公开(公告)号：US08323553B2

公开(公告)日：2012-12-04

申请号：US12362080

申请日：2009-01-29

申请人： Tzong-Ming Lee ,  Ruoh-Huey Uang ,  Kuo-Chan Chiou ,  Yu-Ming Wang ,  Yi-Ting Cheng

发明人： Tzong-Ming Lee ,  Ruoh-Huey Uang ,  Kuo-Chan Chiou ,  Yu-Ming Wang ,  Yi-Ting Cheng

IPC分类号： B05D3/06 ,  B29C35/08 ,  B29C59/16

CPC分类号： H05K3/102 ,  B82Y10/00 ,  H05K3/381 ,  H05K2201/0129 ,  H05K2201/0257 ,  H05K2203/107 ,  H05K2203/128

摘要： A method for manufacturing a substrate with surface substrates by employing photothermal effect is described. Nanoparticles on the surface of the substrate excited by a beam convert light energy to thermal energy. The surface structure on the substrate is formed through the thermal energy generated by the excited nanoparticles. The substrate with plural pores is thus formed.

摘要翻译： 描述了通过使用光热效应制造具有表面基板的基板的方法。 由光束激发的衬底表面上的纳米颗粒将光能转换成热能。 通过激发的纳米粒子产生的热能形成衬底上的表面结构。 由此形成具有多个孔的基板。

公开(公告)号：US20090197011A1

公开(公告)日：2009-08-06

申请号：US12362080

申请日：2009-01-29

申请人： Tzong-Ming LEE ,  Ruoh-Huey Uang ,  Kuo-Chan Chiou ,  Yu-Ming Wang ,  Yi-Ting Cheng

发明人： Tzong-Ming LEE ,  Ruoh-Huey Uang ,  Kuo-Chan Chiou ,  Yu-Ming Wang ,  Yi-Ting Cheng

IPC分类号： B05D3/06

CPC分类号： H05K3/102 ,  B82Y10/00 ,  H05K3/381 ,  H05K2201/0129 ,  H05K2201/0257 ,  H05K2203/107 ,  H05K2203/128

摘要： A method for manufacturing a substrate with surface substrates by employing photothermal effect is described. Nanoparticles on the surface of the substrate excited by a beam convert light energy to thermal energy. The surface structure on the substrate is formed through the thermal energy generated by the excited nanoparticles. The substrate with plural pores is thus formed.

摘要翻译： 描述了通过使用光热效应制造具有表面基板的基板的方法。 由光束激发的衬底表面上的纳米颗粒将光能转换成热能。 通过激发的纳米粒子产生的热能形成衬底上的表面结构。 由此形成具有多个孔的基板。

公开(公告)号：US20090269505A1

公开(公告)日：2009-10-29

申请号：US12362131

申请日：2009-01-29

申请人： Tzong-Ming Lee ,  Ruoh-Huey Uang ,  Kuo-Chan Chiou ,  Yu-Ming Wang ,  Yi-Ting Cheng

发明人： Tzong-Ming Lee ,  Ruoh-Huey Uang ,  Kuo-Chan Chiou ,  Yu-Ming Wang ,  Yi-Ting Cheng

IPC分类号： B05D3/06

CPC分类号： H05K3/102 ,  B82Y10/00 ,  H05K3/381 ,  H05K2201/0129 ,  H05K2201/0257 ,  H05K2203/107 ,  H05K2203/128

摘要： A method for manufacturing a substrate with a surface substrate by employing photothermal effect is described. Nanoparticles on the surface of the substrate excited by a beam convert light energy to thermal energy. The surface structure on the substrate is formed through the thermal energy generated by the excited nanoparticles. The substrate with a layer of the predetermined pattern is thus formed.

摘要翻译： 描述了通过采用光热效应制造具有表面基板的基板的方法。 由光束激发的衬底表面上的纳米颗粒将光能转换成热能。 通过激发的纳米粒子产生的热能形成衬底上的表面结构。 由此形成具有预定图案的层的衬底。

公开(公告)号：US20120009353A1

公开(公告)日：2012-01-12

申请号：US13234344

申请日：2011-09-16

申请人： Tzong-Ming Lee ,  Ruoh-Huey Uang ,  Kuo-Chan Chiou ,  Yi-Ting Cheng

发明人： Tzong-Ming Lee ,  Ruoh-Huey Uang ,  Kuo-Chan Chiou ,  Yi-Ting Cheng

IPC分类号： B05D3/06

CPC分类号： H05K3/102 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  H05K3/381 ,  H05K2201/0129 ,  H05K2201/0257 ,  H05K2203/107 ,  H05K2203/128

摘要： A manufacturing method for manufacturing a substrate with a surface substrate by employing photothermal effect is described. Nanoparticles on the surface of the substrate excited by a beam convert light energy to thermal energy. The surface structure on the substrate is formed through the thermal energy generated by the excited nanoparticles. The substrate with a layer of the predetermined pattern is thus formed.

摘要翻译： 描述了通过使用光热效应制造具有表面基板的基板的制造方法。 由光束激发的衬底表面上的纳米颗粒将光能转换成热能。 通过激发的纳米粒子产生的热能形成衬底上的表面结构。 由此形成具有预定图案的层的衬底。

公开(公告)号：US08426964B2

公开(公告)日：2013-04-23

申请号：US13098209

申请日：2011-04-29

申请人： Ruoh-Huey Uang ,  Yi-Ting Cheng

发明人： Ruoh-Huey Uang ,  Yi-Ting Cheng

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L21/4853 ,  B82Y40/00 ,  H01L21/4867 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/11442 ,  H01L2224/11552 ,  H01L2224/13082 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2924/12042 ,  H01L2924/1461 ,  Y10S977/773 ,  H01L2924/00014 ,  H01L2924/00

摘要： A method for forming a micro bump includes forming a first nano-particle layer on a substrate and forming a second nano-particle layer on the first nano-particle layer. The first and second nano-particle layers include a plurality of first nano particles and a plurality of second nano particles, respectively. The method further includes irradiating a laser beam onto the second nano-particle layer, where the laser beam penetrates through the second nano-particle layer and is at least partially absorbed by at least some of the first nano particles to generate heat. The first nano particles and the second nano particles have different absorption rates with respect to the laser beam.

摘要翻译： 形成微凸块的方法包括在基板上形成第一纳米颗粒层，并在第一纳米颗粒层上形成第二纳米颗粒层。 第一和第二纳米颗粒层分别包括多个第一纳米颗粒和多个第二纳米颗粒。 该方法还包括将激光束照射到第二纳米颗粒层上，其中激光束穿过第二纳米颗粒层并且至少部分地被至少一些第一纳米颗粒吸收以产生热量。 第一纳米颗粒和第二纳米颗粒相对于激光束具有不同的吸收速率。

公开(公告)号：US20120273936A1

公开(公告)日：2012-11-01

申请号：US13098209

申请日：2011-04-29

申请人： Ruoh-Huey Uang ,  Yi-Ting Cheng

发明人： Ruoh-Huey Uang ,  Yi-Ting Cheng

IPC分类号： H01L23/498 ,  H01L21/28

CPC分类号： H01L21/4853 ,  B82Y40/00 ,  H01L21/4867 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/11442 ,  H01L2224/11552 ,  H01L2224/13082 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2924/12042 ,  H01L2924/1461 ,  Y10S977/773 ,  H01L2924/00014 ,  H01L2924/00

摘要： A method for forming a micro bump includes forming a first nano-particle layer on a substrate and forming a second nano-particle layer on the first nano-particle layer. The first and second nano-particle layers include a plurality of first nano particles and a plurality of second nano particles, respectively. The method further includes irradiating a laser beam onto the second nano-particle layer, where the laser beam penetrates through the second nano-particle layer and is at least partially absorbed by at least some of the first nano particles to generate heat. The first nano particles and the second nano particles have different absorption rates with respect to the laser beam.

摘要翻译： 形成微凸块的方法包括在基板上形成第一纳米颗粒层，并在第一纳米颗粒层上形成第二纳米颗粒层。 第一和第二纳米颗粒层分别包括多个第一纳米颗粒和多个第二纳米颗粒。 该方法还包括将激光束照射到第二纳米颗粒层上，其中激光束穿过第二纳米颗粒层并且至少部分地被至少一些第一纳米颗粒吸收以产生热量。 第一纳米颗粒和第二纳米颗粒相对于激光束具有不同的吸收速率。

公开(公告)号：US06440836B1

公开(公告)日：2002-08-27

申请号：US09268785

申请日：1999-03-16

申请人： Szu-Wei Lu ,  Ling-Chen Kung ,  Ruoh-Huey Uang ,  Hsu-Tien Hu

发明人： Szu-Wei Lu ,  Ling-Chen Kung ,  Ruoh-Huey Uang ,  Hsu-Tien Hu

IPC分类号： H01L2144

CPC分类号： H01L24/11 ,  H01L24/13 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05166 ,  H01L2224/05169 ,  H01L2224/05171 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05669 ,  H01L2224/1147 ,  H01L2224/13111 ,  H01L2924/00013 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2224/13099 ,  H01L2924/00014

摘要： The present invention discloses a dual-photoresist method for forming fine-pitched solder bumps on flip chips by utilizing two separate layers of photoresist, i.e., a first thin photoresist layer for patterning the BLM layers on top of the aluminum bonding pads and a second thick photoresist layer for patterning the via openings on top of the BLM layers to supply the necessary thickness required for the solder bumps. The first, thin photoresist layer permits an accurate imaging process to be conducted without focusing problems which are normally associated with thick photoresist layers. As an optional step, the present invention may further utilize a thin layer of non-leachable metal such as Cu or Ni for coating on top of the BLM layer and thus further improving the electrical characteristics of the solder bumps subsequently formed thereon. A majority of the BLM layer is removed with the first, thin photoresist layer and thus, in the final BLM removal process, only a very thin adhesion sublayer of the BLM layer needs to be removed and as a result, ensures a clean removal process without damaging the solder bumps already formed with a fine-pitch.

摘要翻译： 本发明公开了一种双光致抗蚀剂方法，用于通过利用两个单独的光致抗蚀剂层（即，用于在铝接合焊盘的顶部上构图BLM层的第一薄光致抗蚀剂层）和倒装芯片上的第二厚度 光刻胶层，用于图案化BLM层顶部的通孔，以提供焊料凸块所需的必要厚度。 第一个薄的光致抗蚀剂层允许进行精确的成像处理，而不需要通常与厚的光致抗蚀剂层相关的聚焦问题。 作为可选步骤，本发明可以进一步利用薄层的不可浸出金属如Cu或Ni涂覆在BLM层的顶部上，从而进一步改善随后在其上形成的焊料凸块的电特性。 BLM层的大部分用第一个薄的光致抗蚀剂层去除，因此在最终的BLM去除过程中，仅需要除去BLM层的非常薄的粘合子层，结果确保清洁的去除过程而不需要 损坏已经形成有微细间距的焊料凸块。

公开(公告)号：US20060243972A1

公开(公告)日：2006-11-02

申请号：US11477412

申请日：2006-06-30

申请人： Ruoh-Huey Uang ,  Yu-Chih Chen ,  Ren-Jan Lin ,  Syh-Yuh Cheng

发明人： Ruoh-Huey Uang ,  Yu-Chih Chen ,  Ren-Jan Lin ,  Syh-Yuh Cheng

IPC分类号： H01L29/08

CPC分类号： H01L23/49827 ,  B82Y10/00 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/29298 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/12044 ,  H01L2924/14 ,  H01R4/04 ,  H01R13/2414 ,  H05K3/323 ,  H05K2201/026 ,  H05K2201/083 ,  H05K2201/10378 ,  H05K2203/0726 ,  H05K2203/104 ,  Y10S977/761 ,  Y10S977/762 ,  Y10S977/766 ,  Y10S977/77 ,  Y10S977/778 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49204 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

摘要： A composite conductive film formed of a polymer-matrix and a plurality of conductive lines less than micro-sized and its fabricating method are provided. The conductive lines are arranged parallel and spaced apart from each other so as to provide anisotropic conductivity. The present conductive film can serve as an electrical connection between a fine-pitch chip and a substrate. Additionally, an adhesive layer is formed on two opposite sides of the conductive film along its conductive direction to increase adhesive areas. The strength and reliability of the package using the conductive film are thus enhanced.

公开(公告)号：US07163885B2

公开(公告)日：2007-01-16

申请号：US10862515

申请日：2004-06-05

申请人： Yu-Chih Chen ,  Ruoh-Huey Uang ,  Yu-Hua Chen

发明人： Yu-Chih Chen ,  Ruoh-Huey Uang ,  Yu-Hua Chen

IPC分类号： H01L21/00

CPC分类号： H01L21/4853 ,  H01L21/2885 ,  H01L24/11 ,  H01L24/83 ,  H01L24/90 ,  H01L2224/13078 ,  H01L2224/13099 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/19042 ,  H01L2924/00

摘要： A method for dispersing and fixing particles on the bumps of a chip using an electrophoresis technology is provided. The particles and chip bumps are processed to carry charges by applying chemical bonding between metal and thiol with electric charges. The chip is placed in a reactor with a solution along with the conductive particles. The conductive particles are then migrated and fixed to the bonding locations on the bumps of a chip through an electrophoresis procedure. For conductive particles not carrying charges, they can sink naturally to the surface of chip bumps due to their higher density than water in the solution. An electroplating procedure is then applied to fix the conductive particles onto the bump.

摘要翻译： 提供了使用电泳技术将颗粒分散并固定在芯片的凸块上的方法。 通过在金属和硫醇之间进行电荷的化学键合来处理颗粒和芯片凸块以携带电荷。 将芯片与导电颗粒一起放置在具有溶液的反应器中。 然后通过电泳方法将导电颗粒迁移并固定到芯片的凸块上的结合位置。 对于不携带电荷的导电颗粒，由于它们比溶液中的密度高，它们可以自然地沉积到芯片凸块的表面。 然后施加电镀程序以将导电颗粒固定到凸块上。

公开(公告)号：US20050048697A1

公开(公告)日：2005-03-03

申请号：US10653860

申请日：2003-09-03

申请人： Ruoh-Huey Uang ,  Yu-Hua Chen

发明人： Ruoh-Huey Uang ,  Yu-Hua Chen

IPC分类号： H01L21/60 ,  H01L23/485 ,  H01L23/532 ,  H05K3/24 ,  H05K3/40 ,  H01L21/50

CPC分类号： H01L24/13 ,  B82Y10/00 ,  H01L23/53276 ,  H01L24/11 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/0508 ,  H01L2224/05111 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05664 ,  H01L2224/05669 ,  H01L2224/1133 ,  H01L2224/13099 ,  H01L2224/13193 ,  H01L2924/0001 ,  H01L2924/01006 ,  H01L2924/01016 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12042 ,  H05K3/06 ,  H05K3/249 ,  H05K3/4007 ,  H05K2201/026 ,  Y10S977/882 ,  H01L2924/00014 ,  H01L2924/00

摘要： A self-assembled nanometer conductive bump and a method for fabricating the bump. In the method, a multiplicity of carbon nanotubes that are coated at two ends with chemically functional groups is first provided. A substrate that is equipped with at least one bond pad on a surface is then positioned juxtaposed to the carbon nanotubes for forming a bond between the carbon nanotubes and the metal pads facilitated by a chemical affinity existed between the functional groups and the metal pad.

摘要翻译： 一种自组装纳米导电凸块及其制造方法。 在该方法中，首先提供用化学官能团在两端涂覆的多个碳纳米管。 然后将配备有表面上的至少一个键合焊盘的衬底与碳纳米管并置放置，以形成碳纳米管与金属衬底之间的键，这通过官能团和金属衬垫之间存在的化学亲合力而促进。