公开(公告)号：US20240126395A1

公开(公告)日：2024-04-18

申请号：US18391848

申请日：2023-12-21

Applicant: Japan Display Inc.

Inventor： Koichi MIYASAKA ,  Yoshikatsu IMAZEKI ,  Yoichi KAMIJO ,  Shuichi OSAWA ,  Toshinori UEHARA

IPC: G06F3/044 ,  G02F1/1333 ,  G02F1/1343 ,  G06V40/13

CPC classification number: G06F3/0446 ,  G02F1/13338 ,  G02F1/134309 ,  G06V40/1306

Abstract: According to an aspect, a detection device includes: drive electrodes; detection electrodes; and dummy electrodes in a floating state. The drive electrodes include a first electrode extending in a first direction, and a second electrode disposed at a predetermined interval from the first electrode in a second direction intersecting the first direction. The detection electrodes include a third electrode extending in the second direction. The dummy electrodes include a fourth electrode disposed at a predetermined interval from the third electrode in the first direction. The first electrode includes a first extension part, a second extension part, and a first coupling part. The second electrode includes a third extension part, a fourth extension part, and a second coupling part. The third electrode includes a fifth extension part, a sixth extension part, and a third coupling part. The fourth electrode includes a seventh extension part, and an eighth extension part.

公开(公告)号：US20240126391A1

公开(公告)日：2024-04-18

申请号：US18486210

申请日：2023-10-13

Applicant: Japan Display Inc.

Inventor： Hiroumi KINJO ,  Masatomo HISHINUMA

IPC: G06F3/041 ,  G06F3/042 ,  G06F3/044

CPC classification number: G06F3/04164 ,  G06F3/0421 ,  G06F3/0447

Abstract: A detection device includes a substrate having a detection region, a coupling region, and a wiring region between the detection region and the coupling region, a plurality of detection elements disposed in the detection region of the substrate, a plurality of terminals disposed in the coupling region of the substrate and electrically coupled to the detection elements, a plurality of coupling wires adjacently disposed with a gap interposed therebetween in the wiring region of the substrate and electrically coupling the detection elements to the terminals, an insulating layer provided to the wiring region of the substrate and covering the coupling wires, and a plurality of through holes formed in the wiring region of the substrate and passing through the substrate and the insulating layer in a thickness direction between the coupling wires.

公开(公告)号：US11961491B2

公开(公告)日：2024-04-16

申请号：US18204482

申请日：2023-06-01

Applicant: Japan Display Inc.

Inventor： Katsuya Anzai ,  Hideki Kawada ,  Hiroshi Matsuda ,  Yukitada Iwasaki

IPC: G09G3/36 ,  G09G3/20 ,  G09G3/3225 ,  G09G3/3266 ,  G09G3/3275 ,  H10K59/131

CPC classification number: G09G3/3677 ,  G09G3/2096 ,  G09G3/3225 ,  G09G3/3266 ,  G09G3/3275 ,  G09G3/3648 ,  G09G3/3688 ,  G09G2300/0408 ,  G09G2300/0426 ,  G09G2300/0465 ,  G09G2310/0232 ,  H10K59/131

Abstract: An electro-optical device is provided and includes a plurality of first signal lines extending in a first direction on a substrate; a plurality of second signal lines extending in a second direction on the substrate, the second direction intersecting the first direction; a pixel area in which a plurality of pixel electrodes are disposed; an outer peripheral edge of the pixel area having a curved portion or a bent portion; and a first circuit block, a second circuit block, and a third circuit block arranged along the outer peripheral edge, wherein the second circuit block is arranged between the first circuit block and the first circuit block, and a first gap between the first circuit bock and the second circuit block is different from a second gap between the second circuit block and the third circuit block.

公开(公告)号：US20240118575A1

公开(公告)日：2024-04-11

申请号：US18390270

申请日：2023-12-20

Applicant: Japan Display Inc.

Inventor： Takayuki IMAI ,  Kojiro IKEDA ,  Takeo KOITO

IPC: G02F1/1347 ,  G02F1/1343 ,  G02F1/1362

CPC classification number: G02F1/1347 ,  G02F1/134309 ,  G02F1/13439 ,  G02F1/136286

Abstract: An optical device includes an optical element including a liquid crystal cell configured to distribute light emitted from a light source, a power supply part configured to generate first and second potentials, a control signal generation circuit part configured to generate a control signal that controls a pulse width of each of the first and second potentials, and a switch circuit part configured to output a first potential signal including the first potential with a first pulse width and the second potential with a second pulse width based on the control signal. The liquid crystal cell includes a first substrate on which first and second transparent electrodes are alternately arranged in a first direction, and a second substrate on which third and fourth transparent electrodes are alternately arranged in a second direction. The first potential signal is input to the first transparent electrode.

公开(公告)号：US11955492B2

公开(公告)日：2024-04-09

申请号：US17447958

申请日：2021-09-17

Applicant: Japan Display Inc.

Inventor： Yoshinori Aoki ,  Yasuhiro Kanaya ,  Akihiro Ogawa

IPC: H01L27/12 ,  H01L25/16 ,  H01L33/62

CPC classification number: H01L27/124 ,  H01L25/167 ,  H01L27/1255 ,  H01L33/62

Abstract: According to one embodiment, a display device includes a display panel including a display area for displaying an image, and the display panel includes an insulating substrate, a first electrode, a first organic insulating layer, an inorganic insulating layer, a pixel electrode, a second organic insulating layer, and a pad portion. The inorganic insulating layer includes a first opening for electrically connecting the first electrode to the pixel electrode. The second organic insulating layer includes a second opening for electrically connecting the pixel electrode to the pad portion. The pixel electrode is formed of a transparent conductive material.

公开(公告)号：US20240114749A1

公开(公告)日：2024-04-04

申请号：US18477586

申请日：2023-09-29

Applicant: Japan Display Inc.

Inventor： Kaichi FUKUDA

IPC: H10K59/80 ,  H10K59/12 ,  H10K59/35 ,  H10K71/60

CPC classification number: H10K59/80517 ,  H10K59/1201 ,  H10K59/352 ,  H10K59/80516 ,  H10K59/80518 ,  H10K71/60 ,  H10K2102/351

Abstract: According to one embodiment, a display device includes first and second base electrodes, a rib, first and second lower electrodes, first and second organic layers, and an upper electrode. A peripheral portion of each of the first base electrode and the second base electrode is covered with the rib. Each of the first base electrode and the second base electrode is formed of a first metal material. A peripheral portion of each of the first lower electrode and the second lower electrode is located on the rib. Each of the first lower electrode and the second lower electrode is formed of a second metal material different from the first metal material. A thickness of the first lower electrode is different from a thickness of the second lower electrode.

公开(公告)号：US20240113228A1

公开(公告)日：2024-04-04

申请号：US18479934

申请日：2023-10-03

Applicant: Japan Display Inc.

Inventor： Hajime WATAKABE ,  Masashi TSUBUKU ,  Toshinari SASAKI ,  Akihiro HANADA ,  Takaya TAMARU

IPC: H01L29/786 ,  H01L21/02 ,  H01L21/425 ,  H01L21/4757 ,  H01L29/423 ,  H01L29/49 ,  H01L29/66

CPC classification number: H01L29/7869 ,  H01L21/02565 ,  H01L21/02631 ,  H01L21/425 ,  H01L21/47576 ,  H01L29/42384 ,  H01L29/4908 ,  H01L29/66969 ,  H01L29/78633 ,  H01L29/78696 ,  H01L2029/42388

Abstract: A semiconductor device according to an embodiment includes: an oxide insulating layer; an oxide semiconductor layer; a gate electrode; a gate insulating layer; and a first insulating layer, wherein the semiconductor device is divided into a first to a third regions, a thickness of the gate insulating layer in the first region is 200 nm or more, the gate electrode contacts the first insulating layer in the first region, the oxide semiconductor layer contacts the first insulating layer in the second region, an amount of impurities contained in the oxide semiconductor layer in the second region is greater than an amount of impurities contained in the oxide semiconductor layer in the first region, and an amount of impurities contained in the oxide insulating layer in the third region is greater than an amount of impurities contained in the oxide insulating layer in the second region.

公开(公告)号：US20240113227A1

公开(公告)日：2024-04-04

申请号：US18476910

申请日：2023-09-28

Applicant: Japan Display Inc.

Inventor： Hajime WATAKABE ,  Masashi TSUBUKU ,  Toshinari SASAKI ,  Akihiro HANADA ,  Takaya TAMARU

IPC: H01L29/786 ,  H01L29/423

CPC classification number: H01L29/7869 ,  H01L29/42384

Abstract: A method for manufacturing semiconductor device according to an embodiment includes: forming an oxide semiconductor layer above a substrate; forming a gate insulating layer above the oxide semiconductor layer; forming a metal oxide layer containing aluminum as a main component above the gate insulating layer; performing a heat treatment in a state where the metal oxide layer is formed above the gate insulating layer; removing the metal oxide layer after the heat treatment; and forming a gate electrode above the gate insulating layer.

公开(公告)号：US11949048B2

公开(公告)日：2024-04-02

申请号：US17212133

申请日：2021-03-25

Applicant: Japan Display Inc.

Inventor： Masaaki Takuma ,  Mao Izawa

IPC: H01L33/48 ,  F21S2/00 ,  G02F1/1335 ,  G02F1/13357 ,  H01L25/075 ,  H01L27/15 ,  H01L33/56 ,  H01L33/58 ,  H01L33/62

CPC classification number: H01L33/486 ,  H01L27/156 ,  H01L33/56 ,  H01L33/62

Abstract: According to one embodiment, an illumination device comprises a first mounting board including a plurality of first light emitting elements, a second mounting board including a plurality of second light emitting elements, and a first wiring board including a first wiring line electrically connected to at least one of the plurality of first light emitting elements and the plurality of second light emitting elements. The first mounting board and the second mounting board extend in a first direction and are arranged along a second direction intersecting the first direction. The first wiring board is superposed on the first mounting board and the second mounting board. The first wiring board has rigidity that is lower than rigidity of each of the first mounting board and the second mounting board.

公开(公告)号：US11948908B2

公开(公告)日：2024-04-02

申请号：US17304566

申请日：2021-06-23

Applicant: Japan Display Inc.

Inventor： Kazuyuki Yamada

IPC: H01L23/00 ,  H01L25/16

CPC classification number: H01L24/30 ,  H01L24/83 ,  H01L25/167 ,  H01L24/29 ,  H01L24/32 ,  H01L24/98 ,  H01L2224/29286 ,  H01L2224/2929 ,  H01L2224/29291 ,  H01L2224/29339 ,  H01L2224/3003 ,  H01L2224/32145 ,  H01L2224/83052 ,  H01L2224/83986 ,  H01L2924/12041

Abstract: An electronic device comprising: an array substrate having a first electrode and a second electrode; a first connecting member arranged on the first electrode; a first LED chip mounted on the first connecting member; a second connecting member arranged on the second electrode and being thicker than the first connecting member; and a second LED chip mounted on the second connecting member. A distance from a reference surface of the array substrate to a top surface of the second connecting member is larger than a distance from the reference surface to a top surface of the first connecting member.