Abstract:
Disclosed may be a phase change material alloy, a phase change memory device including the same, and methods of manufacturing and operating the phase change memory device. The phase change material alloy may include Si and Sb. The alloy may be a Si—O—Sb alloy further including O. The Si—O—Sb alloy may be SixOySbz, wherein, when x/(x+z) may be x1, 0.05≦x1≦0.30, 0.00≦y≦0.50, and x+y+z may be 1. The Si—O—Sb alloy may further comprise an element other than Si, O, and Sb.
Abstract translation:公开了相变材料合金,包括该相变材料合金的相变存储器,以及制造和操作相变存储器件的方法。 相变材料合金可以包括Si和Sb。 该合金可以是还包含O的Si-O-Sb合金.Si-O-Sb合金可以是SixOySbz,其中当x /(x + z)可以是x1时,0.05 <= x1 <= 0.30,0.00 < = y <= 0.50,x + y + z可以为1.Si-O-Sb合金还可以包含除Si,O和Sb以外的元素。
Abstract:
A phase change material layer includes antimony (Sb) and at least one of indium (In) and gallium (Ga). A phase change memory device includes a storage node including a phase change material layer and a switching device connected to the storage node. The phase change material layer includes Sb and at least one of In and Ga.
Abstract:
A storage node may include a bottom electrode contact layer, a phase change layer connected to the bottom electrode contact layer, and a top electrode layer connected to the phase change layer. The bottom electrode contact layer may protrude toward the phase change layer. A phase change memory device may include a switching device and the storage node. The switching device may be connected to the bottom electrode contact layer. A method of manufacturing the storage node may include forming a via hole in an insulating interlayer, at least partially filling the via hole to form a bottom electrode contact layer, protruding the bottom electrode contact layer from the via hole, and forming a phase change layer that covers the bottom electrode contact layer. A method of manufacturing a phase change memory device may include forming the switching device on a substrate and manufacturing the storage node.
Abstract:
A phase change RAM (PRAM) including a resistance element having a diode function, and methods of fabricating and operating the same are provided. The PRAM may include a substrate, a phase change diode layer formed on the substrate and an upper electrode formed on the phase change diode layer. The phase change diode layer may include a material layer doped with first impurities, and a phase change layer which is stacked on the doped layer. The phase change layer may show characteristics of a semiconductor material doped with impurities having an opposite conductive type to that of the first impurities.
Abstract:
A source driver output circuit of a thin film transistor (TFT) liquid crystal display (LCD) includes first through n-th voltage generators, first through n-th switching portions, first through n-th sub switching portions, and a switching circuit. The voltage generators receive first through n-th corresponding input voltages and generate first through n-th sub input voltages. The switching portions generate the sub input voltages as first through n-th corresponding output voltages when activated, or cut off the sub input voltages when deactivated. The sub switching portions connect predetermined share lines to the output voltages when activated, or cut off the predetermined share lines when deactivated. The switching circuit maintains each of the share line voltages equally at an intermediate voltage level that is between the share line voltages. Therefore, the slew rate of a signal input to the panel from the source driver can be improved, and current consumption in the source driver can be reduced.
Abstract:
A source driver output circuit of a thin film transistor (TFT) liquid crystal display (LCD) includes first through n-th voltage generators, first through n-th switching portions, first through n-th sub switching portions, and a voltage-generating portion. The voltage generators receive first through n-th corresponding input voltages and generate first through n-th sub input voltages. The switching portions generate the sub input voltages as first through n-th corresponding output voltages when activated, or cut off the sub input voltages when deactivated. The sub switching portions connect predetermined share lines to the output voltages when activated, or cut off the predetermined share lines when deactivated. The voltage-generating portion receives predetermined first and second voltages and applies predetermined precharge voltages to the share lines. Therefore, the slew rate of a signal input to the panel from the source driver can be improved, and current consumption in the source driver can be reduced.
Abstract:
A full CMOS SRAM cell having the capability of having a reduced aspect ratio is described. The SRAM cell includes first and second transfer transistors of n-channel types, first and second driving transistors of the n-channel types and first and second load transistors of p-channel types. Each of the transistors has source and drain regions on opposite sides of a channel region formed in a semiconductor substrate and a gate over the channel region. The cell includes a first common region defined by the drain regions of the first transfer transistor and the first driving transistor connected in series therethrough. A second common region is defined by the drain regions of the second transfer transistor and the second driving transistor connected in series therethrough. The drain region of the first load transistor is disposed adjacent to the first common region between the first and second common regions. The drain region of the second load transistor is disposed between the drain region of the first load transistor and the second common region. First and second gate electrode layers are disposed generally parallel to each other, and respectively serving as the gates of the first driving transistor and the first load transistor and as the gates of the second driving transistor and the second load transistor, wherein each of the first and second gate electrode layers is made of a conductive material of a first level. First and second interconnecting layers are each made of a conductive material of a second level different from the first level, the first interconnecting layer connecting the first common region to the drain region of the first load transistor and the second gate electrode layer, the second interconnecting layer connecting the second common region to the drain region of the second load transistor and the first gate electrode layer.
Abstract:
A semiconductor device and methods of forming a semiconductor device are disclosed. In the methods, a layer, such as an insulating interlayer, is formed on a substrate. A first trench is formed in the layer, and a mask layer is formed in the first trench. The mask layer has a first thickness from a bottom surface of the first trench to the top of the mask layer. The mask layer is patterned to form a mask that at least partially exposes a sidewall of the first trench. A portion of the mask adjacent to the exposed sidewall of the first trench has a second thickness smaller than the first thickness. The layer is etched to form a second trench using the mask as an etching mask. The second trench is in fluid communication with the first trench. A conductive pattern is formed in the first trench and the second trench.
Abstract:
A magnetic body structure including: a magnetic layer pattern; and a conductive pattern including a metallic glass alloy and covering at least a portion of the magnetic body structure.
Abstract:
Provided is a magnetic memory device and a method of forming the same. A first magnetic conductive layer is disposed on a substrate. A first tunnel barrier layer including a first metallic element and a first non-metallic element is disposed on the first magnetic conductive layer. A second magnetic conductive layer is disposed on the first tunnel barrier layer. A content of an isotope of the first metallic element having a non-zero nuclear spin quantum number is lower than a natural state.