公开(公告)号：US4577258A

公开(公告)日：1986-03-18

申请号：US676490

申请日：1984-11-29

Applicant: Raymond C. Jodoin

Inventor： Raymond C. Jodoin

IPC: H01G2/06 ,  H01G4/12 ,  H01G4/40 ,  H04B15/02 ,  H05K1/02 ,  H05K7/20

CPC classification number: H01G2/06 ,  H01G4/12 ,  H01G4/40 ,  H04B15/02 ,  H05K1/0231 ,  H05K2201/10515 ,  H05K2201/10651 ,  H05K2201/10689

Abstract: High frequency noise is decoupled from a bus conductor which supplies power to an integrated circuit by insertion of a metallized ceramic chip in the space defined by the two parallel rows of leads extending from the circuit. The ceramic chip is provided with a pair of rectangular leads, connected to respective of the metalized opposite surfaces thereof, which are respectively connected to the power supply leads of the circuit.

Abstract translation: 高频噪声通过在由从电路延伸的两条平行的引线限定的空间内插入金属化的陶瓷芯片而从向总线电路供电的总线导体解耦。 陶瓷芯片设置有一对矩形引线，其连接到其金属化的相对表面，分别连接到电路的电源引线。

公开(公告)号：US4546412A

公开(公告)日：1985-10-08

申请号：US609835

申请日：1984-05-14

Applicant: Terumi Nakazawa ,  Hitoshi Minorikawa ,  Kazuhiko Kawakami

Inventor： Terumi Nakazawa ,  Hitoshi Minorikawa ,  Kazuhiko Kawakami

IPC: F02B77/00 ,  H05K1/02 ,  H05K1/14 ,  H05K3/28 ,  H05K3/34 ,  H05K3/36 ,  H05K5/00 ,  H05K7/12 ,  H05K5/02

CPC classification number: H05K5/0056 ,  H05K1/141 ,  H05K1/0231 ,  H05K1/148 ,  H05K2201/094 ,  H05K2201/09709 ,  H05K2201/1028 ,  H05K2201/10651 ,  H05K3/284 ,  H05K3/3405 ,  H05K3/3447 ,  H05K3/3463 ,  H05K3/36

Abstract: An electronic device for an automobile is roughly divided into individual parts and control circuit elements which are mounted in a casing divided into two compartments, according to the present invention. The individual parts are arranged in one compartment and are covered with silicone rubber to improve their water resistance. The control circuit elements are arranged in the other compartment and are covered with a silicone gel to prevent any stresses acting upon the control circuit elements, such as ICs, and provide these elements with moisture resistance. The control circuit elements are bonded by high-temperature solder to improve their heat resistance, but the individual parts are bonded by eutectic solder.

Abstract translation: 根据本发明，用于汽车的电子设备大致分为安装在分成两个隔间的壳体中的单独部件和控制电路元件。 单个部件布置在一个隔室中，并被硅橡胶覆盖以提高其耐水性。 控制电路元件布置在另一个隔间中并被硅凝胶覆盖，以防止作用在诸如IC之类的控制电路元件上的任何应力，并且使这些元件具有防潮性。 控制电路元件通过高温焊料接合以提高其耐热性，但是各个部件通过共晶焊料接合。

公开(公告)号：US4475145A

公开(公告)日：1984-10-02

申请号：US397644

申请日：1982-07-12

Applicant: Dale L. Heil ,  Mark D. Goodsmith

Inventor： Dale L. Heil ,  Mark D. Goodsmith

IPC: H05K1/02 ,  H05K7/20

CPC classification number: H05K1/0203 ,  H05K2201/10022 ,  H05K2201/10553 ,  H05K2201/10651

Abstract: A printed circuit heatsink technique and assembly is disclosed which increases the heat dissipating capabilities of a printed circuit assembly. A thermally conductive plate is etched using the same artwork or mask employed to define the patterns of terminals and conductive areas on one surface of a printed circuit board. The plate is etched in those regions corresponding to the terminal and conductive areas so that holes are produced in the terminal areas and channels are produced in the conductive areas. The plate is then bonded to the printed circuit board prior to the attachment of the leads of electronic components through the holes formed in the thermally conductive plate. The assembly absorbs heat generated by the electronic components and provides a greater surface area for dissipating that heat without the need for specially fabricated heatsink elements or complex milling procedures.

Abstract translation: 公开了印刷电路散热技术和组件，其增加了印刷电路组件的散热能力。 使用用于限定印刷电路板的一个表面上的端子和导电区域的图案的相同的图案或掩模蚀刻导热板。 在对应于端子和导电区域的那些区域中蚀刻板，使得在端子区域中产生孔，并且在导电区域中产生通道。 然后在通过形成在导热板中的孔的电子部件的引线附接之前，将板接合到印刷电路板。 组件吸收由电子部件产生的热量，并提供更大的表面积来消散热量，而不需要特别制造的散热元件或复杂的铣削程序。

公开(公告)号：US4427368A

公开(公告)日：1984-01-24

申请号：US359465

申请日：1982-03-18

Applicant: Boyd G. Brower

Inventor： Boyd G. Brower

IPC: G03B15/04 ,  H05K1/02 ,  H05K1/18 ,  F21K5/02

CPC classification number: H05K1/0256 ,  G03B15/0442 ,  H05K1/18 ,  H05K2201/10651 ,  Y10T29/4914

Abstract: A miniaturized multilamp photoflash array includes an envelope with a printed circuit of spaced electrical conductors on an inner surface, a plurality of flashlamps each having a pair of electrically conductive leads and a reflector unit affixed to the envelope and having a formed member forcing the conductive leads against the printed circuit and a sonic projection sealed to the envelope intermediate the spaced electrical conductors of the printed circuit.

Abstract translation: 小型化的多光束闪光灯阵列包括：具有在内表面上具有间隔电导体的印刷电路的封套，多个闪光灯，每个闪光灯具有一对导电引线和固定到封套的反射器单元，并且具有强制导电引线 针对印刷电路和在印刷电路的间隔的电导体之间密封到信封的声音突起。

公开(公告)号：US4417114A

公开(公告)日：1983-11-22

申请号：US348998

申请日：1982-02-16

Applicant: Willis A. Larson

Inventor： Willis A. Larson

IPC: H01H13/83 ,  H05K1/11 ,  H05K3/30 ,  H05K3/32 ,  H01H9/02

CPC classification number: H01H13/83 ,  H05K3/326 ,  H05K1/118 ,  H05K2201/09063 ,  H05K2201/091 ,  H05K2201/096 ,  H05K2201/10106 ,  H05K2201/1059 ,  H05K2201/10651 ,  H05K3/306

Abstract: This invention relates to an arrangement for attaching discrete electrical components to a generally flat layer of sheet material. Both mechanical and electrical connections are provided by the attachment elements of the present invention. One form of the invention is directed to a membrane switch keyboard wherein one of the layers of the membrane switch has a tail extending therefrom. The tail has a free end which is adhesively secured to some portion of the keyboard. Conductive traces are formed on the tail and extend to the free end where they contact the leads of an electrical component. The component is held between the tail and the keyboard. In another aspect, which may be applied to the membrane switch keyboard just described, the invention includes a sheet material having two or more slits cut therein for each of the component's leads. The slits are cut in a portion of the sheet having conductive traces formed thereon. The leads of the component are then interlaced through the tabs created by the slits to both mechanically and electrically connect the component to the sheet.

公开(公告)号：US4412272A

公开(公告)日：1983-10-25

申请号：US297548

申请日：1981-08-31

Applicant: Larry D. Wedertz ,  Oakley G. Ross

Inventor： Larry D. Wedertz ,  Oakley G. Ross

IPC: H05K1/18 ,  H05K3/28 ,  H05K3/34 ,  H05K7/20

CPC classification number: H05K1/189 ,  H05K3/284 ,  H05K2201/0116 ,  H05K2201/051 ,  H05K2201/10651 ,  H05K2203/1311 ,  H05K2203/1322 ,  H05K3/3447

Abstract: A flexible printed circuit card assembly includes an insulating sheet positioned over the foil of a flexible printed circuit card and adapted to accommodate the passage of electronic component leads therethrough for soldering to the printed circuit card. A layer of protective insulating foam, having a backing thereon, is positioned over the components and the assembly is rolled into a spiral configuration with leads extending from at least one end.

Abstract translation: 柔性印刷电路卡组件包括位于柔性印刷电路卡的箔上的绝缘片，并适于容纳电子元件引线通过其中以焊接到印刷电路卡。 一层保护性绝缘泡沫，其上具有背衬，位于部件上方，并且组件被卷成具有从至少一端延伸的引线的螺旋形构造。

公开(公告)号：US4347552A

公开(公告)日：1982-08-31

申请号：US140263

申请日：1980-04-14

Applicant: Robert E. Pearcy ,  James E. Raus

Inventor： Robert E. Pearcy ,  James E. Raus

IPC: H05K1/11 ,  H05K3/30 ,  H05K3/34 ,  H05K1/00

CPC classification number: H05K3/308 ,  H01R12/65 ,  H05K1/118 ,  H05K2201/10651 ,  H05K2201/1078 ,  H05K2201/10878 ,  H05K3/3447

Abstract: A lead (12) of an electrical component (10) is formed with an arrowhead-shaped tip (20) that functions to mechanically fasten the lead and component to a substrate (14), such as a flexible printed circuit (11). The tip is formed with barbs (21) extending rearwardly from the end (22) of the tip and having a width (W) across the barbs greater than the diameter (d) of a mounting hole (13) in the substrate. With this arrangement, the barbed tips may be inserted into and through the hole, with the barbs being compressed relatively inward with respect to the hole as the tip passes through the hole, so as to fasten the tips to the substrate in preparation for a soldering operation, in which the tips are soldered (30) to conductive pad areas (16) deposited on the surface of the substrate adjacent to the tips.

Abstract translation: 电气部件（10）的引线（12）形成有用于将引线和部件机械地紧固到诸如柔性印刷电路（11）的基板（14）的箭头形尖端（20）。 尖端形成有从尖端的端部（22）向后延伸的倒钩（21），并且跨越倒钩的宽度（W）大于衬底中的安装孔（13）的直径（d）。 通过这种布置，倒钩尖可以插入孔中并穿过孔，当尖端穿过孔时，倒钩相对于孔相对地被压缩，以便将尖端紧固到基底以准备焊接 操作，其中尖端焊接（30）到沉积在邻近尖端的衬底的表面上的导电焊盘区域（16）。

公开(公告)号：US4337453A

公开(公告)日：1982-06-29

申请号：US127503

申请日：1980-03-05

Applicant: Kazuyoshi Nagashima ,  Nobuyuki Furuya

Inventor： Kazuyoshi Nagashima ,  Nobuyuki Furuya

IPC: H05K1/18 ,  H05K7/06 ,  H05K13/00 ,  H01C1/01

CPC classification number: H05K7/06 ,  H05K1/18 ,  H05K13/003 ,  H05K2201/10272 ,  H05K2201/10492 ,  H05K2201/1053 ,  H05K2201/10651

Abstract: A first fundamental electrical element array which has a plurality of columnar, fundamental electrical elements with opposite wire leads, and in which the fundamental electrical elements are electrically and mechanically connected at one wire lead to a conductive bar at predetermined intervals so that they lie side by side in a common plane, and in which the other wire leads of the fundamental electrical elements serve as terminals for connection with a printed-circuit board. A second fundamental electrical element array which has a plurality of columnar, fundamental electrical elements with opposite wire leads and at least one lead wire, and in which the fundamental electrical elements are electrically and mechanically connected at one wire lead to a conductive bar at predetermined intervals together with the lead wire so that they lie side by side in a common plane, and in which the other wire leads of the fundamental electrical elements serve as terminals for connection with a printed-circuit board. A third fundamental electrical element array which has a plurality of columnar, fundamental electrical elements with opposite wire leads and at least one columnar, short-circuiting means with opposite wire leads, and in which the fundamental electrical elements and the short-circuiting means are electrically and mechanically connected at one wire lead to a conductive bar at predetermined intervals so that they lie side by side in a common plane, and in which the other wire leads of the fundamental electrical elements serve as terminals for connection with a printed-circuit board.A plurality of such first fundamental electrical element arrays are mechanically coupled together so that they are aligned side by side in a common plane.At least one such first fundamental electrical element array and at least one such second or third fundamental electrical array are mechanically coupled together so that they are aligned side by side in a common plane.

公开(公告)号：US4261773A

公开(公告)日：1981-04-14

申请号：US105681

申请日：1979-12-20

Applicant: Vaughn C. Sterling

Inventor： Vaughn C. Sterling

IPC: H01R33/09 ,  H05K1/05 ,  H05K1/09 ,  H05K3/22 ,  H05K3/30 ,  H05K3/34 ,  H01B17/26 ,  B32B3/26

CPC classification number: H01R33/09 ,  H05K3/225 ,  H05K1/053 ,  H05K1/095 ,  H05K2201/10113 ,  H05K2201/10651 ,  H05K2203/173 ,  H05K3/305 ,  H05K3/3421 ,  Y10S323/908 ,  Y10T428/12049 ,  Y10T428/12396 ,  Y10T428/20

Abstract: Means are provided to repair one or more flash lamps in a linear type photoflash lamp array which have become disconnected from the circuit board member. Specifically, the disconnected in-lead is secured to the sequential firing circuitry located on the circuit board member with an adhesive deposit of an organic polymer and a surface conductive path thereafter established on said adhesive deposit between the in-lead and the adjacent circuitry. The surface conductive path can also be an organic polymer containing an electrically conductive filler.

Abstract translation: 提供了用于修复已经与电路板构件断开的直线型闪光灯阵列中的一个或多个闪光灯的装置。 具体地，断开的引线被固定到位于电路板部件上的顺序点火电路，其中有机聚合物的粘合沉积物和其后在引线和相邻电路之间的所述粘合剂沉积物上建立的表面导电路径。 表面导电路径也可以是含有导电填料的有机聚合物。

公开(公告)号：US4246627A

公开(公告)日：1981-01-20

申请号：US20328

申请日：1979-03-14

Applicant: Helmut H. Poensgen

Inventor： Helmut H. Poensgen

IPC: H01G2/06 ,  H01G2/12 ,  H01R4/02 ,  H05K3/30 ,  H05K3/34 ,  H05K1/04

CPC classification number: H01G2/06 ,  H01G2/12 ,  H05K3/308 ,  H01R4/02 ,  H05K2201/10651 ,  H05K2201/1078 ,  H05K2201/10856 ,  H05K2201/10871 ,  H05K2201/10878 ,  H05K2203/1178 ,  H05K3/3447

Abstract: To seat an electrical circuit element in a metallized opening of a circuit board and permit escape of solder gases, a bead is placed on the insertion pin and formed with a surface facing the support board which is non-symmetrical with respect to the axis of the pin, and of the insertion opening. Preferably, the surface is conical, and on adjacent pins the cone angles are tilted in opposite directions to provide for the non-symmetrical positioning of any one cone and centered placement of the insertion pins in the insertion openings.

Abstract translation: 为了将电路元件放置在电路板的金属化开口中并允许焊接气体逸出，珠子被放置在插入销上并形成有面向支撑板的表面，该表面相对于轴线是不对称的 销和插入开口。 优选地，表面是圆锥形的，并且在相邻的销上，锥角在相反的方向上倾斜以提供将插入销的任何一个锥体和居中放置在插入开口中的非对称定位。