Abstract:
A combination backboard includes a main body to which a first bracket is coupled. The main body includes a base plate and first and second side plates perpendicularly mounted to the base plate and opposite to each other. The first and second side plates have an end forming a first coupling section adjacent to the first bracket. The first bracket includes a first bottom plate and a third side plate perpendicularly mounted to the first bottom plate. The third side plate has two ends forming resilient first coupling slots corresponding to the first coupling sections to receive and retained the first coupling sections therein for coupling the first bracket and the main body together. Also provided are a backlight module and a liquid crystal display device that use the combination backboard.
Abstract:
A thin film semiconductor device has a semiconductor layer including a mixture of an amorphous semiconductor ionic metal oxide and an amorphous insulating covalent metal oxide. A pair of terminals is positioned in communication with the semiconductor layer and define a conductive channel, and a gate terminal is positioned in communication with the conductive channel and further positioned to control conduction of the channel. The invention further includes a method of depositing the mixture including using nitrogen during the deposition process to control the carrier concentration in the resulting semiconductor layer.
Abstract:
A connecting device comprises: a first connecting element, comprising a stopping portion and at least two elastic cantilevers disposed at two ends of the stopping portion, a via hole being formed in the stopping portion between the two elastic cantilevers, and a snap-fit portion being disposed on each of the elastic cantilevers; and a second connecting element comprising an abutting portion and a push-pull portion perpendicularly connected with the abutting portion, positioning rings being disposed at both ends of the abutting portion respectively. The push-pull portion of the second connecting element is inserted through the via hole of the first connecting element, and the elastic cantilevers are inserted into the positioning rings respectively. Thus, assembly and detachment of the first connecting element and the second connecting element can be easily achieved by applying a force to the push-pull portion.
Abstract:
A process of fabricating a flexible TFT back-panel on a glass support includes a step of providing a flat glass support member sufficiently thick to prevent bending during the processing. A layer of etch stop material is positioned on the upper surface of the glass support member and an insulating buffer layer is positioned on the layer of etch stop material. A TFT back-panel is positioned on the insulating buffer layer and a flexible plastic carrier is affixed to the TFT back-panel. The glass support member is etched away, whereby a flexible TFT back-panel is provided. The TFT back-panel can include a matrix of either OLED cells or LCD cells.
Abstract:
The present invention provides a backlight module and a liquid crystal display module using the backlight module. The backlight module includes: a backplane (2), a backlight source (4) mounted in the backplane (2), and a light guide plate (6) mounted in the backplane (2). The backplane (2) includes a bottom board (22) and a plurality of side boards (24) perpendicularly connected to the bottom board (22). The backlight source (4) includes a circuit board (42) and a plurality of LED lights (44) mounted to and electrically connected with the circuit board (42). The circuit board (42) is mounted to the bottom board (22). The LED lights (44) are arranged at one side of the light guide plate (6). The circuit board (42) includes a first slope surface (422) facing the bottom board (22). A heat dissipation board (8) is arranged between the circuit board (42) and the bottom board (22). The heat dissipation board (8) includes a second slope surface (82) mateable with the first slope surface (422).
Abstract:
A method of fabricating a high mobility semiconductor metal oxide thin film transistor including the steps of depositing a layer of semiconductor metal oxide material, depositing a blanket layer of etch-stop material on the layer of MO material, and patterning a layer of source/drain metal on the blanket layer of etch-stop material including etching the layer of source/drain metal into source/drain terminals positioned to define a channel area in the semiconductor metal oxide layer. The etch-stop material being electrically conductive in a direction perpendicular to the plane of the blanket layer at least under the source/drain terminals to provide electrical contact between each of the source/drain terminals and the layer of semiconductor metal oxide material. The etch-stop material is also chemical robust to protect the layer of semiconductor metal oxide channel material during the etching process.
Abstract:
The present invention provides a backlight module and a liquid crystal display device using the backlight module. The backlight module includes: a backplane (2), a light guide plate (4) arranged in the backplane (2), a backlight source (6) arranged in the backplane (2), and an optic film assembly (8) arranged on the light guide plate (4). The backplane (2) comprises a bottom plate (22) and a plurality of side plates (24) perpendicularly connected to the bottom plate (22). The bottom plate (22) has a surface facing the light guide plate (4) and defining a curved surface (222) and the curved surface (222) comprises a curved reflection surface (224) formed thereon. The backlight module and the liquid crystal display device using the backlight module according to the present invention have simple structure and include a backplane having a bottom plate that has a surface facing the light guide plate and including a curved reflection surface having excellent reflectivity formed thereon to replace a conventionally used reflector plate so as to reduce the thickness of the liquid crystal display device, reduce the cost of manufacturing, and facilitate achievement of thinning and also preventing the light guide plate from damage caused by friction between the reflector plate and the light guide plate and thus extending the life span of the light guide plate.
Abstract:
A method of fabricating a pixelated imager includes providing a substrate with bottom contact layer and sensing element blanket layers on the contact layer. The blanket layers are separated into an array of sensing elements by trenches isolating adjacent sensing elements. A sensing element electrode is formed adjacent each sensing element overlying a trench and defining a TFT. A layer of metal oxide semiconductor (MOS) material is formed on a dielectric layer overlying the electrodes and on an exposed upper surface of the blanket layers defining the sensing element adjacent each TFT. A layer of metal is deposited on each TFT and separated into source/drain electrodes on opposite sides of the sensing element electrode. The metal forming one of the S/D electrodes contacts the MOS material overlying the exposed surface of the semiconductor layer, whereby each sensing element in the array is electrically connected to the adjacent TFT by the MOS material.
Abstract:
The present invention introduces a backlight device, a backlight system, and a flat panel display device incorporated with the backlight device. The backlight device is configured by at least two backlight units detachably and electrically interconnected. The backlight unit comprises at least first and second leadframes each including longitudinal first and second ends and an intermediate portion located between the ends. A light emitting device is disposed at the intermediate portion. And at least a pair of first and seconds leads with the first pair of leads arranged at the first end, and the second pair of leads located at the second end. The backlight, backlight system, and the flat panel display device can be readily lengthened or shortened according to the field requirements. It features a simple configuration, while is easy to assemble, and is beneficial to cost down.
Abstract:
The present invention provides a frameless liquid crystal display device, which includes a rear enclosure, a backlight module arranged inside the rear enclosure, a mold frame arranged on the backlight module and fixedly coupled to the rear enclosure, a liquid crystal display panel arranged on the mold frame, and a surface decoration arranged at a lower end of the liquid crystal display panel and mounted to the mold frame. The liquid crystal display panel is coupled to the mold frame by coupling sections, each of which includes a rectangular plate, an engagement section, and a connection section that connects the rectangular plate and the engagement section. The mold frame forms retention slots corresponding to the coupling sections and each of the retention slots including first and openings and a channel communicating with the first and second openings. The first opening is greater than the second opening.