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公开(公告)号:US12130241B2
公开(公告)日:2024-10-29
申请号:US18093032
申请日:2023-01-04
Applicant: Microchip Technology Incorporated
Inventor: Yaojian Leng
IPC: G01N21/95 , G01N17/02 , G01N21/47 , G01N21/88 , H01L21/66 , H01L23/522 , H01L23/528 , H01L23/532 , H01L31/02 , H01L31/103
CPC classification number: G01N21/9501 , G01N17/02 , G01N21/47 , G01N21/8851 , H01L22/14 , H01L23/5226 , H01L23/528 , H01L23/53238 , H01L31/02005 , H01L31/103 , G01N2021/4735 , G01N2201/06113
Abstract: Systems and methods for monitoring copper corrosion in an integrated circuit (IC) device are disclosed. A corrosion-sensitive structure formed in the IC device may include a p-type active region adjacent an n-type active region to define a p-n junction space charge region. A copper region formed over the silicon may be connected to both the p-region and n-region by respective contacts, to thereby define a short circuit. Light incident on the p-n junction space charge region, e.g., during a CMP process, creates a current flow through the metal region via the short circuit, which drives chemical reactions that cause corrosion in the copper region. Due to the short circuit configuration, the copper region is highly sensitive to corrosion. The corrosion-sensitive structure may be arranged with less corrosion-sensitive copper structures in the IC device, with the corrosion-sensitive structure used as a proxy to monitor for copper corrosion in the IC device.
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公开(公告)号:US20240353946A1
公开(公告)日:2024-10-24
申请号:US18429684
申请日:2024-02-01
Applicant: Microchip Technology Incorporated
Inventor: Axel Heim
CPC classification number: G06F3/0416 , G06F3/0446
Abstract: Systems having a capacitive touch sensing system with transmit and receive electrodes positioned to have mutual capacitances at node intersections that deviate when a node is touched; a processor; and a machine readable storage medium with instructions to: assign complete code words to transmit electrodes; identify a subset of transmit electrodes based on a prior touch position estimate; generate a transmit signal for the transmit electrodes; receive a first portion of a receive signal for receive electrodes indicative of capacitances; decode the first portion of the receive signal of receive electrodes using the first portions of the code words; and compute touch position estimates for the subset of transmit electrodes based on the decoded first portions of the receive signals.
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23.
公开(公告)号:US12111188B2
公开(公告)日:2024-10-08
申请号:US17648743
申请日:2022-01-24
Applicant: Microchip Technology Incorporated
Inventor: Ganesh Shaga , Surendra Akkina , Sudheer Puttapudi
CPC classification number: G01D5/2275 , G01D5/204 , G01D2205/77
Abstract: An apparatus for inductive linear-position sensing is disclosed. An apparatus may include a support structure and an electrically conductive material defining a continuous path for electrical current to flow between a first location and a second location. The continuous path may include: a first path portion defining a first spiraling path for the electrical current to flow in a clockwise direction around a first axis; a second path portion laterally spaced from the first path portion and defining a second spiraling path for the electrical current to flow in a counter-clockwise direction around a second axis; a first coupling portion coupling an inner portion of the first path portion to an inner portion of the second path portion; and a second coupling portion coupling an outer portion of the second path portion to an outer portion of the first path portion. Related systems, devices, and methods are also disclosed.
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公开(公告)号:US12040632B2
公开(公告)日:2024-07-16
申请号:US17664769
申请日:2022-05-24
Applicant: Microchip Technology Incorporated
Inventor: Santosh Bhandarkar , Alex Dumais
Abstract: Object detection in wireless power systems and related system, methods, and devices are disclosed. A controller for a wireless power transmitter includes a measurement voltage potential input terminal and a processing core. The processing core is to determine an average of peak to peak amplitude differences present in sampled measurement voltage potentials for each of the plurality of transmit coils, determine a lowest average of the peak to peak amplitude differences, and select a transmit coil corresponding to the lowest average of the peak to peak amplitude differences to transmit wireless power to a receive coil of a wireless power receiver. A wireless power system includes a tank circuit selectively including any one of a plurality of transmit coils.
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公开(公告)号:US20240230308A9
公开(公告)日:2024-07-11
申请号:US18490039
申请日:2023-10-19
Applicant: Microchip Technology Incorporated
Inventor: Ganesh Shaga , Kevin Mark Smith , Hwangsoo Choi , Surendra Akkina , Sudheer Puttapudi
Abstract: An apparatus comprises a target to rotate about an axis; an excitation coil to carry an excitation signal; and a first sense coil to carry a sense signal induced by the excitation signal. The first sense coil comprises two or more lobes in one or more planes that are perpendicular to the axis. The two or more lobes comprise a first lobe at a first position relative to the axis and a second lobe at a second position relative to the axis. The second position is substantially the same radial distance from the axis as the first position is from the axis. The second position is at an angular distance of Θ from the first position, where Θ=180°±α/2, and α is a measurement range for angular-position sensing (e.g., α=60°) within a range of 50% to 150% of α.
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公开(公告)号:US12031817B2
公开(公告)日:2024-07-09
申请号:US17808600
申请日:2022-06-24
Applicant: Microchip Technology Incorporated
Inventor: Ganesh Shaga
Abstract: Examples disclosed herein relate generally to inductive angular-position sensors. An example apparatus may include a support structure, a first inductive angular-position sensor, a second inductive angular-position sensor, and a shield. The first inductive angular-position sensor may include a respective first sense coil arranged at a first portion of the support structure. The respective first sense coil may at least partially circumscribe an axis. The second inductive angular-position sensor may include a respective first sense coil arranged opposite the first sense coil of the first inductive angular-position sensor at a second portion of the support structure. The first sense coil of the first inductive angular-position sensor may at least partially circumscribe the axis. The shield may be arranged between the first sense coil of the first inductive angular-position sensor and the first sense coil of the second inductive angular-position sensor.
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公开(公告)号:US12001270B2
公开(公告)日:2024-06-04
申请号:US18075458
申请日:2022-12-06
Applicant: Microchip Technology Incorporated
Inventor: Michael Catherwood , David Mickey
CPC classification number: G06F11/0745 , G06F9/30101
Abstract: A computer system includes a non-transitory computer-readable memory to store (a) a vector table including an exception vector pointing to an exception handler and (b) a vector fail address of a vector fetch bus error handler, and a processor to identify an exception, initiate an exception vector fetch in response to the identified exception to read the exception vector from the vector table, identify a vector fetch bus error associated with the exception vector fetch, access the vector fail address of the vector fetch bus error handler in response to the vector fetch bus error, and execute the vector fetch bus error handler.
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公开(公告)号:US20240153921A1
公开(公告)日:2024-05-09
申请号:US18202356
申请日:2023-05-26
Applicant: Microchip Technology Incorporated
Inventor: Randy Yach , Paul Schimel
CPC classification number: H01L25/072 , H01L21/568 , H01L24/19 , H01L24/20 , H01L24/96 , H01L25/50 , H01L24/94 , H01L2224/19 , H01L2224/214 , H01L2224/215 , H01L2224/221 , H01L2224/224 , H01L2224/94 , H01L2224/96 , H01L2924/01022 , H01L2924/01029 , H01L2924/0132 , H01L2924/10272 , H01L2924/13091
Abstract: An electronic package includes a first integrated circuit (IC) die arranged in a first orientation, a second IC die arranged in a second orientation inverted relative to the first orientation, at least one upper conductive routing layer extending over the first IC die and second IC die, at least one lower conductive routing layer extending under the first IC die and second IC die, and a mold compound at least partially encapsulating the first IC die and the second IC die.
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29.
公开(公告)号:US20240098283A1
公开(公告)日:2024-03-21
申请号:US18471047
申请日:2023-09-20
Applicant: Microchip Technology Incorporated
Inventor: Thorsten Kummermehr , Martin Miller , Jan Huber
IPC: H04N19/186 , G06V10/75
CPC classification number: H04N19/186 , G06V10/751
Abstract: One or more examples relate to selectively line-based encoding pixels of an image via run-length encoding or gradient encoding. A method includes, for at least a portion of an image, determining a highest number of: a number of pixels in a run compressible via run-length encoding, and a number of pixels in a run compressible via gradient encoding; and selectively encoding at least some pixels of an image via the one of run-length encoding or gradient encoding corresponding to the determined highest number.
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公开(公告)号:US11929604B2
公开(公告)日:2024-03-12
申请号:US17443080
申请日:2021-07-20
Applicant: Microchip Technology Incorporated
Inventor: Daniel Harfert
CPC classification number: H02H1/06 , H02H1/0007
Abstract: One or more examples relate, generally, to a programmable voltage lockout circuit provided at an electronic device. Such a programmable voltage lockout circuit asserts a lockout of the electronic device at least partially responsive to a user-programmed threshold and a supply voltage of the electronic device. One or more examples relate, generally, to configuring a programmable voltage lockout circuit utilizing a user-programmed threshold.
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