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    Controlled Surface Roughness in Vacuum Retention
    11.
    发明申请
    Controlled Surface Roughness in Vacuum Retention 有权
    控制表面粗糙度在真空保留

    公开(公告)号：US20130082448A1

    公开(公告)日：2013-04-04

    申请号：US13250871

    申请日：2011-09-30

    申请人： Robert A. Ferguson

    发明人： Robert A. Ferguson

    IPC分类号： B23Q3/08 ,  B23Q17/00

    CPC分类号： B23Q3/088 ,  Y10S414/141 ,  Y10T279/11 ,  Y10T279/34

    摘要： An apparatus, particularly a chuck for retaining a thin part for micro-machining processing, is disclosed. The chuck is formed of a plate-shaped body having a first surface and a second surface opposite the first surface. The plate-shaped body includes a light-transmissive material, and at least one of the first surface or the second surface is a roughened surface. The chuck can be incorporated into a micro-machining system using a chuck support that allows light through to backlight a processed part for inspection.

    摘要翻译： 公开了一种装置，特别是用于保持用于微加工加工的薄部件的卡盘。 卡盘由具有第一表面和与第一表面相对的第二表面的板状主体形成。 板状主体包括透光材料，第一表面或第二表面中的至少一个是粗糙表面。 卡盘可以使用卡盘支撑件结合到微加工系统中，该卡盘支撑件允许光通过背光处理的部件进行检查。

    CENTERING METHOD FOR OPTICAL ELEMENTS
    14.
    发明申请
    CENTERING METHOD FOR OPTICAL ELEMENTS 审中-公开
    光学元件的中心方法

    公开(公告)号：US20120068420A1

    公开(公告)日：2012-03-22

    申请号：US13304959

    申请日：2011-11-28

    申请人： Baruch Ben-Menachem ,  Mordechai Gilo

    发明人： Baruch Ben-Menachem ,  Mordechai Gilo

    IPC分类号： B23B31/30 ,  B23B31/10

    CPC分类号： B24B13/0055 ,  Y10T279/11 ,  Y10T279/21

    摘要： A method for centering a circular optical element using a non-self-centering chuck adapted to grip the element at two grip strengths. The element is rotated in the chuck while measuring the lateral position of the element's outer rim with a probe. The positions of maximum and minimum run-out of the element as a function of its angular position are determined. Chuck rotation is stopped at an angular position with the maximum rim run-out positioned at a predetermined point. The grip of the chuck is reduced such that the element is still held in the chuck but can be moved in a lateral direction without damaging its surface. The element is moved in a direction connecting the predetermined point of maximum run-out and the axis of rotation of the chuck, in order to reduce the run-out of the element. The procedure is repeated until the desired centering is achieved.

    摘要翻译： 一种用于使用非自对中卡盘定心圆形光学元件的方法，其适于以两个抓握强度夹持该元件。 使用探头测量元件外缘的横向位置时，将元件在卡盘中旋转。 确定作为其角位置的函数的元素的最大和最小跳动的位置。 卡盘旋转停止在角位置，最大轮缘径向位于预定点。 卡盘的把手减小，使得元件仍然保持在卡盘中，但是可以在横向方向上移动而不损坏其表面。 元件在连接预定的最大跳动点和卡盘的旋转轴线的方向上移动，以便减少元件的跳动。 重复该过程，直到达到所需的定心。

    Tool Holder Comprising A Suction System
    17.
    发明申请
    Tool Holder Comprising A Suction System 审中-公开
    包括抽吸系统的工具架

    公开(公告)号：US20080203679A1

    公开(公告)日：2008-08-28

    申请号：US11916745

    申请日：2005-07-28

    申请人： Julian Baigorri Hermoso

    发明人： Julian Baigorri Hermoso

    IPC分类号： B23B5/22

    CPC分类号： B23Q11/0046 ,  Y10T279/11

    摘要： This patent document relates, as its title indicates, to a tool holder with suction system of the type used in automatic machining systems with numerical control for the adaptation and securing of different machining tools, characterised in that it integrates in a single device the functionality of a conventional automatic tool holder, being capable of bearing a retractable element for improving precision in the control of the depth of machining, and a suction system for the powder and swarf generated during the process, enabling in an alternative embodiment the use of an axial knuckle joint in the sensing device that enables automatic adaptation to the irregularities of the surface to be machined with the subsequent reduction in machining error, and also enabling in another alternative embodiment the use of a plurality of slide guides in the retractable elements for improving the sliding of the sensing element.The invention being presented herein presents the principal advantages of enabling machining that is more precise in depth than conventional systems, at the same time as all the waste generated by the machining is automatically evacuated by the suction system, all by means of a single device.

    摘要翻译： 该专利文献正如其标题所示，涉及一种具有用于具有用于适应和固定不同加工工具的数字控制的自动加工系统中使用的类型的工具架，其特征在于，其集成在单个装置中，其功能性 传统的自动刀架，能够承载用于提高加工深度控制精度的伸缩元件，以及用于在该过程中产生的粉末和切屑的抽吸系统，使得在替代实施例中可以使用轴向转向节 传感装置中的接头，其随着加工误差的随后减少而自动适应待加工表面的不规则性，并且还可以在另一替代实施例中使用多个可伸缩元件中的滑动引导件来改善滑动 传感元件。 本文给出的本发明提供了与常规系统相比在深度上更精确的加工的主要优点，同时所有由加工产生的所有废物都由抽吸系统全部借助于单个装置而被排空。

    APPARATUS FOR TRANSFERRING SEMICONDUCTOR CHIP AND METHOD OF TRANSFERRING SEMICONDUCTOR CHIP USING THE SAME
    18.
    发明申请
    APPARATUS FOR TRANSFERRING SEMICONDUCTOR CHIP AND METHOD OF TRANSFERRING SEMICONDUCTOR CHIP USING THE SAME 有权
    用于传输半导体芯片的装置和使用其传输半导体芯片的方法

    公开(公告)号：US20080148558A1

    公开(公告)日：2008-06-26

    申请号：US11954657

    申请日：2007-12-12

    申请人： Kook-Jin OH

    发明人： Kook-Jin OH

    IPC分类号： H05K7/10 ,  H05K13/04 ,  B23B31/30

    CPC分类号： H01L21/6838 ,  H05K13/0409 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/5313 ,  Y10T29/53178 ,  Y10T29/53191 ,  Y10T279/11

    摘要： Provided are an apparatus for transferring a semiconductor chip and a method of transferring a semiconductor chip using the same, which can inhibit the occurrence of a void to enhance the reliability of a semiconductor package. The apparatus for transferring the semiconductor chip includes: a holder member including a first vacuum hole connected to a vacuum line; a plate member including at least one second vacuum hole corresponding to the first vacuum hole and redistributed to edges of the plate member, the plate member combined with the holder member; and an absorption member including at least one third vacuum hole corresponding to the second vacuum hole and a groove connected to the third vacuum hole, the absorption member combined with the plate member and the holder member.

    摘要翻译： 提供了一种用于转移半导体芯片的装置以及使用该半导体芯片传送半导体芯片的方法，其可以抑制空洞的发生以提高半导体封装的可靠性。 用于传送半导体芯片的装置包括：保持器构件，包括连接到真空管线的第一真空孔; 板构件，其包括对应于第一真空孔的至少一个第二真空孔并且重新分布到板构件的边缘，板构件与保持构件结合; 以及吸收构件，其包括与所述第二真空孔对应的至少一个第三真空孔和与所述第三真空孔连接的凹槽，所述吸收构件与所述板构件和所述保持构件结合。

    Vacuum Holder For Integrated Circuit Units
    19.
    发明申请
    Vacuum Holder For Integrated Circuit Units 有权
    集成电路单元真空支架

    公开(公告)号：US20080118997A1

    公开(公告)日：2008-05-22

    申请号：US11662283

    申请日：2005-07-19

    申请人： Hae Choon Yang

    发明人： Hae Choon Yang

    IPC分类号： H01L21/00

    CPC分类号： H01L21/67333 ,  B25B11/005 ,  H01L21/67336 ,  Y10T279/11

    摘要： A support device for supporting a set of integrated circuit units (65), the device comprising: a support member having a metal surface, said surface having an array of recesses (27); a soft material layer, overlaying the recesses of the metal surface so as to protect the units (65) from damage caused by contact with the metal surface, and; a vacuum means (35) in communication with said recesses (27), such that the vacuum means supports each unit within a respective recess, wherein the soft material layer is formed of a plurality of independent inserts (40), each insert engageable with at least one recess using engagement means (50, 55) for engaging each insert (40) with the at least one recess (27).

    摘要翻译： 一种用于支撑一组集成电路单元（65）的支撑装置，该装置包括：具有金属表面的支撑构件，所述表面具有凹槽阵列（27）; 软材料层，覆盖金属表面的凹部，以保护单元（65）免受与金属表面接触所造成的损害; 与所述凹部（27）连通的真空装置（35），使得所述真空装置支撑相应凹部内的每个单元，其中所述软材料层由多个独立的插入件（40）形成，每个插入件可接合于 至少一个凹槽，其使用用于使每个插入件（40）与所述至少一个凹部（27）接合的接合装置（50,55）。