公开(公告)号：US10685843B2

公开(公告)日：2020-06-16

申请号：US16044448

申请日：2018-07-24

Applicant: MICROLINK DEVICES, INC.

Inventor： Christopher Youtsey ,  Robert McCarthy

IPC: H01L21/306 ,  H01L21/3063 ,  H01L31/0236 ,  H01L33/00 ,  H01L21/78 ,  H01L21/02 ,  H01L21/67 ,  H01L29/20 ,  H01L33/22

Abstract: Methods and systems for etching a substrate using photoenhanced wet etching techniques are described. At least one light emitting diode source is used to create a high intensity of ultraviolet light at the surface of the substrate or at one or more layers formed on the substrate. Etching rates in GaN substrates and GaN layers are improved by an order of magnitude over conventional systems. Systems and methods for forming a device structure free of a substrate are described. The device structure is grown or applied over a release layer on a substrate. The device structure is exposed to photoenhanced wet etch environments to vertically and laterally etch the release layer to separate the device structure from the substrate.

公开(公告)号：US10522363B2

公开(公告)日：2019-12-31

申请号：US16044479

申请日：2018-07-24

Applicant: MICROLINK DEVICES, INC.

Inventor： Christopher Youtsey ,  Robert McCarthy ,  Rekha Reddy

IPC: H01L21/306 ,  H01L21/78 ,  H01L21/3063 ,  H01L33/00 ,  H01L21/02 ,  H01L31/0236 ,  H01L21/67 ,  H01L29/20 ,  H01L33/22

Abstract: Methods and systems for forming a device structure free of a substrate are described. Exemplary embodiments include a device structure comprising of device layers, a release layer, an etch stop layer, and a substrate. The device structure is exposed to photoenhanced wet etch environments to vertically and laterally etch the release layer to separate the device layers from the substrate. The device structure can include a contact layer, an etch stop layer, or both in some embodiments.

公开(公告)号：US10214295B2

公开(公告)日：2019-02-26

申请号：US15589342

申请日：2017-05-08

Applicant: MICROLINK DEVICES, INC.

Inventor： Noren Pan ,  Raymond Chan ,  Haruki Miyamoto ,  Andree Wibowo ,  Mark Osowski ,  Christopher Youtsey ,  David McCallum

IPC: H01L31/046 ,  B64D27/24 ,  B60L8/00 ,  B64C39/02 ,  H02S10/40 ,  B60L11/18

Abstract: Some embodiments include a high efficiency, lightweight solar sheet. Some embodiments include a solar sheet configured for installation on a surface of a UAV or on a surface of a component of a UAV. The solar sheet includes a plurality of solar cells and a polymer layer to which the plurality of solar cells are attached. Some embodiments include a kit for supplying solar power in a battery-powered or fuel cell powered unmanned aerial vehicle (UAV) by incorporating flexible solar cells into a component of a UAV, affixing flexible solar cells to a surface of a UAV, or affixing flexible solar cells to a surface of a component of a UAV. The kit also includes a power conditioning system configured to operate the solar cells within a desired power range and configured to provide power having a voltage compatible with an electrical system of the UAV.

公开(公告)号：US20180294372A1

公开(公告)日：2018-10-11

申请号：US15947683

申请日：2018-04-06

Applicant: MICROLINK DEVICES, INC.

Inventor： Christopher Youtsey ,  Rekha Reddy ,  Christopher Stender

IPC: H01L31/0463 ,  H01L31/05 ,  H01L31/048

Abstract: Systems and methods taught herein provide thin film semiconductor devices such as thin film photovoltaic devices having via holes that enable electrical connection with a bottom surface of a topside contact of the thin film semiconductor device via the back side of the device (e.g., during mounting of the device). In some embodiments, the via holes are electrically insulated.

公开(公告)号：US09650148B2

公开(公告)日：2017-05-16

申请号：US15131754

申请日：2016-04-18

Applicant: MICROLINK DEVICES, INC.

Inventor： Noren Pan ,  Raymond Chan ,  Haruki Miyamoto ,  Andree Wibowo ,  Mark Osowski ,  Christopher Youtsey ,  David McCallum

IPC: B64D27/24 ,  B60L8/00 ,  B64C39/02 ,  H01L31/046 ,  H02S10/40 ,  H02S10/00 ,  B60L11/18

CPC classification number: B64D27/24 ,  B60L8/003 ,  B60L11/1809 ,  B60L11/1881 ,  B60L2200/10 ,  B64C39/024 ,  B64C2201/021 ,  B64C2201/042 ,  B64D2211/00 ,  B64D2221/00 ,  H01L31/046 ,  H02S10/40 ,  Y02T10/7083

Abstract: Some embodiments include a kit for supplying solar power in a battery-powered or fuel cell powered unmanned aerial vehicle (UAV) by incorporating flexible solar cells into a component of a UAV, affixing flexible solar cells to a surface of a UAV, or affixing flexible solar cells to a surface of a component of a UAV. The kit also includes a power conditioning system configured to operate the solar cells within a desired power range and configured to provide power having a voltage compatible with an electrical system of the UAV. Another embodiments include a solar sheet configured for installation on a surface of a UAV or on a surface of a component of a UAV. The solar sheet includes a plurality of solar cells and a polymer layer to which the plurality of solar cells are attached.

公开(公告)号：US20140004645A1

公开(公告)日：2014-01-02

申请号：US13931463

申请日：2013-06-28

Applicant: MicroLink Devices, Inc.

Inventor： Raymond CHAN ,  Haruki MIYAMOTO

IPC: H01L31/18

CPC classification number: H01L31/1876 ,  H01L31/0508 ,  Y02E10/50 ,  Y02P70/521

Abstract: The method of the invention includes the sequential steps of providing a plurality of solar cells, interconnecting the solar cells using one or more interconnect tabs, attaching the interconnect tabs to a top side of the solar cell to interconnect the plurality of solar cells by coupling an exposed top surface of a first solar cell to a top surface of an adjacent second solar cell, attaching one or more bypass diodes to a top side of the solar cell, then next applying an adhesive to a first film layer, placing the plurality of solar cells onto the first film layer, then next applying an adhesive to a second film layer, placing the plurality of solar cells and first film layer onto the second film layer to form a sheet assembly, and then forming the solar sheet from the sheet assembly.

Abstract translation: 本发明的方法包括提供多个太阳能电池的顺序步骤，使用一个或多个互连接片互连太阳能电池，将互连接片连接到太阳能电池的顶侧，以通过将多个太阳能电池联接 将第一太阳能电池的暴露的顶表面暴露于相邻的第二太阳能电池的顶表面，将一个或多个旁路二极管附接到太阳能电池的顶侧，然后将粘合剂施加到第一膜层，将多个太阳能 将电池放置在第一膜层上，然后接着将粘合剂施加到第二膜层，将多个太阳能电池和第一膜层放置在第二膜层上以形成片组件，然后从片组件形成太阳能片。

公开(公告)号：US20130285440A1

公开(公告)日：2013-10-31

申请号：US13769223

申请日：2013-02-15

Applicant: MICROLINK DEVICES, INC.

Inventor： Noren Pan ,  Raymond Chan ,  Haruki Miyamoto ,  Andree Wibowo ,  Mark Osowski ,  Christopher Youtsey ,  David McCallum

IPC: B64C39/02

CPC classification number: B64D27/24 ,  B60L8/003 ,  B60L11/1809 ,  B60L11/1881 ,  B60L2200/10 ,  B64C39/024 ,  B64C2201/021 ,  B64C2201/042 ,  B64D2211/00 ,  B64D2221/00 ,  H01L31/046 ,  H02S10/40 ,  Y02T10/7083

Abstract: Some embodiments include a kit for increasing endurance of a battery-powered unmanned aerial vehicle (UAV) by incorporating flexible solar cells or applying flexible solar cells on a surface of a UAV or on a surface of a component of a UAV. The kit further include a power conditioning system configured to operate the solar cells within a desired power range and configured to provide power having a voltage compatible with an electrical system of the UAV.

Abstract translation: 一些实施例包括用于通过结合柔性太阳能电池或在无人机的表面上或在UAV的部件的表面上施加柔性太阳能电池来增加电池供电的无人机（UAV）的耐久性的套件。 该套件还包括功率调节系统，其配置为在期望的功率范围内操作太阳能电池并且被配置为提供具有与UAV的电气系统兼容的电压的功率。

公开(公告)号：US20130133730A1

公开(公告)日：2013-05-30

申请号：US13752065

申请日：2013-01-28

Applicant: Microlink Devices, Inc.

Inventor： Noren Pan ,  Glen Hillier ,  Mark Wanlass ,  Christopher Youtsey ,  Jessica Adams

IPC: H01L31/0725

CPC classification number: H01L31/1896 ,  B82Y20/00 ,  H01L31/03046 ,  H01L31/035236 ,  H01L31/0443 ,  H01L31/046 ,  H01L31/047 ,  H01L31/0687 ,  H01L31/06875 ,  H01L31/0725 ,  H01L31/1844 ,  Y02E10/544 ,  Y02P70/521

Abstract: Methods of producing single-junction or multi-junction InP-based solar cells grown latticed-matched on a InP substrate or grown on metamorphic layers on a GaAs substrate, with the substrate subsequently removed in a nondestructive manner via the epitaxial lift-off (ELO) technique, and devices produced using the methods are described herein.

公开(公告)号：US20130034926A1

公开(公告)日：2013-02-07

申请号：US13649367

申请日：2012-10-11

Applicant: MicroLink Devices, Inc.

Inventor： Raymond CHAN ,  Christopher YOUTSEY

IPC: H01L31/18

CPC classification number: H01L31/0504 ,  H01L31/0508 ,  Y02E10/50

Abstract: An assembly technique for assembling solar cell arrays is provided. During the fabrication of a solar cell, openings through the semiconductor layer are etched through to a top surface of the backmetal layer. The solar cells include an exposed top surface of the backmetal layer. A plurality of solar cells are assembled into a solar cell array where adjacent cells are interconnected in an electrically serial or parallel fashion solely from the top surface of the solar cells.

Abstract translation: 提供了组装太阳能电池阵列的装配技术。 在制造太阳能电池期间，通过半导体层的开口被蚀刻到背面金属层的顶表面。 太阳能电池包括背面金属层的暴露的顶表面。 多个太阳能电池被组装成太阳能电池阵列，其中相邻电池单独地以电串联或并联的方式从太阳能电池的顶表面互连。

公开(公告)号：US20030025128A1

公开(公告)日：2003-02-06

申请号：US10200892

申请日：2002-07-22

Applicant: MicroLink Devices, Inc.

Inventor： Noren Pan ,  Byung-Kwon Han

IPC: H01L031/0328

CPC classification number: H01L29/66318 ,  H01L29/0817 ,  H01L29/1004 ,  H01L29/452 ,  H01L29/7371

Abstract: A heterojunction bipolar transistor is provided having an improved current gain cutoff frequency. The heterojunction bipolar transistor includes a contact region formed from InGaAsSb. The contact region allows an emitter region of the heterojunction bipolar transistor to realize a lower contact resistance value to yield an improved cutoff frequency (fT).