Abstract:
A method for fast programming of non-volatile memory cells in a non-volatile memory array comprises the steps of providing an acceleration voltage greater than the internal pump voltage supplied by a conventional internal drain pump, providing a program write command, and coupling the acceleration voltage to provide a programming current to all of the bit lines selected to be programmed at a time. In an embodiment, the acceleration voltage is reduced to a drain voltage before it is applied to the drains of the memory cells. In an embodiment in which the flash memory cells comprise typical dual-gate NOR devices, the acceleration voltage is in the range of about 7 V to about 10 V, and the drain voltage is on the order of about 5 V. The sources of the memory cells are grounded during the fast programming operation. In a further embodiment, the method further comprises the steps of detecting the acceleration voltage, generating an acceleration voltage indicator signal in response to the presence of the acceleration voltage, and generating a fast program write command in response to the acceleration voltage indicator signal and the program write command to set the flash memory cells in a fast program mode.
Abstract:
A system and methodology that can minimize disturbance during an AC operation associated with a memory, such as, program, read and/or erase, is provided. The system pre-charges all or a desired subset of the bit lines in a memory array to a specified voltage, during an AC operation to facilitate reducing AC disturbances between neighboring cells. A pre-charge voltage can be applied to all bit lines in a block in the memory array, or to bit lines associated with a selected memory cell and neighbor memory cells adjacent to the selected memory cell in the block. The system ensures that source and drain voltage levels can be set to desired levels at the same or substantially the same time, while selecting a memory cell. This can facilitate minimizing AC disturbances in the selected memory cell during the AC operation.
Abstract:
A system and methodology that can minimize disturbance during an AC operation associated with a memory, such as, program, read and/or erase, is provided. The system pre-charges all or a desired subset of the bit lines in a memory array to a specified voltage, during an AC operation to facilitate reducing AC disturbances between neighboring cells. A pre-charge voltage can be applied to all bit lines in a block in the memory array, or to bit lines associated with a selected memory cell and neighbor memory cells adjacent to the selected memory cell in the block. The system ensures that source and drain voltage levels can be set to desired levels at the same or substantially the same time, while selecting a memory cell. This can facilitate minimizing AC disturbances in the selected memory cell during the AC operation.
Abstract:
A system and methodology that can minimize disturbance during an AC operation associated with a memory, such as, program, read and/or erase, is provided. The system pre-charges all or a desired subset of the bit lines in a memory array to a specified voltage, during an AC operation to facilitate reducing AC disturbances between neighboring cells. A pre-charge voltage can be applied to all bit lines in a block in the memory array, or to bit lines associated with a selected memory cell and neighbor memory cells adjacent to the selected memory cell in the block. The system ensures that source and drain voltage levels can be set to desired levels at the same or substantially the same time, while selecting a memory cell. This can facilitate minimizing AC disturbances in the selected memory cell during the AC operation.
Abstract:
A method is provided for programming a nonvolatile memory device including an array of memory cells, where each memory cell including a substrate, a control gate, a charge storage element, a source region and a drain region. The method includes receiving a programming window that identifies a plurality of memory cells in the array. A first group of memory cells to be programmed is identified from the plurality of memory cells in the programming window. The first group of memory cells is programmed and a programming state of the first group of memory cells is verified.
Abstract:
A non-volatile memory, such as a Flash memory, is configured to perform a random multi-page read operation. The memory may include a core array of non-volatile memory cells and input lines for receiving an indication of the random multi-page read operation. Further, the memory may include a multi-level volatile memory coupled to the core array that is configured to simultaneously process multiple pages of data from the core array in a pipelined manner. Output lines are coupled to the multi-level volatile memory and output the pages of data from the memory device.
Abstract:
A method of forming flexibly partitioned metal line segments 10 and 12 for separate memory banks in a simultaneous operation flash memory device with a flexible bank partition architecture comprises the steps of providing a basic metal layer 2 comprising a plurality of basic metal layer segments 2a, 2b, 2c, . . . 2j separated by a plurality of gaps 6a, 6b, 6c, . . . 6i, each of the gaps having a predefined gap interval length, and providing a metal option layer 8 comprising a plurality of metal option layer segments on the basic metal layer 2, the metal option layer segments overlapping the gaps between the basic metal layer segments but leaving one of the gaps open, to form the metal line segments for the separate memory banks.
Abstract:
A decoding circuit 54 for a simultaneous operation non-volatile memory device with a flexible bank partition architecture comprises an X-decoder 44, a lower bank decoder 58, an upper bank decoder 56, and a plurality of flexibly partitioned conductive lines coupled between the upper and lower bank decoders 56 and 58. The flexibly partitioned conductive lines 60, 62, 64, . . . 74 provide a plurality of bank address pre-decoding bits for the X-decoder 44 to row decode the memory cells along the respective word lines in the memory array 20. The memory array 20 includes a plurality of flexibly partitioned bit lines comprising first and second bit line segments to partition the memory array into upper and lower memory banks. The bit line segments in the upper and lower memory banks are coupled to two Y-decoders 32 and 34 which provide column decoding for the memory cells in the upper and lower memory banks.
Abstract:
An integrated circuit including an array of flash EEPROM memory cells wherein overerase correction is provided after application of each erase pulse.