公开(公告)号：US11408848B2

公开(公告)日：2022-08-09

申请号：US16695902

申请日：2019-11-26

申请人： Nova Biomedical Corporation

发明人： Bong Kyun Oh

IPC分类号： G01N27/404 ,  C08G59/14 ,  G01N27/31 ,  G01N27/327 ,  G01N27/30 ,  C08G59/18 ,  C08F218/08

摘要： An electrochemical oxygen sensor includes a sensing surface having a working electrode and a reference electrode, a hydrophilic layer formed from an oxygen diffusion-limiting layer emulsion overlaying the working electrode and a hydrophobic membrane formed from a hydrophobic solution disposed over the hydrophilic layer. The hydrophilic layer contains an epoxy network and a hydrophilic polymer. The hydrophobic layer contains an acetate copolymer and a cross-linking agent that reacts with the liquid epoxy resin in the hydrophilic layer forming the epoxy network where the hydrophobic member is water vapor and oxygen permeable.

公开(公告)号：US20220010054A1

公开(公告)日：2022-01-13

申请号：US17295241

申请日：2019-11-01

申请人： MITSUBISHI GAS CHEMICAL COMPANY, INC.

发明人： Takuma HANAOKA

IPC分类号： C08G59/50 ,  C08L63/00 ,  C08G59/18 ,  C09D163/00 ,  C09D5/08 ,  C09D5/02

摘要： Provided is a water-based epoxy resin composition and a cured product thereof, the water-based epoxy resin composition obtained by blending a water-based epoxy resin (A) and a curing agent composition (B) containing a reaction product (b1) of epichlorohydrin and an amine compound represented by the following formula (1), the water-based epoxy resin composition having a content ratio of the component (A) and the component (B) defined as [number of epoxy groups in component (A)/number of active amine hydrogens in component (B)] of 1/1.1 to 1/0.3: H2N—CH2—A—CH2—NH2   (1) wherein A is a 1,2-phenylene group, a 1,3-phenylene group, or a 1,4-phenylene group.

公开(公告)号：US11139178B2

公开(公告)日：2021-10-05

申请号：US16653536

申请日：2019-10-15

申请人： Texas Instruments Incorporated

发明人： Amit Sureshkumar Nangia ,  Siva Prakash Gurrum ,  Janakiraman Seetharaman

IPC分类号： H01L21/56 ,  H01L23/29 ,  H01L23/495 ,  C08G59/18 ,  H01L23/64 ,  H01L23/522 ,  H01L23/00 ,  H01L23/50 ,  H01L23/31

摘要： A semiconductor package includes an integrated circuit formed on a semiconductor substrate. A stress buffer layer is provided on the integrated circuit. Further, a mold compound is provided on a surface of the stress buffer layer opposite the integrated circuit. The mold compound comprises a resin. The resin includes filler particles. The filler particles have multiple sizes with the largest of the particles having a size between 5 microns and 32 microns.

公开(公告)号：US11111333B2

公开(公告)日：2021-09-07

申请号：US16169062

申请日：2018-10-24

申请人： Cytec Industries Inc.

发明人： Jonathan E. Meegan ,  Marco Aurilia

IPC分类号： C08G59/38 ,  C08G59/50 ,  C08L63/00 ,  C08G59/32 ,  C08G59/26 ,  C08G59/18 ,  B29C70/48 ,  C08L63/04 ,  C08L9/06 ,  C08L51/04 ,  C08G59/22

摘要： Curable epoxy resin compositions suitable for liquid resin infusion processes. In one embodiment, the resin composition contains (a) at least two polyepoxides, one of which is triglycidyl ether of tris(hydroxyphenyl)methane, (b) an aromatic amine curing agent, and (c) core-shell rubber particles. In another embodiment, the resin composition (a) at least two polyepoxides, one of which is diglycidyl ether of bis(hydroxyphenyl)fluorene, (b) an aromatic amine curing agent, and (c) core-shell rubber particles.

公开(公告)号：US11098203B2

公开(公告)日：2021-08-24

申请号：US16334650

申请日：2017-08-30

申请人： COMMONWEALTH SCIENTIFIC AND INDUSTRIAL RESEARCH ORGANISATION

发明人： Berkay Ozcelik ,  Helmut Werner Thissen

IPC分类号： A61L27/34 ,  C09D5/16 ,  A61L17/14 ,  A61L29/08 ,  C08G59/50 ,  C08G59/18 ,  A61L27/18 ,  A61L29/06 ,  A61L29/16 ,  A61L27/54 ,  C09D163/00 ,  C09D133/26 ,  C09D171/00

摘要： The application is directed to polymer coatings which can be modified to control biointerfacial interactions including biofilm formation and protein adsorption onto said coatings. The polymer coatings comprise a First Component comprising epoxide or alkenyl groups, and a Second Component comprising at least one amine group. The polymer coatings further comprise at least one bioactive agent which may control said biofilm formation and/or protein adsorption. Also disclosed herein are methods for producing said coatings incorporating bioactive molecules in one or two step procedures on a substrate. The polymer coating may be immobilised on the substrate via the reaction of functional groups present on the First Component and/or Second Component with complimentary functional groups disposed on at least one surface of the substrate.

公开(公告)号：US11046809B2

公开(公告)日：2021-06-29

申请号：US15752814

申请日：2016-09-16

申请人： SIKA TECHNOLOGY AG

发明人： Edis Kasemi ,  Andreas Kramer ,  Ursula Stadelmann ,  Urs Burckhardt

IPC分类号： C08G59/50 ,  C09D163/00 ,  C08G59/18 ,  C08G59/24

摘要： The use of an amine of formula (I) as a component of a hardener for epoxy resins, hardeners for epoxy resins containing the amine of formula (I), and resultant epoxy resin compositions which can particularly be used as low-emission room-temperature-curing epoxy-resin coatings with high hardness and surface quality. The amine of formula (I) is low-odour and a very successful diluent for epoxy resin compositions. It is particularly obtained by reductive alkylation from 1,2-ethylenediamine or 1,2-propylenediamine and an aldehyde or ketone.

公开(公告)号：US20210102101A1

公开(公告)日：2021-04-08

申请号：US16497552

申请日：2018-03-23

申请人： CEMEDINE CO., LTD. ,  MAZDA MOTOR CORPORATION

发明人： Daisuke MAKINO ,  Atsuhiko SUZUKI ,  Yusuke MURACHI ,  Motoyasu ASAKAWA ,  Katsuya HIMURO ,  Kenichi YAMAMOTO

IPC分类号： C09J163/00 ,  C08G59/18 ,  C09J11/04 ,  C09J11/06 ,  C09J5/06 ,  B62D65/02 ,  C08K3/36 ,  C08K3/22

摘要： Provided are a low-temperature heat-curable adhesive composition for structures which is able to cure at a low temperature in a short time, is reduced in groove defects after open-state standing, and is excellent in rust-preventive property, corrosion resistance, shower resistance, and workability; and a method for producing an automotive structure using the adhesive composition. The low-temperature heat-curable adhesive composition for structures includes (A) an epoxy resin, (B) a micro-encapsulated curing agent, (C) a hygroscopic agent, (D) a viscosity modifier, and (E) a stabilizer. The hygroscopic agent (C) is calcium oxide, which suitably includes both a surface-treated grade and a non-surface-treated grade.

公开(公告)号：US10947337B2

公开(公告)日：2021-03-16

申请号：US16155008

申请日：2018-10-09

申请人： KANEKA CORPORATION

发明人： Nobuo Miyatake

IPC分类号： C08G59/22 ,  C08L71/02 ,  C08L51/00 ,  C08L63/00 ,  C08G59/42 ,  C08G59/18 ,  C08G59/32 ,  C08G59/50 ,  C08G65/04 ,  C08L25/08 ,  C08L33/10 ,  C08L101/06

摘要： A toughened epoxy resin composition includes an end-capped polyalkylene oxide (A), an epoxy resin (B), an epoxy curing agent (C), and a core shell polymer (D). The end-capped polyalkylene oxide (A) has a number average molecular weight of 1500 to 5000, and 40% or more of a total number of ends of the end-capped polyalkylene oxide (A) are capped with at least one selected from the group consisting of an alkyl group, an allyl group, and an aryl group. A weight ratio of the end-capped polyalkylene oxide (A) to the core shell polymer (D) is 10/90 to 90/10. The core shell polymer (D) comprises a core layer in an amount of 70 to 95% by weight and the core layer is one or more selected from the group consisting of diene rubber, (meth)acrylate rubber, organosiloxane rubber, styrene polymer, and (meth)acrylate polymer.

公开(公告)号：US10920031B2

公开(公告)日：2021-02-16

申请号：US16572164

申请日：2019-09-16

申请人： Mitsubishi Chemical Corporation

发明人： Yukihiro Harada ,  Atsushi Nohara

IPC分类号： B32B27/38 ,  B32B27/20 ,  C08J5/24 ,  C08G59/18 ,  C08L63/00

摘要： A prepreg including: a component (A); a component (B); and a component (C), in which the component (A) is a reinforced fiber substrate, the component (B) is an epoxy resin composition, the component (C) is a component (c1) or a component (c2), the component (c1) includes polyamide particles and thermosetting polyimide particles, and the component (c2) includes spherical polyamide particles having a melting point of 140° C. to 175° C.

公开(公告)号：US10778058B2

公开(公告)日：2020-09-15

申请号：US16083341

申请日：2017-02-08

申请人： Siemens Aktiengesellschaft

发明人： Jürgen Huber ,  Dieter Schirm ,  Matthias Übler

IPC分类号： H01B3/04 ,  H01B3/40 ,  H02K15/10 ,  H02K15/12 ,  H02K3/30 ,  H02K3/40 ,  C09J7/21 ,  C09J7/30 ,  B32B3/26 ,  B32B7/12 ,  H02K3/34 ,  C08G59/18 ,  B32B5/02 ,  B32B5/06 ,  B32B5/24 ,  H01B3/00 ,  H01B3/48 ,  H01B3/30 ,  H01B7/02 ,  H01B3/50

摘要： Various embodiments may include a solid insulation material, e.g. in tape form, the use thereof in a vacuum impregnation process, and/or an insulation system produced therewith and also an electrical machine having the insulation system, for the medium- and high-voltage sector. Some examples include rotating electrical machines in the medium- and high-voltage sector and also semifinished products for electrical switchgear. The solid insulation material and the insulation system produced therewith are characterized in that it can be produced in an anhydride-free manner, wherein the curing catalyst is, for example, an adduct of a 1H-imidazole and/or 1H-imidazole derivative with a compound containing oxirane groups.