法

    公开(公告)号：US08557035B2

    公开(公告)日：2013-10-15

    申请号：US13446962

    申请日：2012-04-13

    申请人： Yoichi Sengoku ,  Masami Tsutae ,  Kiyoto Tai ,  Keisuke Joko ,  Tsuyoshi Amatani

    发明人： Yoichi Sengoku ,  Masami Tsutae ,  Kiyoto Tai ,  Keisuke Joko ,  Tsuyoshi Amatani

    IPC分类号： C09J9/00 ,  C23C22/07 ,  C23C22/52 ,  C23C26/00 ,  C23C18/16 ,  C23C22/68 ,  C23F1/18 ,  H05K3/38

    CPC分类号： C23C22/52 ,  C23C18/1689 ,  C23C22/68 ,  H05K3/0079 ,  H05K3/108 ,  H05K2203/124

    摘要： Provided are: a coating-forming liquid composition capable of forming a coating for bonding copper to a photosensitive resin, which includes an aqueous solution containing an azole having only nitrogen as ring hetero atom, an acid having a logarithm of the reciprocal of acid dissociation constant of 3 to 8 at 25° C., and a salt thereof, has a pH of more than 4 and not more than 7 at 25° C., and can stably form a coating for improving adhesion between copper and a photosensitive resin even when used continuously or repeatedly; and a method of forming a coating for bonding copper to a photosensitive resin, which comprises bringing the surface of the copper into contact with the coating-forming liquid composition to form the coating.

    摘要翻译： 本发明提供：能够形成用于将铜键合到感光性树脂上的涂层的涂布形成液体组合物，其包含含有仅具有氮作为环杂原子的唑类的水溶液，具有酸解离常数的倒数的对数的酸 在25℃下为3〜8，其盐在25℃下的pH为4以上7以下，可以稳定地形成用于提高铜与感光性树脂之间的粘合性的涂层，即使在 连续或反复使用; 以及形成用于将铜结合到感光性树脂上的涂层的方法，其包括使铜的表面与涂覆液形成液体组合物接触以形成涂层。

    Compositions and processes for deposition of metal ions onto surfaces of conductive substrates
    13.
    发明授权
    Compositions and processes for deposition of metal ions onto surfaces of conductive substrates 有权
    用于将金属离子沉积到导电基底表面上的组合物和方法

    公开(公告)号：US08317909B2

    公开(公告)日：2012-11-27

    申请号：US12720395

    申请日：2010-03-09

    申请人： Frank G. Defalco

    发明人： Frank G. Defalco

    IPC分类号： C23C18/31 ,  C23C18/32 ,  C23C18/38 ,  C23C18/42

    CPC分类号： C23C18/00 ,  C23C18/31 ,  C23C22/08 ,  C23C22/42 ,  C23C22/60 ,  C23C22/68

    摘要： The present invention provides compositions and processes for preparing metallic ions for deposition on and/or into conductive substrates, such as metals, to substantially eliminate friction from metal to metal contact. It is used in the aqueous embodiment to form new metal surfaces on all metal substrates. The processes form stable aqueous solutions of metal and metalloid ions that can be adsorbed or absorbed on and/or into conductive substrates. The aqueous solutions consist of ammonium alkali metal phosphate salts, and/or ammonium alkali metal sulfate salts mixed with a water soluble metal or metalloid salt from Group I through Group VIII of the periodic table of elements. The aqueous solutions allow for a nano deposition of the metal ions on and/or into the surfaces of conductive substrates. The surfaces created by the deposited metal ions will provide metal passivation and substantially eliminate friction in metal-to-metal contact without the use of hydrocarbon based lubricants.

    摘要翻译： 本发明提供用于制备金属离子以用于沉积在导电基底（例如金属）上和/或导电基底（例如金属）中的组合物和方法，以基本上消除金属与金属接触的摩擦。 在水性实施方案中用于在所有金属基材上形成新的金属表面。 该方法形成可以吸附或吸收在导电基材上和/或导电基材上的稳定的金属和准金属离子水溶液。 水溶液由铵碱金属磷酸盐和/或碱金属硫酸铵盐与碱金属元素周期表第I族至第VIII族的水溶性金属或准金属盐混合。 水溶液允许金属离子在导电基底表面上和/或表面上的纳米沉积。 由沉积的金属离子产生的表面将提供金属钝化，并且基本上消除金属与金属之间的摩擦，而不使用烃基润滑剂。

    COATING-FORMING LIQUID COMPOSITION AND COATING-FORMING METHOD THEREWITH
    14.
    发明申请
    COATING-FORMING LIQUID COMPOSITION AND COATING-FORMING METHOD THEREWITH 有权
    涂料成型液体组合物及其成膜方法

    公开(公告)号：US20120260821A1

    公开(公告)日：2012-10-18

    申请号：US13446962

    申请日：2012-04-13

    申请人： Yoichi SENGOKU ,  Masami TSUTAE ,  Kiyoto TAI ,  Keisuke JOKO ,  Tsuyoshi AMATANI

    发明人： Yoichi SENGOKU ,  Masami TSUTAE ,  Kiyoto TAI ,  Keisuke JOKO ,  Tsuyoshi AMATANI

    IPC分类号： C09J9/00

    CPC分类号： C23C22/52 ,  C23C18/1689 ,  C23C22/68 ,  H05K3/0079 ,  H05K3/108 ,  H05K2203/124

    摘要： Provided are: a coating-forming liquid composition capable of forming a coating for bonding copper to a photosensitive resin, which includes an aqueous solution containing an azole having only nitrogen as ring hetero atom, an acid having a logarithm of the reciprocal of acid dissociation constant of 3 to 8 at 25° C., and a salt thereof, has a pH of more than 4 and not more than 7 at 25° C., and can stably form a coating for improving adhesion between copper and a photosensitive resin even when used continuously or repeatedly; and a method of forming a coating for bonding copper to a photosensitive resin, which comprises bringing the surface of the copper into contact with the coating-forming liquid composition to form the coating.

    摘要翻译： 本发明提供：能够形成用于将铜键合到感光性树脂上的涂层的涂布形成液体组合物，其包含含有仅具有氮作为环杂原子的唑类的水溶液，具有酸解离常数的倒数的对数的酸 在25℃下为3〜8，其盐在25℃下的pH为4以上7以下，可以稳定地形成用于提高铜与感光性树脂之间的粘合性的涂层，即使在 连续或反复使用; 以及形成用于将铜结合到感光性树脂上的涂层的方法，其包括使铜的表面与涂覆液形成液体组合物接触以形成涂层。

    Method for conversion treating surface of magnesium alloy workpiece
    15.
    发明授权
    Method for conversion treating surface of magnesium alloy workpiece 有权
    镁合金工件转化处理方法

    公开(公告)号：US08262810B2

    公开(公告)日：2012-09-11

    申请号：US13045733

    申请日：2011-03-11

    申请人： Sheng-En Hsu ,  Yong Liu ,  Fei-Xiang Li ,  Zhao Jin

    发明人： Sheng-En Hsu ,  Yong Liu ,  Fei-Xiang Li ,  Zhao Jin

    IPC分类号： C23C22/57 ,  C23C22/05

    CPC分类号： C23C22/68 ,  C23C22/60

    摘要： A method for conversion treating a surface of a magnesium alloy workpiece includes the steps of degreasing, acid pickling, alkali pickling, and chemical converting. A phosphating solution is used in the step of chemical converting and includes the following solution concentrations: 2.89 gram/liter to 8.67 gram/liter of phosphoric acid, 0.3 gram/liter to 1.0 gram/liter of carbamide, 0.39 gram/liter to 1.56 gram/liter of nitric acid, 6 gram/liter to 30 gram/liter of manganese dihydrogen phosphate, and 0.2 gram/liter to 0.6 gram/liter of tannin.

    摘要翻译： 对镁合金工件的表面进行转化处理的方法包括脱脂，酸洗，碱洗和化学转化的步骤。 在化学转化步骤中使用磷酸盐溶液，包括以下溶液浓度：2.89克/升至8.67克/升磷酸，0.3克/升至1.0克/升氨基酰胺，0.39克/升至1.56克 /升硝酸，6克/升至30克/升磷酸二氢锰和0.2克/升至0.6克/升的单宁。