公开(公告)号：USD661821S1

公开(公告)日：2012-06-12

申请号：US29376493

申请日：2010-10-07

申请人： Orsolya Veres ,  Istvan Bakk

设计人： Orsolya Veres ,  Istvan Bakk

公开(公告)号：US08132939B2

公开(公告)日：2012-03-13

申请号：US12371295

申请日：2009-02-13

申请人： Christoph Platzer ,  Bernd Skopec

发明人： Christoph Platzer ,  Bernd Skopec

IPC分类号： F21V9/00

CPC分类号： A47F11/10 ,  F21K9/00 ,  F21W2131/405 ,  F21Y2115/10 ,  H01L33/504

摘要： An LED module with a blue LED chip, over which is arranged a conversion layer, which has a luminous material mixture mixing a further proportion of greater wavelength into the blue light, so that a reddish or greenish or yellowish white light is emitted from the LED module, the emitted light of the LED module having a peak or secondary peak in the red or green or yellow range.

摘要翻译： 具有蓝色LED芯片的LED模块，其上设置有转换层，其具有将更大比例的更大波长混合到蓝色光中的发光材料混合物，使得从LED发射红色或绿色或淡黄色的白色光 模块，LED模块的发射光具有红色或绿色或黄色范围内的峰值或次级峰值。

公开(公告)号：US20110309396A1

公开(公告)日：2011-12-22

申请号：US12935559

申请日：2009-04-01

申请人： Yangi Wang ,  Hiroaki Kawaguchi ,  Friedrich Wagner

发明人： Yangi Wang ,  Hiroaki Kawaguchi ,  Friedrich Wagner

IPC分类号： H01L33/50 ,  H01L29/02 ,  H01L33/62

CPC分类号： H01L33/62 ,  H01L24/73 ,  H01L33/486 ,  H01L33/54 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/01068 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An LED module comprises a platform having a recession, wherein the recession presents a center section with a bottom and an enlarged section surrounding the center portion. An LED chip is arranged on the bottom of the center section. A bond wire leads from the LED chip to the bottom of the enlarged section in order to contact a first electrode of the LED chip. In one embodiment the bond wire is electrically connected to the back side of the platform by means of a through contact leading from the bottom of the enlarged section through the platform to the backside of the platform. In another embodiment a first conducting path leads from a first electrode of the LED chip across the side wall of the recession to the surface of the platform and from there across a lateral wall of the platform to the back side of the platform. A second conducting path, electrically isolated from the first conducting path, leads from a second electrode of the LED chip across the side wall of the recession to the to surface of the platform and from there across a lateral wall of the platform to the back side of the platform.

摘要翻译： LED模块包括具有凹陷的平台，其中所述凹部具有带有底部的中心部分和围绕所述中心部分的放大部分。 LED芯片布置在中心部分的底部。 接合线从LED芯片引出到放大部分的底部，以便接触LED芯片的第一电极。 在一个实施例中，接合线通过从扩大部分的底部穿过平台引导到平台的后侧的通过接触端电连接到平台的后侧。 在另一个实施例中，第一导电路径从LED芯片的第一电极跨越凹陷的侧壁穿过平台的表面，并且从那里穿过平台的侧壁到达平台的背面。 与第一导电路径电隔离的第二导电路径从LED芯片的第二电极穿过凹陷的侧壁穿过平台的表面，并从该平台的侧壁穿过平台的侧壁 的平台。

公开(公告)号：US20110186885A1

公开(公告)日：2011-08-04

申请号：US12812453

申请日：2008-12-22

申请人： Marko Schweighart

发明人： Marko Schweighart

IPC分类号： H01L33/50 ,  H01L33/62

CPC分类号： H01L33/62 ,  H01L24/48 ,  H01L24/49 ,  H01L33/483 ,  H01L2224/48464 ,  H01L2224/48998 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01067 ,  H01L2924/01068 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/85399 ,  H01L2224/05599

摘要： The invention relates to an LED assembly comprising a carrier (T, T′), at least one LED chip (2, 102) which is arranged on the carrier (T, T′), the LED chip (2, 102) being connected to at least one bonding wire (3, 103), a transparent layer (8, 108) applied over the LED chip (2, 102) and a frame (4, 104) which surrounds the at least one LED chip (2, 102). The frame (4, 104) comprises at least one web (5, 105) so as to divide the frame (4, 104) into at least a first frame region (6, 106), which comprises the at least one LED chip (2, 102), and at least a second frame region (7, 107). The first frame region (6, 106) laterally delimits the layer (8, 108) and the second frame region (7, 107) forms a protective region for the at least one bonding wire (3, 103). By means of the assembly according to the invention, an LED assembly can be achieved which is of simple construction, can be easily assembled and also effectively protects the bonding wires against mechanical influences.

摘要翻译： 本发明涉及一种包括载体（T，T'），布置在载体（T，T'）上的至少一个LED芯片（2,102）的LED组件，所述LED芯片（2,102）被连接 至少一个接合线（3,103），施加在所述LED芯片（2,102）上的透明层（8,108）和围绕所述至少一个LED芯片（2,102）的框架（4,104） ）。 框架（4,104）包括至少一个腹板（5,105），以将框架（4,104）分成至少一个第一框架区域（6,106），该第一框架区域包括至少一个LED芯片 2,102）和至少第二框架区域（7,107）。 第一框架区域（6,106）横向限定层（8,108），并且第二框架区域（7,107）形成用于至少一个接合线（3,103）的保护区域。 通过根据本发明的组件，可以实现一种简单结构的LED组件，可以容易地组装，并且还有效地保护接合线免受机械影响。

公开(公告)号：US20100288972A1

公开(公告)日：2010-11-18

申请号：US12738213

申请日：2008-10-14

申请人： Sven Roesler ,  Sylke Rösler ,  Detlef STARICK ,  Sven Rösler ,  Anne Charlotte Antoinette Delsing ,  Cheng-Jun Duan

发明人： Sven Roesler ,  Sylke Rösler ,  Detlef STARICK ,  Sven Rösler ,  Anne Charlotte Antoinette Delsing ,  Cheng-Jun Duan

IPC分类号： C09K11/59

CPC分类号： C09K11/0883 ,  C09K11/773 ,  C09K11/7734

摘要： The invention relates to a method of manufacturing a rare-earth doped alkaline-earth silicon nitride phosphor of a stoichiometric composition. Said method comprising the step of selecting one or more compounds each comprising at least one element of the group comprising the rare-earth elements (RE), the alkaline-earth elements (AE), silicon (Si) and nitrogen (N) and together comprising the necessary elements to form the rare-earth doped alkaline-earth silicon nitride phosphor (AE2Si5N8:RE). The method further comprises the step of bringing the compounds at an elevated temperature in reaction for forming the rare-earth doped alkaline-earth silicon nitride phosphor (AE2Si5N8:RE). In such a method normally a small amount of oxygen, whether intentionally or not-intentionally added, will be incorporated in the rare-earth doped alkaline-earth silicon nitride phosphor (AE2Si5N8:RE). According to the invention the creation of defects by formation of a non-stoichiometric oxygen containing phosphor is at least partly prevented by partly substituting for the ions (AE, Si, N) of the alkaline-earth silicon nitride phosphor (AE2Si5N8:RE) suitable further elements of the periodic system by which vacancies are created, filled or annihilated resulting in the formation of a modified alkaline-earth silicon nitride phosphor (AE2Si5N8:RE) having a stoichiometric composition. In this way a modified phosphor is obtained having excellent and stable optical properties. The invention further relates to a modified phosphor obtainable by the above-mentioned method and a radiation converting device comprising such a phosphor.

摘要翻译： 本发明涉及一种制备化学计量组成的稀土掺杂碱土金属氮化硅荧光体的方法。 所述方法包括选择一种或多种化合物的步骤，每种化合物包含稀土元素（RE），碱土元素（AE），硅（Si）和氮（N）的组中的至少一种元素并在一起 包括形成稀土掺杂的碱土金属氮化硅荧光体（AE2Si5N8：RE）所必需的元素。 该方法还包括使化合物在升高的温度下反应以形成稀土掺杂的碱土金属氮化硅荧光体（AE2Si5N8：RE）的步骤。 在这种方法中，通常将少量的氧，无论有意或没有有意添加，都将被掺入稀土掺杂的碱土金属氮化硅荧光体（AE2Si5N8：RE）中。 根据本发明，通过部分代替碱土金属氮化硅荧光体（AE2Si5N8：RE）中的离子（AE2Si5N8：RE），至少部分地替代了通过形成非化学计量的含氧荧光体来产生缺陷， 产生空位的周期性系统的另外的元素，填充或消除，导致形成具有化学计量组成的改性碱土金属氮化硅荧光体（AE2Si5N8：RE）。 以这种方式获得具有优异且稳定的光学性质的改性荧光体。 本发明还涉及通过上述方法获得的改性荧光体和包含这种荧光体的辐射转换装置。

公开(公告)号：US20100271836A1

公开(公告)日：2010-10-28

申请号：US12769566

申请日：2010-04-28

申请人： Istvan Bakk

发明人： Istvan Bakk

IPC分类号： B60Q1/04 ,  H01J61/52

CPC分类号： F21V29/006 ,  F21K9/00 ,  F21S41/141 ,  F21S41/28 ,  F21S45/47 ,  F21S45/60 ,  F21S48/335 ,  F21V3/04 ,  F21V29/004 ,  F21V29/506 ,  F21V29/60 ,  F21V29/70 ,  F21Y2101/02 ,  F21Y2115/10

摘要： Embodiments of the present invention generally relate to an LED lamp having a heat dissipating means as well as a headlamp (to be mounted e.g. to the front of a vehicle such as e.g. a car or a truck) comprising said LED lamp. Embodiments of the present invention also generally relate to a method for dissipating heat from an LED lamp.

摘要翻译： 本发明的实施例一般涉及一种具有散热装置的LED灯以及包括所述LED灯的前照灯（例如安装在诸如汽车或卡车的车辆的前方）。 本发明的实施例还通常涉及一种用于从LED灯散热的方法。

公开(公告)号：US20100002450A1

公开(公告)日：2010-01-07

申请号：US12526206

申请日：2007-12-11

申请人： Peter Pachler ,  Stefan Tasch

发明人： Peter Pachler ,  Stefan Tasch

IPC分类号： F21V3/00 ,  H01J9/00

CPC分类号： H01L33/58 ,  H01L25/0753 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2933/0058 ,  H01L2924/00

摘要： An LED module comprises an LED chip mounted on a substrate, a lens, and a metal holder mechanically holding the lens and being soldered on the substrate. The holder can be designed such that it holds the lens such that there is an air gap between the light exit surface of the LED chip and the bottom face of the lens.

摘要翻译： LED模块包括安装在基板上的LED芯片，透镜和机械地保持透镜并被焊接在基板上的金属保持器。 保持器可以被设计成使得其保持透镜，使得在LED芯片的光出射表面和透镜的底面之间存在气隙。