公开(公告)号：US11296270B2

公开(公告)日：2022-04-05

申请号：US16957185

申请日：2018-12-26

Applicant: ams Sensors Singapore Pte. Ltd.

Inventor： Bojan Tesanovic ,  Nicola Spring

IPC: H01L33/62 ,  H01L31/02 ,  H01L31/0203 ,  H01L31/0232 ,  H01L33/54 ,  H01L33/58 ,  H01S5/02 ,  H01S5/02216 ,  H01S5/02325

Abstract: Optoelectronic modules exhibiting relatively small thickness and methods for their manufacture are disclosed. The optoelectronic modules include substrates and transparent covers. Each optoelectronic module includes a transparent substrate on which an optoelectronic component is mounted. The optoelectronic component can be sensitive to and/or operable to generate a particular wavelength of electromagnetic radiation. The transparent substrate is transmissive to the particular wavelength of electromagnetic radiation. In some instances, the transparent substrate is composed, at least partially of glass.

公开(公告)号：US20210394470A1

公开(公告)日：2021-12-23

申请号：US17288735

申请日：2019-11-01

Applicant: ams Sensors Singapore Pte. Ltd.

Inventor： Uros Markovic

IPC: B29D11/00 ,  G02B3/00

Abstract: A method includes: providing a substrate, in which a first surface of the substrate includes at least one optical element module region defining an area in which multiple optical elements are to be disposed; forming, for each optical element module region on the first surface of the substrate, a corresponding reflow waste channel in the first surface of the substrate and around a perimeter of the optical element module region; providing a first optical element mold, in which a surface of the first optical element mold includes multiple first cavities, each first cavity defining a shape of a corresponding optical element of the multiple optical elements; providing resin globules between the surface of the optical element mold and the first surface of the substrate; and compressing the first optical element mold to the first surface of the substrate so that the resin fills the multiple first cavities, and so that excess resin flows into the reflow waste channel.

公开(公告)号：US11145796B2

公开(公告)日：2021-10-12

申请号：US16919556

申请日：2020-07-02

Applicant: ams Sensors Singapore Pte. Ltd.

Inventor： Simon Gubser ,  Mario Cesana ,  Markus Rossi ,  Hartmut Rudmann

IPC: H01L33/56 ,  H01L31/0232 ,  H01L27/146 ,  H01L23/00 ,  H01L31/0203 ,  H01L31/18 ,  H01L33/00 ,  H01L33/58 ,  H01L51/52 ,  H01L51/56 ,  H01S5/02 ,  H01S5/183 ,  H01L31/0216 ,  H01L33/44 ,  H01L33/48 ,  H01L33/54

Abstract: Various optoelectronic modules are described and include one or more optoelectronic devices. Each optoelectronic module includes one or more optoelectronic devices. Sidewalls laterally surround each optoelectronic device and can be in direct contact with sides of the optoelectronic device or, in some cases, with an overmold surrounding the optoelectronic device. The sidewalls can be composed, for example, of a vacuum injected material that is non-transparent to light emitted by or detectable by the optoelectronic device. The module also includes a passive optical element. Depending on the implementation, the passive optical element can be on a cover for the module, directly on a top surface of the optoelectronic device, or on an overmold surrounding the optoelectronic device. Methods of fabricating such modules are described as well, and can facilitate manufacturing the modules using wafer-level processes.

公开(公告)号：US20210293584A1

公开(公告)日：2021-09-23

申请号：US17262513

申请日：2019-08-29

Applicant: ams Sensors Singapore Pte. Ltd.

Inventor： Vijay Ele ,  Niwin Gnaniah

IPC: G01D5/347

Abstract: An optical encoder system is disclosed comprising a movable target arranged to provide a varying reflectance dependent on a position of the target within the system. An emitter is positioned on a first side of the target to illuminate the target and a sensor is positioned on the first side of the target to sense a reflectance from the target, wherein the sensed reflectance is dependent on the position of the target within the system. Also disclosed are a target and a sensor module for use in such a system, a device comprising such a system and a method of determining the position of a moving target using such a system.

公开(公告)号：US11018269B2

公开(公告)日：2021-05-25

申请号：US16073418

申请日：2017-02-21

Applicant: AMS SENSORS SINGAPORE PTE. LTD.

Inventor： Qichuan Yu ,  Hartmut Rudmann ,  Ji Wang ,  Kian Siang Ng ,  Simon Gubser ,  James Eilertsen ,  Sundar Raman Gnana Sambandam

IPC: H01L33/58 ,  H01L33/54 ,  H01L33/00 ,  H01L33/44 ,  H01L33/48 ,  H01L31/0203 ,  G01S7/481 ,  H01L25/16 ,  G01S17/02 ,  H01L23/00 ,  H01L31/0216 ,  H01L31/0232 ,  H01L31/18 ,  G01S17/04

Abstract: The wafer-level manufacturing method makes possible to manufacture ultrathin optical devices such as opto-electronic modules. A clear encapsulation is applied to an initial wafer including active optical components and a wafer-size substrate. Thereon, a photostructurable opaque coating is produced which includes apertures. Then, trenches are produced which extend through the clear encapsulation and establish side walls of intermediate products. Then, an opaque encapsulation is applied to the intermediate products, thus filling the trenches. Cutting through the opaque encapsulation material present in the trenches, singulated optical modules are produced, wherein side walls of the intermediate products are covered by the opaque encapsulation material. The wafer-size substrate can be attached to a rigid carrier wafer during most process steps.

公开(公告)号：US20210135077A1

公开(公告)日：2021-05-06

申请号：US17148087

申请日：2021-01-13

Applicant: ams Sensors Singapore Pte. Ltd.

Inventor： Tobias Senn ,  Julien Boucart ,  Susanne Westenhöfer

IPC: H01L33/64 ,  H01L27/146 ,  H01L33/00 ,  H01L33/48 ,  H01L33/56 ,  H01S5/024 ,  H01S5/0231 ,  H01S5/0236

Abstract: An optoelectronic module includes a spacer with an optical component mounting surface, a fluid permeable channel, and a module mounting surface. The fluid permeable channel and module mounting surface allow the channels to be sealed to foreign matter during certain manufacturing steps and to remain free from blockages, such as solidified flux, during certain manufacturing steps. Further, the channels can permit heat to escape from the optoelectronic module during operation.

公开(公告)号：US10928642B2

公开(公告)日：2021-02-23

申请号：US16630918

申请日：2018-07-18

Applicant: ams Sensors Singapore Pte. Ltd.

Inventor： Dmitry Bakin ,  Markus Rossi

IPC: G02B27/42 ,  G01B11/25 ,  G02B13/22

Abstract: Structured light projection system includes an array of light emitting devices, which is configured to emit a pattern of light. A projection lens is configured to receive and project the pattern of light from the array to a first optical element. The first optical element alters the pattern of light to generate a first emitted pattern of light that is irregular. The first emitted pattern of light is transmitted to a second optical element that is configured to receive the first pattern of light and reproduce the first emitted pattern along a second emitted pattern, which comprises multiple instances of the first emitted pattern arranged in a tiled pattern.

公开(公告)号：US20210041650A1

公开(公告)日：2021-02-11

申请号：US16978736

申请日：2019-02-27

Applicant: ams Sensors Singapore Pte. Ltd.

Inventor： Qi Chuan YU ,  Hartmut RUDMANN ,  Ji WANG ,  Kam Wah LEONG ,  Kim Lung NG

IPC: G02B6/42 ,  H01L33/56 ,  H01L27/146 ,  H01L31/0232

Abstract: An apparatus includes an optoelectronic component mounted to a PCB substrate. A transmissive adhesive is disposed directly on the optoelectronic component and is transmissive to light of a wavelength sensed by, or emitted by, the optoelectronic component. The apparatus includes an optical filter disposed directly on the transmissive adhesive. An epoxy laterally surrounds and is in contact with side surfaces of the transmissive adhesive and the optical filter. The epoxy is non-transmissive to light of a wavelength sensed by, or emitted by, the optoelectronic component. In some cases, the epoxy defines a recess directly over the optical filter to accommodate an optical component, such as an optical diffuser. Methods of fabricating the modules are disclosed as well.

公开(公告)号：US20200319321A1

公开(公告)日：2020-10-08

申请号：US16895231

申请日：2020-06-08

Applicant: ams Sensors Singapore Pte. Ltd.

Inventor： Jens Kubacki ,  Jim Lewis ,  Miguel Bruno Vaello Paños ,  Michael Lehmann ,  Stephan Beer ,  Bernhard Buettgen ,  Daniel Pérez Calero ,  Bassam Hallal

IPC: G01S7/497 ,  G01S17/36 ,  G01S17/89 ,  G01S7/481 ,  G01J1/42 ,  G01J1/02 ,  G01J1/04

Abstract: An optoelectronic module including a light emitter to generate light to be emitted from the module; a plurality of spatially distributed light sensitive elements arranged to detect light from the emitter that is reflected by an object outside the module; and one or more dedicated spurious-reflection detection pixels.

公开(公告)号：US20200319320A1

公开(公告)日：2020-10-08

申请号：US16895224

申请日：2020-06-08

Applicant: ams Sensors Singapore Pte. Ltd.

Inventor： Jens Kubacki ,  Jim Lewis ,  Miguel Bruno Vaello Paños ,  Michael Lehmann ,  Stephan Beer ,  Bernhard Buettgen ,  Daniel Pérez Calero ,  Bassam Hallal

IPC: G01S7/497 ,  G01S17/36 ,  G01S17/89 ,  G01S7/481 ,  G01J1/42 ,  G01J1/02 ,  G01J1/04

Abstract: An optoelectronic module including a light emitter to generate light to be emitted from the module, a plurality of spatially distributed light sensitive elements arranged to detect light from the emitter that is reflected by an object outside the module, and one or more dedicated spurious-reflection detection pixels.