公开(公告)号：US06656378B2

公开(公告)日：2003-12-02

申请号：US10067814

申请日：2002-02-08

申请人： Sang Koo Kwon ,  Kang Heon Hur ,  Jong Kuk Hong ,  Dong Hwan Seo

发明人： Sang Koo Kwon ,  Kang Heon Hur ,  Jong Kuk Hong ,  Dong Hwan Seo

IPC分类号： H01L41187

CPC分类号： C04B35/493 ,  C04B2235/3241 ,  C04B2235/3249 ,  C04B2235/3258 ,  C04B2235/3267 ,  C04B2235/3275 ,  C04B2235/3296 ,  H01L41/1876

摘要： Disclosed is a piezoelectric ceramic composition comprising a PZT piezoelectric composition, a B-site of which is substituted with a certain material, and chromium oxide, and a piezoelectric device using the piezoelectric ceramic composition. The piezoelectric ceramic composition has good heat resistance and frequency stability, and reduces a leakage current. There is provided the piezoelectric ceramic composition comprising a main component expressed by Pb[(Co1/2W1/2)xTi1−x−yZry]O3 (wherein, 0.001≦x≦0.04, and 0.35 ≦y≦0.55), Cr2O3 in an amount of 0.01 to 2 wt %, MnO2 in an amount of 0.1 to 0.5 wt %, and an additive in an amount of 0.01 to 2.0 wt %, based on the total weight of the piezoelectric ceramic composition, in which the additive is selected from the group consisting of CoO, MgO, ZnO, Al2O3, Fe2O3, Sb2O3, SnO2, CeO2, Nb2O5, V2O5 and WO3, and mixtures thereof. The piezoelectric ceramic composition satisfies piezoelectric properties such as kp and Qm needed for a piezoelectric material, and is 320° C. or higher in phase transition temperature, ±30 ppm/° C. in TCF, and 0.1% or less in oscillation frequency change after reflow; and the piezoelectric ceramic composition also has good piezoelectric properties such that the leakage current is reduced.

摘要翻译： 本发明公开了一种压电陶瓷组合物和使用该压电陶瓷组合物的压电装置，其中PZT压电组合物的B部位用某种材料代替，氧化铬。 压电陶瓷组合物具有良好的耐热性和频率稳定性，并且减小了漏电流。 提供了包含由Pb [（Co1 / 2W1 / 2）xTi1-x-yZry] O3（其中0.001≤x≤0.04,0.35≤Y＆LE; 0.55）表示的主要成分的压电陶瓷组合物， 0.01〜2.0重量％的MnO 2，0.1〜0.5重量％的MnO 2，0.01〜2.0重量％的添加剂，相对于压电陶瓷组合物的总重量，添加剂为 选自CoO，MgO，ZnO，Al2O3，Fe2O3，Sb2O3，SnO2，CeO2，Nb2O5，V2O5和WO3，以及它们的混合物。 压电陶瓷组合物满足压电材料所需的压电特性如kp和Qm，在TCF中相变温度为320℃或更高，±30ppm /℃，振荡频率变化为0.1％以下 回流后 并且压电陶瓷组合物也具有良好的压电性能，使得泄漏电流降低。

公开(公告)号：US20090038837A1

公开(公告)日：2009-02-12

申请号：US12078176

申请日：2008-03-27

申请人： Shuhichi Okabe ,  Jin-Yong An ,  Seok-Kyu Lee ,  Soon-Oh Jung ,  Jong-Kuk Hong ,  Hae-Nam Seo

发明人： Shuhichi Okabe ,  Jin-Yong An ,  Seok-Kyu Lee ,  Soon-Oh Jung ,  Jong-Kuk Hong ,  Hae-Nam Seo

IPC分类号： H05K1/11 ,  B32B38/10

CPC分类号： H05K3/462 ,  H05K3/205 ,  H05K3/243 ,  H05K3/421 ,  H05K3/4623 ,  H05K3/4644 ,  H05K2201/09527 ,  H05K2201/09563 ,  H05K2201/096

摘要： A multilayered printed circuit board is disclosed. A method of manufacturing the multilayered printed circuit board, which includes: forming a metal layer and a lower-circuit-forming pattern in order on a carrier, and forming a lower circuit by filling a conductive material in the lower-circuit-forming pattern; removing the lower-circuit-forming pattern, stacking an insulation resin, and forming at least one via hole connecting with the lower circuit; forming at least one inner circuit and at least one interlayer connector connecting the inner circuit with the lower circuit on the insulation resin, to form a pair of circuit parts; and aligning the pair of circuit parts, attaching the pair of circuit parts to each other, and removing the carrier and the metal layer, allows the forming of fine-lined circuits and provides a thin board, while preventing bending and warpage in the board.

摘要翻译： 公开了一种多层印刷电路板。 一种制造多层印刷电路板的方法，包括：在载体上依次形成金属层和下电路形成图案，并通过在下电路形成图案中填充导电材料形成下层电路; 去除下部电路形成图案，堆叠绝缘树脂，并形成与下部电路连接的至少一个通孔; 在所述绝缘树脂上形成至少一个内部电路和连接所述内部电路与所述下部电路的至少一个层间连接器，以形成一对电路部件; 并且将一对电路部件对准，将一对电路部件彼此连接，并且移除载体和金属层，允许形成精细的电路并提供薄板，同时防止板的弯曲和翘曲。

公开(公告)号：US07277005B2

公开(公告)日：2007-10-02

申请号：US11022074

申请日：2004-12-22

申请人： Myung Sam Kang ,  Chang Sup Ryu ,  Jong Kuk Hong

发明人： Myung Sam Kang ,  Chang Sup Ryu ,  Jong Kuk Hong

IPC分类号： H01C1/012

CPC分类号： H01C7/003 ,  H01C17/065 ,  H01C17/0652 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/05568 ,  H01L2224/16 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H05K1/167 ,  H05K3/0047 ,  H05K3/005 ,  H05K3/4069 ,  H05K3/42 ,  H05K3/429 ,  H05K3/4652 ,  H05K2201/09509 ,  H05K2201/09645 ,  H05K2203/1476

摘要： Disclosed is a PCB including an embedded resistor and a method of fabricating the same. The PCB includes a plurality of circuit layers in which circuit patterns are formed. A plurality of insulating layers is each interposed between the circuit layers. The embedded resistor is made of a resistive material and received in a receiving hole formed in the plurality of circuit layers and the plurality of insulating layers such that walls defining the receiving hole extends from one of the circuit layers to another circuit layer. The receiving hole has a closed section, and a conductive material is plated on the opposite walls of the walls defining the receiving hole.

摘要翻译： 公开了一种包括嵌入式电阻器的PCB及其制造方法。 PCB包括形成电路图案的多个电路层。 在电路层之间分别插入多个绝缘层。 嵌入式电阻器由电阻材料制成并且被容纳在形成在多个电路层和多个绝缘层中的接收孔中，使得限定接收孔的壁从电路层之一延伸到另一个电路层。 接收孔具有闭合部分，并且导电材料被电镀在限定接收孔的壁的相对壁上。