公开(公告)号：US06581279B1

公开(公告)日：2003-06-24

申请号：US09763203

申请日：2001-04-04

Applicant: Pierre Gidon ,  Paul Philippe

Inventor： Pierre Gidon ,  Paul Philippe

IPC: H05K336

CPC classification number: H01L24/80 ,  H01L23/147 ,  H01L24/45 ,  H01L24/48 ,  H01L25/50 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  Y10T29/49121 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49144 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Method of collectively packaging a plurality of electronic components formed in a first substrate, wherein the electronic components are separated from one other by separation strips associated with a plurality of conducting tracks formed on a second substrate. The conducting tracks on the second substrate are associated with contact pads of the components in the first substrate. Each conducting track on the second substrate includes a connection strip arranged to coincide with associated depressions in the first substrate when the first and second substrates are mated. After mating, the components are separated into individualized electronic modules by forming proximal trenches in the first substrate and distal trenches in the second substrate. The proximal trenches are formed around the components in the first substrate to open up into the depressions in the first substrate. The distal trenches are formed further away from the components than the proximal trenches in regions comprising the connection strips on the second substrate.

Abstract translation: 集体包装形成在第一基板中的多个电子部件的方法，其中电子部件通过与形成在第二基板上的多个导电轨道相关联的分隔条彼此分离。 第二衬底上的导电轨道与第一衬底中的部件的接触焊盘相关联。 第二基板上的每个导电轨道包括连接带，当连接第一和第二基板时，该连接条布置成与第一基板中相关联的凹陷重合。 在配合之后，通过在第一衬底中形成近端沟槽和在第二衬底中形成远端沟槽，将部件分离成单独的电子模块。 近端沟槽围绕第一衬底中的部件形成以打开到第一衬底中的凹陷中。 在包括第二基底上的连接条的区域中，远端沟槽比在远端沟槽处远离部件形成。

公开(公告)号：US06423573B1

公开(公告)日：2002-07-23

申请号：US09530034

申请日：2000-04-24

Applicant: Pierre Gidon

Inventor： Pierre Gidon

IPC: H01L2144

CPC classification number: H01L21/764 ,  H01L21/563 ,  H01L23/051 ,  H01L23/147 ,  H01L24/24 ,  H01L24/81 ,  H01L24/82 ,  H01L2224/24226 ,  H01L2224/2518 ,  H01L2224/73203 ,  H01L2224/81192 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/00

Abstract: A method of producing an integrated circuit having a plurality of electronic components by the steps of: a) forming plurality of components with connection points in a substrate plate; b) forming a connection support of conducting tracks; c) transferring the substrate plate onto the connection support connecting the connection points with the conducting tracks; d) forming at least one separation trench in the substrate plate, surrounding a portion of substrate having at least one electronic component, in a way that separates it from the other components in the plate; and e) filling the trenches with a dielectric material.

Abstract translation: 一种通过以下步骤制造具有多个电子部件的集成电路的方法：a）在衬底板中形成具有连接点的多个部件; b）形成导电轨道的连接支撑件; c）将所述衬底板转移到 连接支撑件，其将连接点与导电轨道连接; d）在衬底板中形成至少一个分离槽，围绕具有至少一个电子部件的衬底的一部分，以将其与板中的其它部件分离; 和）用电介质材料填充沟槽。

公开(公告)号：US6009218A

公开(公告)日：1999-12-28

申请号：US861636

申请日：1997-05-22

Applicant: Gilles Grand ,  Pierre Gidon

Inventor： Gilles Grand ,  Pierre Gidon

IPC: G02B6/122 ,  G02B6/12 ,  G02B6/42 ,  G02F1/01 ,  H01L33/00 ,  G02B6/10

CPC classification number: G02B6/42 ,  G02B6/4234 ,  G02B2006/12176 ,  G02B2006/12178

Abstract: A support designed for hybrid optoelectronics, including at least one integrated optical guide and including a substrate on which the optical guide has been created by depositing a suitable material on the substrate to create a lower confinement layer, a guide core layer, and an upper confinement layer. The optical guide is designed to be optically connected to an optoelectronic component mounted on the support, in which the support positions the component to ensure its optical alignment with the optical guide. The support includes abutments located at the core level, or defined in a confinement layer in relation to the core layer, to ensure the vertical positioning of the component. The invention also relates to processes for producing the support.

Abstract translation: 专为混合光电子设计的支撑件，包括至少一个集成的光导，并且包括通过在衬底上沉积合适的材料而在其上形成光导的衬底，以产生下约束层，引导芯层和上约束 层。 光导被设计成光学地连接到安装在支撑件上的光电元件，其中支撑件使元件定位以确保其与光导的光学对准。 支撑件包括位于核心水平面的基台或相对于芯层限定在约束层中，以确保部件的垂直定位。 本发明还涉及制备载体的方法。

公开(公告)号：US08614698B2

公开(公告)日：2013-12-24

申请号：US12515247

申请日：2007-11-20

Applicant: Yohan Desieres ,  Pierre Gidon ,  Ludovic Poupinet ,  Bruno Mourey

Inventor： Yohan Desieres ,  Pierre Gidon ,  Ludovic Poupinet ,  Bruno Mourey

IPC: G09G5/00 ,  G09G3/30

CPC classification number: H01L51/5265 ,  H01L27/3206 ,  H01L27/3244 ,  H01L51/5206 ,  H01L51/5209 ,  H01L51/5275

Abstract: An electrode of a light-emitting device of the OLED type adapted for forming with a second electrode, an optical cavity, including at least one layer based on a material of refraction index n1 including a structured face comprising a plurality of recesses filled with a material of refractive index n2 different from n1.

Abstract translation: 适于与第二电极形成的OLED型发光器件的电极，光腔，其包括基于折射率n1的材料的至少一层，所述材料包括结构化面，所述结构化面包括填充有材料的多个凹部 的折射率n2不同于n1。

公开(公告)号：US20120274834A1

公开(公告)日：2012-11-01

申请号：US13443474

申请日：2012-04-10

Applicant: Pierre GIDON

Inventor： Pierre GIDON

IPC: H04N5/232

CPC classification number: H01L27/14627 ,  H01L27/14605 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/1464 ,  H04N5/2254 ,  H04N5/23212

Abstract: An imager device including: an imager integrated circuit comprising a matrix of pixels, several first, second and third focusing means such that each focusing means is provided facing a group of four associated pixels forming a 2×2 matrix, and is capable of focusing light rays to the group of associated pixels, and perform focusing which are different and equivalent to an arrangement of groups of associated pixels at three distances which are different toward the inlet face for light rays in the imager device, fourth means capable of passing, with respect to each group of pixels, the light rays directed toward said group and passing through the focusing means associated with said group, and capable of blocking the light rays directed toward said group and passing through the other focusing means.

Abstract translation: 一种成像器件，包括：成像器集成电路，包括像素矩阵，若干第一，第二和第三聚焦装置，使得每个聚焦装置面向一组形成2×2矩阵的四个相关联像素，并且能够聚焦光 并且执行与成像器装置中的光线的入射面不同的三个距离处的相关联像素组的布置不同并且等效的聚焦，第四装置能够相对于 对于每组像素，所述光线指向所述组并且通过与所述组相关联的聚焦装置，并且能够阻挡朝向所述组并且穿过另一个聚焦装置的光线。

公开(公告)号：US20120097946A1

公开(公告)日：2012-04-26

申请号：US13381435

申请日：2010-07-05

Applicant: Pierre Gidon ,  Benoit Giffard ,  Norbert Moussy

Inventor： Pierre Gidon ,  Benoit Giffard ,  Norbert Moussy

IPC: H01L27/146 ,  H01L31/18

CPC classification number: H01L27/14647 ,  H01L27/14603 ,  H01L27/14632 ,  H01L27/14636 ,  H01L27/14687 ,  H01L27/14689 ,  H01L27/14692 ,  H01L31/022408

Abstract: A photo-detecting device including a plurality of pixels, each including at least one alternate stack of photodiodes and electrically conducting electrodes. Each photodiode includes one intrinsic amorphous semiconductor layer in contact with one doped amorphous semiconductor layer distinct from the amorphous semiconductor layers in other photodiodes, and is arranged between two electrodes. Each pair of photodiodes includes one of the electrodes arranged between photodiodes. In each pixel: each electrode includes an electrically conducting portion not superposed on other electrodes of the pixel and electrically connected to one interconnection hole filled with an electrically conducting material; and portions of an electrically conducting material are superposed approximately on each of non-superposed portions of electrodes.

Abstract translation: 一种光检测装置，包括多个像素，每个像素包括至少一个交替的光电二极管和导电电极。 每个光电二极管包括与其它光电二极管中的非晶半导体层不同的一个掺杂非晶半导体层接触的本征非晶半导体层，并且布置在两个电极之间。 每对光电二极管包括布置在光电二极管之间的电极之一。 在每个像素中：每个电极包括不叠置在像素的其他电极上的导电部分，并且电连接到填充有导电材料的一个互连孔; 并且导电材料的部分大致重叠在电极的非重叠部分中的每一个上。

公开(公告)号：US08153979B2

公开(公告)日：2012-04-10

申请号：US12328894

申请日：2008-12-05

Applicant: Pascale Parrein ,  Pierre Gidon

Inventor： Pascale Parrein ,  Pierre Gidon

IPC: G01J5/02

CPC classification number: G01J3/4532

Abstract: A device for interference spectroscopic analysis of radiation is of the interference type. The device includes at least a first reflecting layer onto which is deposited a multilayer of alternately transparent and photo-absorbing films. Each photo-absorbing layer is connected to an electronic detection unit supplying a primary electronic signal. The device also includes an electronic analyzing unit for analyzing the primary signals and configured in such a manner as to determine the spectral distribution of the original radiation.

Abstract translation: 辐射干涉光谱分析装置是干涉型。 该装置至少包括第一反射层，在其上沉积交替透明和光吸收膜的多层。 每个光吸收层连接到提供初级电子信号的电子检测单元。 该装置还包括一个电子分析单元，用于分析主信号，并以这样的方式配置，以便确定原始辐射的光谱分布。

公开(公告)号：US20090147263A1

公开(公告)日：2009-06-11

申请号：US12328894

申请日：2008-12-05

Applicant: Pascale PARREIN ,  Pierre Gidon

Inventor： Pascale PARREIN ,  Pierre Gidon

IPC: G01J3/45

CPC classification number: G01J3/4532

Abstract: The field of the invention is that of spectroscopic analysis devices allowing the spectral analysis of radiation. The device according to the invention is of the interference type, it comprises at least a first reflecting layer onto which is deposited a multilayer of alternately transparent and photo-absorbing thin films, each photo-absorbing layer being connected to electronic detection means supplying a primary electronic signal and the device also comprising means for analyzing the primary signals and configured in such a manner as to determine the spectral distribution of the original radiation.

Abstract translation: 本发明的领域是允许辐射的光谱分析的光谱分析装置的领域。 根据本发明的装置是干涉型的，它至少包括第一反射层，在其上沉积交替透明和光吸收薄膜的多层，每个光吸收层连接到提供初级的电子检测装置 电子信号，并且该装置还包括用于分析主信号并且以这样的方式配置以便确定原始辐射的光谱分布的装置。

公开(公告)号：US07352043B2

公开(公告)日：2008-04-01

申请号：US10540334

申请日：2003-12-17

Applicant: Pierre Gidon

Inventor： Pierre Gidon

IPC: H01L31/09

CPC classification number: H01L27/1467 ,  H01L27/14647 ,  H01L27/1465 ,  H01L27/14652

Abstract: The invention concerns a matrix structure of multispectral detectors (200) comprising: a superimposition of several layers of semiconductor material separated by layers of dielectric material transparent to a light to be detected, said superimposition offering a face for receiving the light to be detected, said superimposition of layers of semiconductor material being spread out in picture elements or pixels, each part of the layer of semiconductor material corresponding to a pixel comprising a light detection element delivering electrical charges in response to the light received by said detection element, means for collecting the electrical charges delivered by each light detection element, said collection means being electrically connected to electrical connection means (153) and comprising conductive walls (151).

Abstract translation: 本发明涉及多光谱检测器（200）的矩阵结构，包括：由被覆检测光透明的介电材料层隔开的若干层半导体材料的叠加，所述叠加提供用于接收被检测光的面，所述 半导体材料层的叠加被分散在像素或像素中，半导体材料层的每个部分对应于包括响应于由所述检测元件接收的光传送电荷的光检测元件的像素，用于收集 由每个光检测元件传送的电荷，所述收集装置电连接到电连接装置（153）并且包括导电壁（151）。

公开(公告)号：US4865453A

公开(公告)日：1989-09-12

申请号：US174827

申请日：1988-03-29

Applicant: Pierre Gidon ,  Jacques Lizet ,  Serge Valette

Inventor： Pierre Gidon ,  Jacques Lizet ,  Serge Valette

IPC: G01B9/02 ,  G01D5/353 ,  G02B6/12

CPC classification number: G01B9/02051 ,  G01B9/02028 ,  G01D5/35303 ,  G02B6/12004 ,  G01B2290/45

Abstract: A displacement transducer in integrated optics comprises a light source emitting a main monochromatic beam, a lens for collimating the main beam, a splitting plate for forming a measuring beam and a reference beam, a phase displacer for introducing a phase displacement of .pi./2 on part of the reference beam in order to form two reference beams, a first mirror integral with the moving object and a second mirror respectively serving for reflecting the measuring beam and the two reference beams on to the splitting plate, so as to form two interference signals, a splitting mirror for splitting these two interference signals and two detectors for respectively detecting these two interference signals. The transducer is formed in a SiO.sub.2 /Si.sub.3 N.sub.4 /SiO.sub.2 optical guide, the lens, plate and phase displacer being formed by local etching of the surface layer of the guide, the second mirror and the splitting mirror being formed by total etching of the guide.

Abstract translation: 集成光学器件中的位移传感器包括发射主单色光束的光源，用于准直主光束的透镜，用于形成测量光束的分束板和参考光束，用于将π/ 2的相位位移导入的相位置换器 参考光束的一部分，以形成两个参考光束，与移动物体成一体的第一反射镜和分别用于将测量光束和两个参考光束反射到分割板上的第二反射镜，以形成两个干涉信号 ，用于分离这两个干扰信号的分束镜和用于分别检测这两个干扰信号的两个检测器。 传感器形成在SiO 2 / Si 3 N 4 / SiO 2光导中，透镜，板和相位置换器是通过局部蚀刻引导件的表面层，第二反射镜和分束镜通过导体的全蚀刻而形成的。