Electrically insulating and thermally conductive composition and electronic device
    22.
    发明授权
    Electrically insulating and thermally conductive composition and electronic device 有权
    电绝缘和导热组合物和电子器件

    公开(公告)号:US08530566B2

    公开(公告)日:2013-09-10

    申请号:US13191113

    申请日:2011-07-26

    CPC classification number: C08K3/22 C08K3/042 C08L79/08 C09K5/14 C08L63/00

    Abstract: An embodiment of the invention provides an electrically insulating and thermally conductive composition including 5-80 parts by weight of a resin, 20-95 parts by weight of an electrically insulating and thermally conductive powder, and 0.0001-2 parts by weight of a graphene. Another embodiment of the invention also provides an electronic device including the electrically insulating and thermally conductive composition.

    Abstract translation: 本发明的一个实施方案提供一种电绝缘和导热组合物,其包含5-80重量份的树脂,20-95重量份的电绝缘导热粉末和0.0001-2重量份的石墨烯。 本发明的另一个实施方案还提供了一种包括电绝缘和导热组合物的电子器件。

    CONDUCTIVE PASTES
    24.
    发明申请
    CONDUCTIVE PASTES 有权
    导电胶

    公开(公告)号:US20130146820A1

    公开(公告)日:2013-06-13

    申请号:US13560273

    申请日:2012-07-27

    CPC classification number: H01B1/22

    Abstract: A conductive paste is provided. The conductive paste includes a conductive powder and a resin composition. The resin composition includes a polyester acrylate oligomer, a hydroxyalkyl acrylate (HAA) and a polyvinylpyrrolidone (PVP) derivative. The conductive powder and the resin composition have a weight ratio of 40-85:15-60. The polyester acrylate oligomer, the hydroxyalkyl acrylate (HAA) and the polyvinylpyrrolidone (PVP) derivative have a weight ratio of 15-70:10-60:3-40.

    Abstract translation: 提供导电浆料。 导电浆料包括导电粉末和树脂组合物。 树脂组合物包括聚酯丙烯酸酯低聚物,丙烯酸羟烷基酯(HAA)和聚乙烯吡咯烷酮(PVP)衍生物。 导电粉末和树脂组合物的重量比为40-85:15-60。 聚酯丙烯酸酯低聚物,丙烯酸羟烷基酯(HAA)和聚乙烯吡咯烷酮(PVP)衍生物的重量比为15-70:10-60:3-40。

    ELECTRICALLY INSULATING AND THERMALLY CONDUCTIVE COMPOSITION AND ELECTRONIC DEVICE
    26.
    发明申请
    ELECTRICALLY INSULATING AND THERMALLY CONDUCTIVE COMPOSITION AND ELECTRONIC DEVICE 有权
    电绝缘和导电组合物和电子器件

    公开(公告)号:US20120229981A1

    公开(公告)日:2012-09-13

    申请号:US13191113

    申请日:2011-07-26

    CPC classification number: C08K3/22 C08K3/042 C08L79/08 C09K5/14 C08L63/00

    Abstract: An embodiment of the invention provides an electrically insulating and thermally conductive composition including 5-80 parts by weight of a resin, 20-95 parts by weight of an electrically insulating and thermally conductive powder, and 0.0001-2 parts by weight of a graphene. Another embodiment of the invention also provides an electronic device including the electrically insulating and thermally conductive composition.

    Abstract translation: 本发明的一个实施方案提供一种电绝缘和导热组合物,其包含5-80重量份的树脂,20-95重量份的电绝缘导热粉末和0.0001-2重量份的石墨烯。 本发明的另一个实施方案还提供了一种包括电绝缘和导热组合物的电子器件。

    COMPOSITION OF THERMAL INTERFACE MATERIAL
    28.
    发明申请
    COMPOSITION OF THERMAL INTERFACE MATERIAL 审中-公开
    热界面材料的组成

    公开(公告)号:US20100219369A1

    公开(公告)日:2010-09-02

    申请号:US12778665

    申请日:2010-05-12

    CPC classification number: C08K7/06

    Abstract: A composition of a thermal interface material is provided. The deficiencies of low thermal conductivity and high thermal resistance in the conventional thermal interface materials are resolved. By using carbon fibers with high thermal conductivity, the thermal conductivity of the thermal interface material can be about 7˜10 times higher than the traditional thermal interface materials. The added amount of carbon fibers is less than the added amount of metal or ceramic powders. The dispersion process is thereby improved. Further, the thermal interface material has a phase change temperature at about 40˜65° C. Holes, gaps and dents on the surface of device are filled at the normal operation temperature of device to reduce the thermal resistance of the entire device and to increase the interfacial bonding strength.

    Abstract translation: 提供了热界面材料的组合物。 解决了常规热界面材料中低热导率和高热阻的缺点。 通过使用具有高导热性的碳纤维,热界面材料的热导率可以比传统的热界面材料高约7〜10倍。 碳纤维的添加量小于金属或陶瓷粉末的添加量。 从而改善了分散过程。 此外,热界面材料的相变温度为约40〜65℃。器件表面上的孔,间隙和凹痕在器件的正常工作温度下被填充,以降低整个器件的热阻,并增加 界面粘合强度。

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