Abstract:
A flash memory device includes a semiconductor substrate, a gate insulating layer having a first width formed on the semiconductor substrate to trap carriers tunneled from the semiconductor substrate and a metal electrode on the gate insulating layer to receive a voltage required for tunneling. The metal electrode having a second width smaller than the first width. The flash memory device further includes a sidewall spacer surrounding a side surface of the metal electrode to prevent oxidation of the metal electrode.
Abstract:
An apparatus and method to inspect a display panel that can correctly detect a defect of the display panel itself. In the method of inspecting the display panel, a first image is captured from the display panel in a state in which no pattern is applied to the display panel. Light is then irradiated on the display panel in a state in which a pattern is applied to the display panel, and a second image is captured from the display panel. The first image can be compared with the second image, and a determination can be made as to whether or not a defect of the display panel is present.
Abstract:
In one embodiment, a semiconductor device comprises a semiconductor substrate and a doped conductive layer formed over the semiconductor substrate. A diffusion barrier layer is formed over the doped conductive layer. The diffusion barrier layer comprises an amorphous semiconductor material. An ohmic contact layer is formed over the diffusion barrier layer. A metal barrier layer is formed over the ohmic contact layer. A metal layer is formed over the metal barrier layer.
Abstract:
In a method for forming a gate in a semiconductor device, a first preliminary gate structure is formed on a substrate. The first preliminary gate structure includes a gate oxide layer, a polysilicon layer pattern and a tungsten layer pattern sequentially stacked on the substrate. A primary oxidation process is performed using oxygen radicals at a first temperature for adjusting a thickness of the gate oxide layer to form a second preliminary gate structure having tungsten oxide. The tungsten oxide is reduced to a tungsten material using a gas containing hydrogen to form a gate structure. The tungsten oxide may not be formed on the gate structure so that generation of the whiskers may be suppressed. Thus, a short between adjacent wirings may not be generated.
Abstract:
Embodiments of the present invention include semiconductor devices that can be made with relatively low resistance, and methods of forming the semiconductor devices. A resistance reducing layer is formed between a polysilicon layer and a metal layer. As a result, an interface resistance between the polysilicon layer and the metal layer is greatly reduced and a distribution of the interface resistance is very uniform. As a result, a conductive structure including the resistance reducing layer has a greatly reduced sheet resistance to improve electrical characteristics of a semiconductor device having the conductive structure.
Abstract:
A satellite broadcast receiver comprises an antenna, a tuner, a modulator, a FEC decoder, a microprocessor, and an antenna driver. The antenna receives the satellite signal and the tuner tunes the satellite signal received by the antenna, and the modulator modulates the satellite signal tuned by the tuner into digital signal, the FEC decoder corrects a position error of the satellite antenna using the signal modulated by the modulator, and outputs a corresponding output signal, and the microprocessor receives the signal modulated by the modulator and the output signal of the error corrector, and outputs a control signal which controls the position of the antenna, and the antenna driver drives the antenna in accordance with the control signal of the microprocessor. The satellite broadcast receiver enables a user to detect satellites fast and see satellite broadcast conveniently.
Abstract:
A refrigerator has an evaporator to discharge cold air into a food storage chamber by rotation of a fan as the cold air is generated during circulation of a coolant, and a temperature detecting unit to detect the temperature of the evaporator and generate a signal related to the evaporator temperature. The fan is controlled to initially rotate at a low speed (when the evaporator is warmest) and then at a progressively increasing speed. The increasing speed is independent of the temperature of the food storage chamber. The speed could be increased in response to detected decreases in the evaporator temperature. Alternatively, the speed could increase automatically for a predetermined time period.
Abstract:
A deposition apparatus includes a chuck in a process chamber, the chuck having a top surface on which a substrate is loaded, a showerhead disposed over the chuck, and a fence extension disposed in the process chamber. Plasma is generated in a space between the showerhead and the loaded substrate during a deposition process. The fence extension at least partially confines the plasma in the space during the deposition process, thereby enabling improved thickness uniformity and reliability of a layer deposited on the loaded substrate during the deposition process.
Abstract:
The present invention relates to an image display device and a method for operating same. According to an embodiment of the present invention, a method for operating an image display device uses a remote controller, and comprises the steps of: displaying a pointer in a first area of a display; receiving movement coordinate information of the pointer from the remote controller; restoring the first area using a prestored image when the first area does not overlap a second area where a pointer is displayed, based on the movement coordinate information; storing an image of the second area; and displaying a pointer in the second area. This enables the pointer of the remote controller to be easily displayed.
Abstract:
A method of forming through silicon vias (TSVs) includes forming a primary via hole in a semiconductor substrate, depositing low-k dielectric material in the primary via hole, forming a secondary via hole by etching the low-k dielectric in the primary via hole, in such a manner that a via insulating layer and an inter metal dielectric layer of the low-k dielectric layer are simultaneously formed. The via insulating layer is formed of the low-k dielectric material on sidewalls and a bottom surface of the substrate which delimit the primary via hole and the inter metal dielectric layer is formed on an upper surface of the substrate. Then a metal layer is formed on the substrate including in the secondary via hole, and the metal layer is selectively removed from an upper surface of the semiconductor substrate.