Abstract:
The operation of a bipolar transistor is controlled comprising by producing a first voltage that is a product of a static collector current of the bipolar transistor times an emitter resistance. The first voltage is then compared to a predetermined reference voltage to produce a control signal. Current is then injected a base of the bipolar transistor in response to the control signal. In a specific implementation, the first voltage, which is a product of the static collector current (Ic) of the bipolar transistor times its emitter resistance (RE) , is slaved to a predetermined reference voltage (Vref) whose value is substantially equal, to within a tolerance, to 13 mV at a temperature at or about 27° C.
Abstract:
A method of approximation of the respective colors of pixels of a digital image by selecting, from a look-up table and successively for each pixel of the image, a color, the code of which comes close with the smallest error to the sum of the code of the current pixel color and of a correction term, in which the correction term is equal to the smallest error calculated upon approximation of a preceding pixel, assigned with a weighting coefficient depending on the position of the current pixel in the image.
Abstract:
A method of manufacturing a bipolar transistor in a P-type substrate, including the steps of forming in the substrate a first N-type area; forming by epitaxy a first silicon layer; forming in this first layer, and substantially above the first area a second heavily-doped P-type area separate from the second area; forming at the periphery of this second area a third N-type area; forming by epitaxy a second silicon layer; forming a deep trench crossing the first and second silicon layers, penetrating into the substrate and laterally separating the second area from the third area; and performing an anneal such that the dopant of the third area is in continuity with that of the first area.
Abstract:
The vertical transistor includes, on a semiconductor substrate, a vertical pillar 5 having one of the source and drain regions at the top, the other of the source and drain regions being situated in the substrate at the periphery of the pillar, a gate dielectric layer 7 situated on the flanks of the pillar and on the top surface of the substrate, and a semiconductor gate resting on the gate dielectric layer. The gate includes a semiconductor block having a first region 800 resting on the gate dielectric layer 7 and a second region 90 facing at least portions of the source and drain regions and separated from those source and drain region portions by dielectric cavities 14S, 14D.
Abstract:
A process for fabricating a strained layer of silicon or of a silicon/germanium alloy, includes: a) the formation of a layer (2) of silicon or of a silicon/germanium alloy on a layer (1) of a material having a modifiable lattice parameter; and b) the modification of the lattice parameter.
Abstract:
A method for controlling cells of a plasma screen of array type, formed of cells arranged at the intersections of lines and columns, including the step of sequentially applying to each line an activation potential and, during the activation of a line, applying an activation potential to selected columns, in which, while a line is activated, the selected columns are non-simultaneously activated.
Abstract:
The present invention relates to a method for checking and refreshing a floating-gate transistor in the erased state, comprising the steps of applying a positive erase voltage to a control gate of the floating-gate transistor, and selectively applying a positive erase voltage to the drain of the floating-gate transistor, by means of a programming latch for example. Application to checking and refreshing memory pages in a Flash memory.
Abstract:
The forming of a contact with a deep region of a first conductivity type formed in a silicon substrate. The contact includes a doped silicon well region of the first conductivity type and an intermediary region connected between the deep layer and the well. This intermediary connection region is located under a trench. The manufacturing method enables forming of vertical devices, in particular fast bipolar transistors.
Abstract:
An integrated circuit memory includes a FLASH memory including a circuit for recording a word presented on its input without the possibility of recording simultaneously several words in parallel. The integrated circuit memory may include a buffer memory with a sufficient capacity to store a plurality of words, the output of which is coupled to the input of the FLASH memory. A circuit is also included for recording into the buffer memory a series of words to be recorded into the FLASH memory and recording into the FLASH memory the words first recorded into the buffer memory.
Abstract:
A ramp capacitor CAP1 has a first terminal connected to a power supply voltage VBAT. A generator circuit is connected to a second terminal of the ramp capacitor and adapted to generate a voltage ramp at the terminals of the ramp capacitor. The generator circuit includes a constant current source SCC connected to the second terminal B12 of the ramp capacitor CAP1 and auxiliary circuit MAX adapted in the presence of a transient variation of the power supply voltage to determine the transient current flowing in the ramp capacitor and generated by the transient variation. Responsive thereto, delivery is made to the second terminal B12 of the ramp capacitor CAP1 of a charging current equal to the algebraic sum of the constant current delivered by the constant current source and an auxiliary current equal and opposite to the transient current.