中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

35 records (took 0.019 seconds)

    Heat dissipating structure and semiconductor package with the same
    22.
    发明申请
    Heat dissipating structure and semiconductor package with the same 有权
    散热结构和半导体封装相同

    公开(公告)号：US20050056926A1

    公开(公告)日：2005-03-17

    申请号：US10851288

    申请日：2004-05-21

    Applicant: Chin-Te Chen ,  Chang-Fu Lin

    Inventor： Chin-Te Chen ,  Chang-Fu Lin

    IPC: H01L23/10 ,  H01L23/36 ,  H01L23/495

    CPC classification number: H01L23/10 ,  H01L23/36 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/16251 ,  H01L2924/163 ,  H01L2924/16315 ,  H01L2924/00

    Abstract: A heat dissipating structure and a semiconductor package with the same are proposed. A substrate is used to accommodate at least one chip thereon, and the chip is electrically connected to the substrate. A heat dissipating structure having a flat portion and a support portion is mount on the substrate via the support portion by means of an adhesive. At least one groove is formed on the support portion and at least one air vent is formed around the groove to allow the groove to communicate with the outside via the air vent, such that the adhesive is allowed to fill the groove to expel air from the groove to the atmosphere through the air vent, thereby preventing the air from trapped in the groove.

    Abstract translation: 提出了一种散热结构及其半导体封装。 衬底用于容纳至少一个芯片，芯片电连接至衬底。 具有平坦部分和支撑部分的散热结构通过粘合剂经由支撑部分安装在基板上。 在支撑部分上形成至少一个凹槽，并且围绕凹槽形成至少一个排气孔，以允许凹槽经由排气口与外部连通，使得允许粘合剂填充凹槽以从空气中排出空气 通过排气口到大气中，从而防止空气被捕获在槽中。

    Semiconductor package and fabrication method thereof
    24.
    发明授权
    Semiconductor package and fabrication method thereof 有权
    半导体封装及其制造方法

    公开(公告)号：US08698326B2

    公开(公告)日：2014-04-15

    申请号：US11900345

    申请日：2007-09-10

    Applicant: Wen-Home Huang ,  Wen-Tsung Tseng ,  Chang-Fu Lin ,  Ho-Yi Tsai ,  Cheng-Hsu Hsiao

    Inventor： Wen-Home Huang ,  Wen-Tsung Tseng ,  Chang-Fu Lin ,  Ho-Yi Tsai ,  Cheng-Hsu Hsiao

    IPC: H01L23/28 ,  H01L23/48

    CPC classification number: H01L21/561 ,  H01L23/3128 ,  H01L23/3142 ,  H01L29/0657 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/10158 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

    Abstract: A semiconductor package and a fabrication method thereof are disclosed. The fabrication method includes the steps of providing a semiconductor chip having an active surface and a non-active surface opposing to the active surface, roughening a peripheral portion of the non-active surface so as to divide the non-active surface into the peripheral portion formed with a roughened structure and a non-roughened central portion, mounting the semiconductor chip on a chip carrier via a plurality of solder bumps formed on the active surface, forming an encapsulant on the chip carrier to encapsulate the semiconductor chip. The roughened structure formed on the peripheral portion of the non-active surface of the semiconductor chip can reinforce the bonding between the semiconductor chip and the encapsulant, and the non-roughened central portion of the non-active surface of the semiconductor chip can maintain the structural strength of the semiconductor chip.

    Abstract translation: 公开了半导体封装及其制造方法。 该制造方法包括以下步骤：提供具有与活性表面相对的活性表面和非活性表面的半导体芯片，粗糙化非活性表面的周边部分，以将非活性表面划分成周边部分 形成有粗糙结构和非粗糙化的中心部分，通过形成在有源表面上的多个焊料凸块将半导体芯片安装在芯片载体上，在芯片载体上形成密封剂以封装半导体芯片。 形成在半导体芯片的非活性表面的周边部分上的粗糙结构可以加强半导体芯片和密封剂之间的接合，并且半导体芯片的非活性表面的非粗糙化的中心部分可以保持 半导体芯片的结构强度。

    Apparatuses for capturing and storing real-time images
    26.
    发明授权
    Apparatuses for capturing and storing real-time images 有权
    用于捕获和存储实时图像的设备

    公开(公告)号：US08194146B2

    公开(公告)日：2012-06-05

    申请号：US12191547

    申请日：2008-08-14

    Applicant: Chang-Fu Lin ,  Shu-Wen Teng ,  Cheng-Che Chen ,  Wei Cheng Gu ,  Ching-Chao Yang ,  Shih Tang Lin

    Inventor： Chang-Fu Lin ,  Shu-Wen Teng ,  Cheng-Che Chen ,  Wei Cheng Gu ,  Ching-Chao Yang ,  Shih Tang Lin

    IPC: H04N5/228

    CPC classification number: H04N5/772 ,  H04N5/04 ,  H04N5/765

    Abstract: An apparatus for capturing and storing real-time images is provided. A camera module records frames corresponding to sensed light, outputs pixel data of the frames on a data bus, and generates synchronization control signals to control the synchronized transmission of the frames. An interrupt controller receives the synchronization control signals and correspondingly generates interrupt signals. A processing unit receives the interrupt signals, fetches the pixel data of the frames on the data bus according to at least one of the interrupt signals, and stores the fetched pixel data in a memory device.

    Abstract translation: 提供了一种用于捕获和存储实时图像的设备。 相机模块记录与感测光对应的帧，在数据总线上输出帧的像素数据，并产生同步控制信号以控制帧的同步传输。 中断控制器接收同步控制信号并相应产生中断信号。 处理单元接收中断信号，根据至少一个中断信号取出数据总线上的帧的像素数据，并将获取的像素数据存储在存储器件中。

    General purpose interface controller of resoure limited system
    27.
    发明授权
    General purpose interface controller of resoure limited system 有权
    通用接口控制器

    公开(公告)号：US07937520B2

    公开(公告)日：2011-05-03

    申请号：US12271073

    申请日：2008-11-14

    Applicant: Chang-Fu Lin ,  Shu-Wen Teng ,  Wei Cheng Gu ,  Cheng-Che Chen

    Inventor： Chang-Fu Lin ,  Shu-Wen Teng ,  Wei Cheng Gu ,  Cheng-Che Chen

    IPC: G06F13/36

    CPC classification number: G06F13/387

    Abstract: The invention discloses a general purpose interface controller, including a slave interface controller and a master interface controller, used to exchange data among master devices and slave devices in an electronic device. The slave interface controller receives data and a first control signal from one of the master devices, and converts the first control signal to a request signal. The master interface controller receives the data and the request signal from the slave interface controller, converts the request signal to a second control signal recognized by at least one of the slave devices, and forwards the data and the second control signal to the slave device.

    Abstract translation: 本发明公开了一种通用接口控制器，包括从接口控制器和主接口控制器，用于在电子设备中的主设备和从设备之间交换数据。 从接口控制器从主设备之一接收数据和第一控制信号，并将第一控制信号转换为请求信号。 主接口控制器从从接口控制器接收数据和请求信号，将请求信号转换成由至少一个从设备识别的第二控制信号，并将数据和第二控制信号转发给从设备。

    APPARATUSES FOR CAPTURING AND STORING REAL-TIME IMAGES
    28.
    发明申请
    APPARATUSES FOR CAPTURING AND STORING REAL-TIME IMAGES 有权
    用于捕获和存储实时图像的设备

    公开(公告)号：US20090179997A1

    公开(公告)日：2009-07-16

    申请号：US12191547

    申请日：2008-08-14

    Applicant: Chang-Fu LIN ,  Shu-Wen TENG ,  Cheng-Che CHEN ,  Wei Cheng GU ,  Ching-Chao YANG ,  Shih Tang LIN

    Inventor： Chang-Fu LIN ,  Shu-Wen TENG ,  Cheng-Che CHEN ,  Wei Cheng GU ,  Ching-Chao YANG ,  Shih Tang LIN

    IPC: H04N5/228

    CPC classification number: H04N5/772 ,  H04N5/04 ,  H04N5/765

    Abstract: An apparatus for capturing and storing real-time images is provided. A camera module records frames corresponding to sensed light, outputs pixel data of the frames on a data bus, and generates synchronization control signals to control the synchronized transmission of the frames. An interrupt controller receives the synchronization control signals and correspondingly generates interrupt signals. A processing unit receives the interrupt signals, fetches the pixel data of the frames on the data bus according to at least one of the interrupt signals, and stores the fetched pixel data in a memory device.

    Abstract translation: 提供了一种用于捕获和存储实时图像的设备。 相机模块记录与感测光对应的帧，在数据总线上输出帧的像素数据，并产生同步控制信号以控制帧的同步传输。 中断控制器接收同步控制信号并相应产生中断信号。 处理单元接收中断信号，根据至少一个中断信号取出数据总线上的帧的像素数据，并将获取的像素数据存储在存储器件中。

    Semiconductor package and fabrication method thereof
    30.
    发明申请
    Semiconductor package and fabrication method thereof 有权
    半导体封装及其制造方法

    公开(公告)号：US20080061451A1

    公开(公告)日：2008-03-13

    申请号：US11900345

    申请日：2007-09-10

    Applicant: Wen-Home Huang ,  Wen-Tsung Tseng ,  Chang-Fu Lin ,  Ho-Yi Tsai ,  Cheng-Hsu Hsiao

    Inventor： Wen-Home Huang ,  Wen-Tsung Tseng ,  Chang-Fu Lin ,  Ho-Yi Tsai ,  Cheng-Hsu Hsiao

    IPC: H01L23/495 ,  H01L21/00

    CPC classification number: H01L21/561 ,  H01L23/3128 ,  H01L23/3142 ,  H01L29/0657 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/10158 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

    Abstract: A semiconductor package and a fabrication method thereof are disclosed. The fabrication method includes the steps of providing a semiconductor chip having an active surface and a non-active surface opposing to the active surface, roughening a peripheral portion of the non-active surface so as to divide the non-active surface into the peripheral portion formed with a roughened structure and a non-roughened central portion, mounting the semiconductor chip on a chip carrier via a plurality of solder bumps formed on the active surface, forming an encapsulant on the chip carrier to encapsulate the semiconductor chip. The roughened structure formed on the peripheral portion of the non-active surface of the semiconductor chip can reinforce the bonding between the semiconductor chip and the encapsulant, and the non-roughened central portion of the non-active surface of the semiconductor chip can maintain the structural strength of the semiconductor chip.

    Abstract translation: 公开了半导体封装及其制造方法。 该制造方法包括以下步骤：提供具有与活性表面相对的活性表面和非活性表面的半导体芯片，粗糙化非活性表面的周边部分，以将非活性表面划分成周边部分 形成有粗糙结构和非粗糙化的中心部分，通过形成在有源表面上的多个焊料凸块将半导体芯片安装在芯片载体上，在芯片载体上形成密封剂以封装半导体芯片。 形成在半导体芯片的非活性表面的周边部分上的粗糙结构可以加强半导体芯片和密封剂之间的接合，并且半导体芯片的非活性表面的非粗糙化的中心部分可以保持 半导体芯片的结构强度。

Patent Agency Ranking