公开(公告)号：US20220158491A1

公开(公告)日：2022-05-19

申请号：US17522925

申请日：2021-11-10

Applicant: CYNTEC CO., LTD.

Inventor： TSUNG-CHAN WU ,  Yen-Ming Liu ,  Chien-Hui Chen

IPC: H02J50/10 ,  H02J7/00 ,  H05K7/20 ,  H02J50/70 ,  H01L35/00

Abstract: A wireless charger comprises a top cover; a metallic case; and a first thermoelectric cooler chip, disposed between a bottom surface of the top cover and a top surface of the metallic case to form a heat conductive path from the top cover to the metallic case via the first thermoelectric cooler chip for dissipating heat generated by an electronic device disposed on the top cover for wireless charging the electronic device.

公开(公告)号：US20220157512A1

公开(公告)日：2022-05-19

申请号：US17317904

申请日：2021-05-12

Applicant: CYNTEC CO., LTD.

Inventor： Min-Feng Chung ,  Kuan Yu Chiu ,  Ching Hsiang Yu

IPC: H01F27/28 ,  H01F27/24 ,  H01F41/04 ,  H01F27/32

Abstract: A structure for forming a 3D-coil transponder, wherein each group of leads is encapsulated by a separated insulating molding body and a magnetic body disposed over the plurality of separated groups of leads, wherein each said insulating molding body does not extend across two or more groups of leads.

公开(公告)号：US11031255B2

公开(公告)日：2021-06-08

申请号：US16782039

申请日：2020-02-04

Applicant: CYNTEC CO., LTD.

Inventor： Bau-Ru Lu ,  Da-Jung Chen ,  Yi-Cheng Lin

IPC: H01L23/00 ,  H01L21/48 ,  H01L23/495 ,  H01L21/768 ,  H01L25/00 ,  H01L25/16

Abstract: A method for forming a conductive structure is disclosed, the method comprising the steps of: forming a metallic frame having a plurality of metal parts separated from each other; forming an insulating layer on the top surface of the plurality of metal parts; and forming a conductive pattern layer on the insulating layer for making electrical connections with at least one portion of the plurality of metal parts.

公开(公告)号：US20210159537A1

公开(公告)日：2021-05-27

申请号：US16698131

申请日：2019-11-27

Applicant: Cyntec Co., Ltd.

Inventor： Chihung Su ,  Wenhsiung Liao

IPC: H01M10/0562 ,  H01M4/04 ,  H01M2/16

Abstract: A solid-state battery includes a first electrode; a second electrode having a first side facing a first side of the first electrode and spaced from the first electrode; and a solid electrolyte at least partially disposed in a space between the first electrode and the second electrode for providing a path for metal ions associated with the first electrode and/or the second electrode to move through. The metal ions are kept differentially distributed along the path.

公开(公告)号：US20210105898A1

公开(公告)日：2021-04-08

申请号：US16592786

申请日：2019-10-04

Applicant: CYNTEC CO., LTD.

Inventor： KAIPENG CHIANG ,  DA-JUNG CHEN ,  BAU-RU LU ,  CHUN HSIEN LU

IPC: H05K1/18 ,  H05K1/02 ,  H05K7/20 ,  H05K3/34 ,  H02M3/156

Abstract: An electronic module, such as a VRM, has a power inductor and power wave pins disposed on a bottom surface of a circuit board so as to reduce the size and increase the heat dissipation capability of the VRM.

公开(公告)号：US10854575B2

公开(公告)日：2020-12-01

申请号：US15961865

申请日：2018-04-24

Applicant: CYNTEC CO., LTD.

Inventor： Bau-Ru Lu ,  Ming-Chia Wu ,  Shao Wei Lu

IPC: H01L25/065 ,  H01L23/552 ,  H01L23/13 ,  H01L23/538 ,  H01L23/31 ,  H01L25/11 ,  H01L25/07 ,  H01L25/00 ,  H01L23/36 ,  H01L23/373 ,  H01L23/40 ,  H01L23/498 ,  H01L23/00 ,  H05K5/02 ,  H05K5/06 ,  H05K1/11 ,  H05K3/42 ,  H05K7/02 ,  H05K7/20

Abstract: The present invention discloses a three-dimensional package structure which can achieve a relatively high utilization of an internal space thereof, so that a size of electronic package structure can be reduced. The three-dimensional package structure comprises a first electronic component, a plurality of second electronic components and a plurality of conductive patterns. The first electronic component has a top surface and a bottom surface. The plurality of second electronic components are disposed over the top surface of the first electronic component. The plurality of conductive patterns are disposed over the plurality of second electronic components to electrically connect the plurality of second electronic components and the first electronic component.

公开(公告)号：US10593561B2

公开(公告)日：2020-03-17

申请号：US15955696

申请日：2018-04-18

Applicant: CYNTEC CO., LTD.

Inventor： Bau-Ru Lu ,  Da-Jung Chen ,  Yi-Cheng Lin

IPC: H01L23/00 ,  H01L21/48 ,  H01L23/495 ,  H01L21/768 ,  H01L25/00 ,  H01L25/16

Abstract: A package structure comprises: a plurality of metal parts, wherein each metal part is made of metal and each two adjacent metal parts are spaced apart by a gap being filled with an insulating material; a first insulating layer, disposed over a top of the plurality of metal parts and the top surface of a conductive element; and a first conductive layer, disposed over the first insulating layer, wherein a first conductive pattern electrically connects a first terminal of the conductive element to a first metal part through at least one first via disposed in the first insulating layer, wherein a bump is disposed in the first insulating layer and electrically connected to a second terminal of the conductive element.

公开(公告)号：US10438907B2

公开(公告)日：2019-10-08

申请号：US15375146

申请日：2016-12-11

Applicant: CYNTEC CO., LTD.

Inventor： Chun-Fu Hu ,  Chih-Yu Hu ,  Shu-Wei Chang

IPC: H01L23/66 ,  H01L23/498 ,  H01L23/31 ,  H01L23/552 ,  H01L21/56 ,  H01L23/50

Abstract: The present invention discloses a wireless package with a resilient connector for connecting a substrate to an antenna. The antenna is disposed directly on a top surface of a molding compound of the wireless package. The resilient connector has a lower terminal bonded to the substrate, a horizontal contact portion, and an oblique support portion integrally extending between the horizontal contact portion and the lower terminal. The horizontal contact portion has a flat top surface that is coplanar with the top surface of the molding compound and is in direct contact with the antenna such that the contact resistance distribution is concentrated and the production yield of the wireless package is improved.

公开(公告)号：US10438730B2

公开(公告)日：2019-10-08

申请号：US16022708

申请日：2018-06-29

Applicant: CYNTEC CO., LTD.

Inventor： Kuo-Tung Kao ,  Yang-Sheng Chou ,  Chieh-Yuan Feng

IPC: H01C1/14 ,  G01R1/20 ,  H01C17/28 ,  H01C1/01

Abstract: A current sensing resistor includes a conductive body comprising a resistor portion and a pair of electrode portions connecting to two ends of the resistor portion, a receiving blind hole disposed on a top surface of each of the pair of electrode portions, and a detection terminal disposed on the receiving blind hole. The detection terminal includes a base fixed in the receiving blind hole and a terminal pin protruding from the top surface.

公开(公告)号：US10297573B2

公开(公告)日：2019-05-21

申请号：US15876222

申请日：2018-01-22

Applicant: CYNTEC CO., LTD.

Inventor： Bau-Ru Lu ,  Ming-Chia Wu ,  Shao Wei Lu

IPC: H01L21/311 ,  H01L25/065 ,  H01L25/00 ,  H01L23/552 ,  H05K5/02 ,  H05K5/06 ,  H05K1/11 ,  H05K3/42 ,  H05K7/02 ,  H05K7/20 ,  H01L23/13 ,  H01L23/36 ,  H01L23/373 ,  H01L23/40 ,  H01L23/498 ,  H01L23/538 ,  H01L23/31

Abstract: A three-dimensional package structure, comprising: a substrate; a first plurality of discrete electronic components disposed over the bottom surface of the substrate, wherein a first insulating layer is disposed over the bottom surface of the substrate to encapsulate the first plurality of discrete electronic components, wherein at least one second insulating layer is disposed over the first insulating layer, wherein a plurality of surface-mount pads are disposed on the bottom surface of the at least one second insulating layer and electrically connected to at least one via disposed in the at least one second insulating layer.