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    DUAL-LAYER RECORDABLE OPTICAL DISC AND MANUFACTURING METHOD THEREOF
    22.
    发明申请
    DUAL-LAYER RECORDABLE OPTICAL DISC AND MANUFACTURING METHOD THEREOF 审中-公开
    双层可记录光盘及其制造方法

    公开(公告)号：US20080150176A1

    公开(公告)日：2008-06-26

    申请号：US12043913

    申请日：2008-03-06

    Applicant: RU-LIN YEH ,  Chung-Fa Chen ,  Chun-Ying Lin ,  Wei-Hsiang Wang

    Inventor： RU-LIN YEH ,  Chung-Fa Chen ,  Chun-Ying Lin ,  Wei-Hsiang Wang

    IPC: B29D17/00

    CPC classification number: G11B7/244 ,  G11B7/24038 ,  G11B7/243 ,  G11B7/2467 ,  G11B7/2472 ,  G11B7/2534 ,  G11B7/258 ,  G11B7/26 ,  G11B2007/2431 ,  G11B2007/24312

    Abstract: A dual-layer recordable optical disc includes a first recording layer and a second recording layer disposed on the first recording layer. The first recording layer is made of organic material, and the second recording layer is made of inorganic material. The optical disc may further includes a first substrate, a second substrate and a bonding layer. The first recording layer includes a dye recording layer disposed on the first substrate, and a first reflection layer disposed on the dye recording layer, whereas the second recording layer includes an inorganic recording layer and a second reflection layer disposed on the inorganic recording layer. In addition, the second substrate is disposed on the second reflection layer, and the bonding layer is disposed between the first reflection layer and the inorganic recording layer. A manufacturing process of the optical disc is also provided to increase production yield and lower manufacturing cost.

    Abstract translation: 双层可记录光盘包括设置在第一记录层上的第一记录层和第二记录层。 第一记录层由有机材料制成，第二记录层由无机材料制成。 光盘还可以包括第一基板，第二基板和接合层。 第一记录层包括设置在第一基板上的染料记录层和设置在染料记录层上的第一反射层，而第二记录层包括设置在无机记录层上的无机记录层和第二反射层。 此外，第二基板设置在第二反射层上，并且接合层设置在第一反射层和无机记录层之间。 还提供了光盘的制造工艺以提高产量并降低制造成本。

    Adjustable smoke inlet set for kitchen ventilator
    23.
    发明授权
    Adjustable smoke inlet set for kitchen ventilator 失效
    厨房通风机可调式烟雾入口组

    公开(公告)号：US06732730B1

    公开(公告)日：2004-05-11

    申请号：US10377460

    申请日：2003-02-28

    Applicant: Chun-Ying Lin

    Inventor： Chun-Ying Lin

    IPC: F24C1520

    CPC classification number: F24C15/20

    Abstract: An adjustable smoke inlet set for kitchen ventilator comprising an open and hollow shoulder tube connecting to both sides of the air duct; an inclined tube is on the bottom of the shoulder tube; an inlet base in vertical tube shape with top links to the bottom the inclined tube and the bottom links to the filter set; several sealing structures are installed on the conjunction areas of the shoulder tube, the inclined tube and the inlet base; such scheme can fit different kitchen ventilators with different sizes and angles.

    Abstract translation: 一种用于厨房呼吸机的可调烟雾入口组件，包括连接到风道两侧的敞开且空心的肩管; 斜管位于肩管底部; 入口底座为垂直管状，顶部连接到底部倾斜管，底部连接到过滤器组; 几个密封结构安装在肩管，倾斜管和入口底座的连接区域上; 这种方案可以适应不同尺寸和角度的不同厨房通风机。

    FLIP CHIP QUAD FLAT NON-LEADED PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF AND CHIP PACKAGE STRUCTURE
    28.
    发明申请
    FLIP CHIP QUAD FLAT NON-LEADED PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF AND CHIP PACKAGE STRUCTURE 审中-公开
    卷芯四边平板非引线包装结构及其制造方法和芯片包装结构

    公开(公告)号：US20090189296A1

    公开(公告)日：2009-07-30

    申请号：US12275172

    申请日：2008-11-20

    Applicant: Cheng-Ting Wu ,  Hung-Tsun Lin ,  Yu-Ren Chen ,  Chun-Ying Lin

    Inventor： Cheng-Ting Wu ,  Hung-Tsun Lin ,  Yu-Ren Chen ,  Chun-Ying Lin

    IPC: H01L23/52 ,  H01L21/00

    CPC classification number: H01L23/3114 ,  H01L23/49517 ,  H01L23/49822 ,  H01L23/49861 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/181 ,  H01L2224/05599 ,  H01L2924/00012

    Abstract: A manufacturing method for a Flip Chip Quad Flat Non-leaded package structure is provided. A lead frame having a plurality of leads is provided at first in the manufacturing method. A dielectric layer is formed on the lead frame and exposes a top surface and a bottom surface of the leads. A redistribution layer including a plurality of pads and a plurality of conductive lines connected the pads and the top surface of the leads is formed on the dielectric layer. A solder resist layer is formed to cover the redistribution layer, the dielectric layer and the leads, and expose the surface of the pads. An adhesive layer is formed on the solder resist layer. A chip having a plurality of bumps is provided. The chip is adhered on the solder resist layer with the adhesive layer and each bump is electrically connected with one of the pads.

    Abstract translation: 提供了一种倒装芯片四边形扁平无铅封装结构的制造方法。 首先在制造方法中设置具有多根引线的引线框架。 在引线框架上形成介电层，并使引线的顶表面和底表面露出。 在电介质层上形成包括多个焊盘的重分配层和连接焊盘和引线顶表面的多条导线。 形成阻焊层以覆盖再分布层，电介质层和引线，并露出焊盘的表面。 在阻焊层上形成粘接层。 提供具有多个凸块的芯片。 该芯片用粘合剂层粘附在阻焊层上，并且每个凸块与其中一个焊盘电连接。

    LEADFRAME FOR LEADLESS PACKAGE
    29.
    发明申请
    LEADFRAME FOR LEADLESS PACKAGE 审中-公开
    LEADFRAME无铅包装

    公开(公告)号：US20090108424A1

    公开(公告)日：2009-04-30

    申请号：US12248391

    申请日：2008-10-09

    Applicant: HENG CHANG KUO ,  PO KAI HOU ,  CHUN YING LIN

    Inventor： HENG CHANG KUO ,  PO KAI HOU ,  CHUN YING LIN

    IPC: H01L23/495

    CPC classification number: H01L23/49558 ,  H01L23/49541 ,  H01L23/49565 ,  H01L24/97

    Abstract: A leadframe for a leadless package comprises a plurality of package areas, a plurality of first slots, a plurality of first side rails, a plurality of second side rails, and tape. Each of the package areas comprises a plurality of package units, each of which comprises a die pad and a plurality of leads surrounding the die pad. The plurality of first side rails and the plurality of second side rails are connected and surround the plurality of the package areas. The tape fixes the plurality of package areas, the plurality of first side rails, the plurality of second side rails, the die pads, and the plurality of leads in place.

    Abstract translation: 用于无引线封装的引线框架包括多个封装区域，多个第一槽，多个第一侧轨道，多个第二侧轨和带。 每个封装区域包括多个封装单元，每个封装单元包括管芯焊盘和围绕管芯焊盘的多个引线。 多个第一侧轨道和多个第二侧轨道连接并围绕多个封装区域。 所述带将所述多个封装区域，所述多个第一侧轨道，所述多个第二侧轨道，所述管芯焊盘以及所述多个引线固定就位。

    LEADFRAME FOR LEADLESS PACKAGE
    30.
    发明申请
    LEADFRAME FOR LEADLESS PACKAGE 审中-公开
    LEADFRAME无铅包装

    公开(公告)号：US20090108419A1

    公开(公告)日：2009-04-30

    申请号：US12248362

    申请日：2008-10-09

    Applicant: HENG CHANG KUO ,  PO KAI HOU ,  CHUN YING LIN

    Inventor： HENG CHANG KUO ,  PO KAI HOU ,  CHUN YING LIN

    IPC: H01L23/495

    CPC classification number: H01L23/49565 ,  H01L23/3107 ,  H01L23/49541 ,  H01L23/49548 ,  H01L24/97

    Abstract: A leadframe for a leadless package comprises a plurality of package areas, a plurality of slots, a plurality of connection portions, a plurality of openings, and a tape (film). Each package area comprises a plurality of package units, each of which comprises a die pad and a plurality of leads surrounding the die pad. The plurality of slots are disposed around each of the package units. The plurality of connection portions connect the plurality of package areas. The plurality of openings are disposed on the plurality of connection portions, and are aligned with some of the plurality of slots. The tape (film) fixes the plurality of package areas, the plurality of connection portions, the plurality of die pads, and the plurality of leads in place.

    Abstract translation: 用于无引线封装的引线框架包括多个封装区域，多个槽，多个连接部分，多个开口和带（膜）。 每个封装区域包括多个封装单元，每个封装单元包括管芯焊盘和围绕管芯焊盘的多个引线。 多个狭槽围绕每个包装单元设置。 多个连接部分连接多个包装区域。 多个开口设置在多个连接部分上，并且与多个狭槽中的一些对齐。 带（膜）将多个封装区域，多个连接部分，多个管芯焊盘和多个引线固定就位。

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