中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

43 records (took 0.017 seconds)

    DUAL-LAYER RECORDABLE OPTICAL DISC AND MANUFACTURING METHOD THEREOF
    4.
    发明申请
    DUAL-LAYER RECORDABLE OPTICAL DISC AND MANUFACTURING METHOD THEREOF 审中-公开
    双层可记录光盘及其制造方法

    公开(公告)号：US20080150176A1

    公开(公告)日：2008-06-26

    申请号：US12043913

    申请日：2008-03-06

    Applicant: RU-LIN YEH ,  Chung-Fa Chen ,  Chun-Ying Lin ,  Wei-Hsiang Wang

    Inventor： RU-LIN YEH ,  Chung-Fa Chen ,  Chun-Ying Lin ,  Wei-Hsiang Wang

    IPC: B29D17/00

    CPC classification number: G11B7/244 ,  G11B7/24038 ,  G11B7/243 ,  G11B7/2467 ,  G11B7/2472 ,  G11B7/2534 ,  G11B7/258 ,  G11B7/26 ,  G11B2007/2431 ,  G11B2007/24312

    Abstract: A dual-layer recordable optical disc includes a first recording layer and a second recording layer disposed on the first recording layer. The first recording layer is made of organic material, and the second recording layer is made of inorganic material. The optical disc may further includes a first substrate, a second substrate and a bonding layer. The first recording layer includes a dye recording layer disposed on the first substrate, and a first reflection layer disposed on the dye recording layer, whereas the second recording layer includes an inorganic recording layer and a second reflection layer disposed on the inorganic recording layer. In addition, the second substrate is disposed on the second reflection layer, and the bonding layer is disposed between the first reflection layer and the inorganic recording layer. A manufacturing process of the optical disc is also provided to increase production yield and lower manufacturing cost.

    Abstract translation: 双层可记录光盘包括设置在第一记录层上的第一记录层和第二记录层。 第一记录层由有机材料制成，第二记录层由无机材料制成。 光盘还可以包括第一基板，第二基板和接合层。 第一记录层包括设置在第一基板上的染料记录层和设置在染料记录层上的第一反射层，而第二记录层包括设置在无机记录层上的无机记录层和第二反射层。 此外，第二基板设置在第二反射层上，并且接合层设置在第一反射层和无机记录层之间。 还提供了光盘的制造工艺以提高产量并降低制造成本。

    Adjustable smoke inlet set for kitchen ventilator
    5.
    发明授权
    Adjustable smoke inlet set for kitchen ventilator 失效
    厨房通风机可调式烟雾入口组

    公开(公告)号：US06732730B1

    公开(公告)日：2004-05-11

    申请号：US10377460

    申请日：2003-02-28

    Applicant: Chun-Ying Lin

    Inventor： Chun-Ying Lin

    IPC: F24C1520

    CPC classification number: F24C15/20

    Abstract: An adjustable smoke inlet set for kitchen ventilator comprising an open and hollow shoulder tube connecting to both sides of the air duct; an inclined tube is on the bottom of the shoulder tube; an inlet base in vertical tube shape with top links to the bottom the inclined tube and the bottom links to the filter set; several sealing structures are installed on the conjunction areas of the shoulder tube, the inclined tube and the inlet base; such scheme can fit different kitchen ventilators with different sizes and angles.

    Abstract translation: 一种用于厨房呼吸机的可调烟雾入口组件，包括连接到风道两侧的敞开且空心的肩管; 斜管位于肩管底部; 入口底座为垂直管状，顶部连接到底部倾斜管，底部连接到过滤器组; 几个密封结构安装在肩管，倾斜管和入口底座的连接区域上; 这种方案可以适应不同尺寸和角度的不同厨房通风机。

    Chip package
    6.
    发明授权
    Chip package 有权
    芯片封装

    公开(公告)号：US07932531B2

    公开(公告)日：2011-04-26

    申请号：US12506255

    申请日：2009-07-21

    Applicant: Chun-Ying Lin ,  Ya-Chi Chen ,  Yu-Ren Chen ,  I-Hsin Mao

    Inventor： Chun-Ying Lin ,  Ya-Chi Chen ,  Yu-Ren Chen ,  I-Hsin Mao

    IPC: H01L33/00

    CPC classification number: H01L21/563 ,  H01L23/3135 ,  H01L24/97 ,  H01L33/642 ,  H01L2224/16225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/0401

    Abstract: A chip package includes a thermal enhanced plate, contacts around the thermal enhanced plate and electrically insulated from the thermal enhanced plate, a film-like circuit layer disposed on the contacts and the thermal enhanced plate, a conductive adhesive layer, a first molding, and at least one chip disposed on the film-like circuit layer. The conductive adhesive layer is disposed between the contacts and the film-like circuit layer electrically connected to the contacts through the conductive adhesive layer. The chip has a back surface, an active surface and many bumps disposed thereon, and the chip is electrically connected to the film-like circuit layer via the bumps. The first molding at least encapsulates a portion of the thermal enhanced plate, the conductive adhesive layer, parts of the contacts and at least a portion of the film-like circuit layer. Therefore, heat dissipation efficiency of the light emitting chip package is improved.

    Abstract translation: 芯片封装包括热增强板，围绕热增强板接触并与热增强板电绝缘，设置在触点和热增强板上的膜状电路层，导电粘合剂层，第一模制件和 设置在膜状电路层上的至少一个芯片。 导电性粘合剂层设置在触点和通过导电粘合剂层与触点电连接的膜状电路层之间。 芯片具有背面，有源表面和设置在其上的许多凸块，并且芯片经由凸块电连接到膜状电路层。 第一模制品至少封装热增强板的一部分，导电粘合剂层，触点的一部分和膜状电路层的至少一部分。 因此，提高了发光芯片封装的散热效率。

    Method of fabricating quad flat non-leaded package
    7.
    发明授权
    Method of fabricating quad flat non-leaded package 有权
    制造四方扁平无铅封装的方法

    公开(公告)号：US07842550B2

    公开(公告)日：2010-11-30

    申请号：US12332362

    申请日：2008-12-11

    Applicant: Chun-Ying Lin ,  Geng-Shin Shen ,  Po-Kai Hou

    Inventor： Chun-Ying Lin ,  Geng-Shin Shen ,  Po-Kai Hou

    IPC: H01L21/00

    CPC classification number: H01L24/97 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/97 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: A method of fabricating a quad flat non-leaded package includes first forming a patterned conductive layer on a sacrificial layer. The patterned conductive layer includes a number of lead sets. A number of chips are attached to the sacrificial layer. Each of the chips is surrounded by one of the lead sets. Each of the chips is electrically connected to one of the lead sets, and a molding compound is formed on the sacrificial layer to cover the patterned conductive layer and the chips. The molding compound and the patterned conductive layer are then cut and singulated, and the sacrificial layer is pre-cut to form a number of recesses on the sacrificial layer. After the molding compound and the patterned conductive layer are cut and singulated and the sacrificial layer is pre-cut, the sacrificial layer is removed.

    Abstract translation: 制造四边形扁平非引线封装的方法包括首先在牺牲层上形成图案化的导电层。 图案化导电层包括多个引线组。 许多芯片附着到牺牲层。 每个芯片都被其中一个引线组包围。 每个芯片电连接到一个引线组，并且在牺牲层上形成模制化合物以覆盖图案化的导电层和芯片。 然后将成型化合物和图案化导电层切割并切割，并且牺牲层被预切割以在牺牲层上形成多个凹部。 在模制化合物和图案化的导电层被切割并切割并且牺牲层被预切割之后，去除牺牲层。

Patent Agency Ranking