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公开(公告)号：US20240056094A1
公开(公告)日：2024-02-15
申请号：US18269247
申请日：2021-12-28
Applicant: Obsidian Sensors, Inc.
Inventor： Bing WEN , John HONG , Edward CHAN
IPC: H03M3/00
Abstract: Data converter circuits and methods of operating the data converter circuits are disclosed. In some embodiments, a data converter circuit includes a charge measurement circuit. In some embodiments, the charge measurement circuit is a capacitive transimpedance amplifier (CTIA). In some embodiments, the data converter circuit includes the CTIA, a quantizer, a digital-to-analog converter, a summer, and a digital filter. In some embodiments, the data converter circuit includes an analog-to-digital converter electrically coupled to the CTIA and the digital filter. In some embodiment, a method includes integrating an input signal with a CTIA, determining whether a CTIA output signal is greater than a threshold, and reducing the CTIA output signal or forgoing the reducing based on the determination of whether the CTIA output signal is greater than the threshold.
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公开(公告)号：US20240043264A1
公开(公告)日：2024-02-08
申请号：US18266514
申请日：2021-12-09
Applicant: Obsidian Sensors, Inc.
Inventor： Tallis CHANG , Sean ANDREWS
CPC classification number: B81B7/0006 , B81C3/001 , B81B2201/0207 , B81B2207/07 , B81C2203/035
Abstract: Some embodiments include methods of manufacturing a plurality of MEMS devices, each device including a first material and a second material with different CTE. The method includes providing a carrier with substantially equal CTE as the first material, the carrier comprising a plurality of cavities. The method also includes positioning a plurality of components in respective cavities of the carrier, the components comprising the second material. In some embodiments, the method includes positioning a layer of the first material on the second material components. In some embodiments, the method includes bonding the first material layer and the second material components. The method also includes removing the carrier and singulating the first material layer to produce the plurality of MEMS devices.
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公开(公告)号：US11624657B2
公开(公告)日：2023-04-11
申请号：US17267789
申请日：2019-08-09
Applicant: Obsidian Sensors, Inc.
Inventor： John Hong , Bing Wen , Edward Chan , Tallis Chang , Sean Andrews
Abstract: Disclosed herein are MEMS devices and systems and methods of manufacturing or operating the MEMS devices and systems for transmitting and detecting radiation. The devices and methods described herein are applicable to terahertz radiation. In some embodiments, the MEMS devices and systems are used in imaging applications. In some embodiments, a microelectromechanical system comprises a glass substrate configured to pass radiation from a first surface of the glass substrate through a second surface of the glass substrate, the glass substrate comprising TFT circuitry; a lid comprising a surface; spacers separating the lid and glass substrate; a cavity defined by the spacers, surface of the lid, and second surface of the glass substrate; a pixel in the cavity, positioned on the second surface of the glass substrate, electrically coupled to the TFT circuitry, and comprising an absorber to detect the radiation; and a reflector to direct the radiation to the absorbers and positioned on the lid.
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公开(公告)号：US20230036855A1
公开(公告)日：2023-02-02
申请号：US17815895
申请日：2022-07-28
Applicant: Obsidian Sensors, Inc.
Inventor： Heesun SHIN , John HONG , Tallis CHANG , Bing WEN
Abstract: Circuitries for controlling a power consuming device are disclosed. Methods for operating the circuitries and manufacturing the circuitries are also disclosed. In some embodiments, the circuit comprises a first thin-film transistor (TFT), a second TFT, and a storage capacitor. The first TFT is configured to output a current to a power consuming device. The second TFT is configured to provide a control voltage to the first TFT for controlling an amount of the current. The storage capacitor is configured to store the control voltage.
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公开(公告)号：US11555744B2
公开(公告)日：2023-01-17
申请号：US17048046
申请日：2019-04-17
Applicant: Obsidian Sensors, Inc.
Inventor： Edward Chan , Bing Wen , John Hong , Tallis Chang , Seung-Tak Ryu
Abstract: Methods of sensor readout and calibration and circuits for performing the methods are disclosed. In some embodiments, the methods include driving an active sensor at a voltage. In some embodiments, the methods include use of a calibration sensor, and the circuits include the calibration sensor. In some embodiments, the methods include use of a calibration current source and circuits include the calibration current source. In some embodiments, a sensor circuit includes a Sigma-Delta ADC. In some embodiments, a column of sensors is readout using first and second readout circuits during a same row time.
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Patent Agency Ranking
公开(公告)号：US20200294878A1
公开(公告)日：2020-09-17
申请号：US16660664
申请日：2019-10-22
Applicant: Obsidian Sensors, Inc.
Inventor： Yaoling PAN , Tallis Young CHANG , John Hyunchul HONG
IPC: H01L23/31 , B81C1/00 , B81B7/00 , H01L21/56 , H01L21/683 , H01L21/768 , H01L23/522 , H01L23/528 , H01L27/12 , H01L33/52 , H01L33/62 , H01L51/00 , H01L51/52 , H01L51/56
Abstract: This disclosure provides devices and methods for 3-D device packaging with backside interconnections. One or more device elements can be hermetically sealed from an ambient environment, such as by vacuum lamination and bonding. One or more via connections provide electrical interconnection from a device element to a back side of a device substrate, and provide electrical interconnection from the device substrate to external circuitry on the back side of the device. The external circuitry can include a printed circuit board or flex circuit. In some implementations, an electrically conductive pad is provided on the back side, which is electrically connected to at least one of the via connections. In some implementations, the one or more via connections are electrically connected to one or more electrical components or interconnections, such as a TFT or a routing line.
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公开(公告)号：US20180364439A1
公开(公告)日：2018-12-20
申请号：US15625089
申请日：2017-06-16
Applicant: OBSIDIAN SENSORS, INC.
Inventor： Yaoling PAN , Jian MA , John HONG , Tallis CHANG
Abstract: Conventional optical lens assembly typically require a capping window, which is expensive, to protect the optical sensor. Also, each conventional optical lens assembly is discretely assembled, and thus incurs additional costs. To address these and other disadvantages, it is proposed to assemble a plurality of imaging sensors, a plurality of spacers, and a plurality of lenses at a panel. The resulting lens assembly array can be individualized into separate lens assemblies.
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公开(公告)号：US09936129B2
公开(公告)日：2018-04-03
申请号：US15183528
申请日：2016-06-15
Applicant: OBSIDIAN SENSORS, INC.
Inventor： Bing Wen , Edward Chan , Shen-Ge Wang , Jian Ma , John Hong
CPC classification number: H04N5/23232 , G06T3/4053 , H04N5/2258 , H04N5/2621
Abstract: Techniques are disclosed for generating a high resolution image from a plurality of images captured from a plurality of sensors. The pixels in one sensor have at least one of different size, shape, or orientation than pixels in another sensor. The difference in size, shape, or orientation of the pixels and the interconnection of pixels on respective sensors provides a high level of certainty that there will be sufficient difference in the captured images, with limited loss in image content, to generate a relatively high resolution image from the images captured by the respective sensors.
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公开(公告)号：US12006209B2
公开(公告)日：2024-06-11
申请号：US16980792
申请日：2019-03-14
Applicant: Obsidian Sensors, Inc.
Inventor： John Hong , Tallis Chang , Edward Chan , Bing Wen , Yaoling Pan , Sean Andrews
CPC classification number: B81C1/00595 , B81B3/0081 , B81C1/0069 , G01J5/20 , B81B2201/0207 , B81B2203/019 , B81C2201/0105 , B81C2201/014
Abstract: A method of manufacturing an electromechanical systems structure includes manufacturing sub-micron structural features. In some embodiments, the structural features are less than the lithographic limit of a lithography process.
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公开(公告)号：US20230343130A1
公开(公告)日：2023-10-26
申请号：US17763591
申请日：2020-09-23
Applicant: Obsidian Sensors, Inc.
IPC: G06V40/13
CPC classification number: G06V40/1318
Abstract: Methods and systems for sensing a user interaction (e.g., a fingerprint) with a display of an electronic device are disclosed. In some embodiments, the method includes illuminating, with a light source, a position of a user interaction on the display. In some embodiments, the method includes detecting, with a detector, a backscattered light from the position. In some embodiments, the light source and the detector are located on a same layer of the display.
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