公开(公告)号：US4370746A

公开(公告)日：1983-01-25

申请号：US219656

申请日：1980-12-24

申请人： Robert E. Jones ,  Donald H. Wood

发明人： Robert E. Jones ,  Donald H. Wood

IPC分类号： G11C29/00 ,  G01R31/28 ,  G11C29/56

CPC分类号： G11C29/56

摘要： A testing apparatus, having an address generator for providing address signals to a test device and to a reference device, is provided with a programmable mask for passing only selected least significant X and Y address bits to the reference device.

摘要翻译： 具有用于向测试设备和参考设备提供地址信号的地址发生器的测试设备设置有用于仅将所选择的最低有效X和Y地址位传递到参考设备的可编程掩码。

公开(公告)号：US4219855A

公开(公告)日：1980-08-26

申请号：US972102

申请日：1978-12-21

申请人： Robert E. Jones, Jr.

发明人： Robert E. Jones, Jr.

IPC分类号： G11B5/31 ,  G11B5/22 ,  G11B5/20 ,  G11B5/60

CPC分类号： G11B5/3163 ,  G11B5/3116 ,  G11B5/313

摘要： A thin film magnetic transducer comprises a non-magnetic substrate and a pair of magnetic pole pieces having different widths. The width of the first pole piece deposited on the substrate is greater than that of the second pole piece to prevent a problem associated with misregistration between the pole pieces, which may occur during manufacture. Such misregistration generally results in a "wraparound", so that the edge of the second pole piece would have an extended portion forming an angle to the normal magnetic transitions created by the pole pieces. The width of the second pole piece is slightly less than the effective width of the data track recorded on a magnetic medium, and the data track width is relatively independent of the dimension of the first pole piece.

摘要翻译： 薄膜磁换能器包括非磁性基片和一对具有不同宽度的磁极片。 沉积在基板上的第一极片的宽度大于第二极片的宽度，以防止与制造期间可能发生的极片之间的重合不良相关的问题。 这种配准失调通常导致“环绕”，使得第二极靴的边缘将具有与由极片产生的正常磁性转变成角度的延伸部分。 第二极靴的宽度略小于记录在磁性介质上的数据轨迹的有效宽度，并且数据轨迹宽度相对独立于第一极片的尺寸。

公开(公告)号：US4219854A

公开(公告)日：1980-08-26

申请号：US972103

申请日：1978-12-21

申请人： Mark A. Church ,  Robert E. Jones, Jr.

发明人： Mark A. Church ,  Robert E. Jones, Jr.

IPC分类号： G11B5/17 ,  G11B5/31 ,  G11B5/20 ,  G11B5/22 ,  G11B5/60

CPC分类号： G11B5/3136 ,  G11B5/313

摘要： A thin film magnetic head assembly has a multi-turn electrical conducting coil, which is formed by deposition in an elliptical pattern. By virtue of the elliptical pattern, the coil turn portions between the back gap closure and transducing gap of the thin film head are relatively narrow, whereas the coil turn portions furthest from the transducing gap are widest. Corners and sharp ends are eliminated. Electrical resistance effects are thereby minimized and signal output is enhanced.

摘要翻译： 薄膜磁头组件具有通过以椭圆形图案沉积形成的多匝导电线圈。 由于椭圆形图案，薄膜头的后间隙封闭和换能间隙之间的线圈转动部分相对较窄，而距离换能间隙最远的线圈转动部分最宽。 角落和尖端被消除。 从而电阻效应最小化，信号输出增强。

公开(公告)号：US4040592A

公开(公告)日：1977-08-09

申请号：US721703

申请日：1976-09-09

申请人： Robert E. Jones

发明人： Robert E. Jones

IPC分类号： A47B17/02 ,  A47G1/24

CPC分类号： A47B17/02 ,  A47B2200/0043

摘要： A desk top work support device having a primary work support member pivotally mounted in an opening in a desk top. A pair of link arms mounted on the primary work support member rotatably support a secondary work support member, and are pivotable to position the secondary work support member in a forward position over the primary work surface and a rearward position to the rear of the primary work surface. A rotating mechanism causes the secondary work support member to rotate with respect to the link arm when the link arm is pivoted. A drive train is provided for rotating the rotating mechanism and the secondary work support bar independently of movement of the link arms, and a second drive train is provided for pivoting the link arms.

摘要翻译： 一种桌面工作支撑装置，其具有枢转地安装在台面的开口中的主要工作支撑构件。 安装在主工作支撑构件上的一对连杆臂可旋转地支撑辅助工件支撑构件，并且可枢转以将辅助工件支撑构件定位在主工作表面上的向前位置和向主工作的后方的向后位置 表面。 当连杆臂枢转时，旋转机构使辅助工作支撑构件相对于连杆臂旋转。 提供传动系，用于独立于连杆臂的运动旋转旋转机构和辅助工作支撑杆，并且提供第二传动系以枢转连杆臂。

公开(公告)号：US3988698A

公开(公告)日：1976-10-26

申请号：US659083

申请日：1976-02-18

申请人： Dale E. Crane ,  Robert E. Jones ,  Hector A. Meneses

发明人： Dale E. Crane ,  Robert E. Jones ,  Hector A. Meneses

IPC分类号： H01S3/032 ,  H01S3/034 ,  H01S3/038 ,  H01S3/03

CPC分类号： H01S3/0323 ,  H01S3/034 ,  H01S3/038

摘要： Plasma tube for gas lasers including an elongate cylindrical glass envelope closed at one end with a conductive metal anode disc and at the other with a metal cathode disc, each of which has been intimately fused with the envelope. The envelope carries an internally mounted capillary having a bore for confining a discharge within the tube, the capillary being supported by a flange member connected between the capillary and the envelope. Each disc has a centrally located aperture which is aligned with the capillary bore, each aperture being closed by a suitable reflector for defining an optical cavity. Fine tuning of the cavity is accomplished by incremental deformation of one or both of the discs.

摘要翻译： 用于气体激光器的等离子体管，其包括在一端处与导电金属阳极盘封闭的细长圆柱形玻璃外壳，而另一端具有金属阴极盘，每个金属阴极盘已经与外壳紧密地熔合。 信封带有内部安装的毛细管，其具有用于限制管内的排出口的孔，毛细管由连接在毛细管和外壳之间的凸缘构件支撑。 每个盘具有与毛细管孔对准的居中定位的孔，每个孔由合适的反射器封闭，用于限定光腔。 通过一个或两个盘的增量变形实现空腔的微调。

公开(公告)号：US08242564B2

公开(公告)日：2012-08-14

申请号：US13313806

申请日：2011-12-07

申请人： Gregory S. Spencer ,  Jill C. Hildreth ,  Robert E. Jones

发明人： Gregory S. Spencer ,  Jill C. Hildreth ,  Robert E. Jones

IPC分类号： H01L27/12

CPC分类号： G02B6/12004 ,  H01L21/76283 ,  H01L27/1203 ,  H01L31/028 ,  H01L31/112

摘要： A semiconductor structure having a transistor region and an optical device region includes a transistor in a first semiconductor layer of the semiconductor structure, wherein the first semiconductor layer is over a first insulating layer, the first insulating layer is over a second semiconductor layer, and the second semiconductor layer is over a second insulating layer. A gate dielectric of the transistor is in physical contact with a top surface of the first semiconductor layer, and the transistor is formed in the transistor region of the semiconductor structure. A waveguide device in the optical device region and a third semiconductor layer over a portion of the second semiconductor layer.

摘要翻译： 具有晶体管区域和光学器件区域的半导体结构包括在半导体结构的第一半导体层中的晶体管，其中第一半导体层在第一绝缘层之上，第一绝缘层在第二半导体层上，并且 第二半导体层在第二绝缘层之上。 晶体管的栅极电介质与第一半导体层的顶表面物理接触，并且晶体管形成在半导体结构的晶体管区域中。 光学器件区域中的波导器件和第二半导体层的一部分上的第三半导体层。

公开(公告)号：US07887550B2

公开(公告)日：2011-02-15

申请号：US12847948

申请日：2010-07-30

申请人： Terry D. Daglow ,  Robert E. Jones

发明人： Terry D. Daglow ,  Robert E. Jones

IPC分类号： A61B19/00

CPC分类号： A61B90/10 ,  A61B2090/103

摘要： In one embodiment, an apparatus comprises: a base structure adapted to be inserted within the burr hole; a lead securing member for securing the lead, the lead securing member comprising a first arm structure and a second arm structure, at least one spring loaded structure adapted to exert a force to bring the first arm structure and the second arm structure together; and a positioning tool having a distal end adapted to be inserted within the lead securing member. When the positioning tool is positioned within the lead securing member, the distal end holds the first and second arm structures a sufficient distance apart to receive a lead between the first and second arm structures; wherein the positioning tool comprises a control structure at a proximal end that, when engaged, causes the distal end of the positioning tool to be released from between the first and second arm structures.

摘要翻译： 在一个实施例中，一种装置包括：适于插入钻孔内的基座结构; 用于固定所述引线的引线固定构件，所述引线固定构件包括第一臂结构和第二臂结构，至少一个弹簧加载结构，其适于施加力以使所述第一臂结构和所述第二臂结构在一起; 以及定位工具，其具有适于插入到所述引线固定构件内的远端。 当定位工具定位在引线固定构件内时，远端将第一和第二臂结构保持足够的距离，以在第一和第二臂结构之间接收引线; 其中所述定位工具包括在近端处的控制结构，所述控制结构在接合时使所述定位工具的远端从所述第一和第二臂结构之间释放。

公开(公告)号：US07741218B2

公开(公告)日：2010-06-22

申请号：US11679512

申请日：2007-02-27

申请人： Terry G. Sparks ,  Robert E. Jones

发明人： Terry G. Sparks ,  Robert E. Jones

IPC分类号： H01L21/44

CPC分类号： H01L21/76898 ,  H01L21/2885 ,  H01L21/76879 ,  H01L2224/05567 ,  H01L2224/06181 ,  H01L2224/13022 ,  H01L2924/00014 ,  H01L2224/13099

摘要： A method for forming a conductive via is discussed and includes forming a seed layer over a first side of a semiconductor substrate, wherein the semiconductor substrate includes a first side opposite a second side, forming a via hole in a semiconductor substrate from the second side of the semiconductor substrate, wherein the via hole exposes the seed layer; and electroplating a conductive via material in the via hole from the seed layer. In one embodiment, a continuous conductive layer is formed over and electrically coupled to the seed layer. The continuous conductive layer can serve as the current source while electroplating the conductive via material.

摘要翻译： 讨论了一种用于形成导电通孔的方法，包括在半导体衬底的第一侧上形成晶种层，其中半导体衬底包括与第二侧相对的第一侧，从半导体衬底的第二侧形成通孔 所述半导体衬底，其中所述通孔暴露所述种子层; 以及从所述种子层电镀所述通孔中的导电通孔材料。 在一个实施例中，在种子层上方形成连续的导电层，并电耦合到晶种层。 连续导电层可用作电流源，同时电镀导电通孔材料。

公开(公告)号：US07715227B2

公开(公告)日：2010-05-11

申请号：US11865991

申请日：2007-10-02

申请人： Syed M. Alam ,  Robert E. Jones

发明人： Syed M. Alam ,  Robert E. Jones

IPC分类号： G11C11/50

CPC分类号： G11C17/14 ,  H01L25/18 ,  H01L27/112 ,  H01L27/11226 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2924/0002 ,  Y10T29/49002 ,  H01L2924/00

摘要： A read only memory implemented as a 3D integrated device has a first stratum, a second stratum, and bonded inter-strata connections for coupling the first stratum to the second stratum. The physical bonding between the two strata implements the programming of the read only memory. The stratum may be in wafer form or in die form. The first stratum includes functional active devices and at least one non-programmed active device. The second stratum includes at least conductive routing to be associated with the at least one non-programmed active device. The bonded inter-strata connections include at least one bonded programmable inter-strata connection for programming the at least one non-programmed active device and for providing conductive routing to the programmed active device. The two strata thus form a programmed ROM. Other types of programmable storage devices may be implemented by bonding the two strata.

摘要翻译： 实现为3D集成设备的只读存储器具有用于将第一层耦合到第二层的第一层，第二层和粘结层间连接。 两层之间的物理绑定实现了只读存储器的编程。 层可以是晶片形式或模具形式。 第一层包括功能性有源器件和至少一个非编程有源器件。 第二层包括至少与至少一个非编程的有源设备相关联的导电路由。 所述接合的层间连接包括用于对所述至少一个非编程的有源器件进行编程以及为所述编程的有源器件提供导电路由的至少一个结合的可编程层间连接。 因此，这两个层由此形成一个编程的ROM。 其他类型的可编程存储设备可以通过键合两个层来实现。

公开(公告)号：US07514340B2

公开(公告)日：2009-04-07

申请号：US11368720

申请日：2006-03-06

申请人： Robert E. Jones ,  Ajay Somani

发明人： Robert E. Jones ,  Ajay Somani

IPC分类号： H01L21/30

CPC分类号： H01L21/76885 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L25/50 ,  H01L2224/114 ,  H01L2224/116 ,  H01L2224/13021 ,  H01L2224/13099 ,  H01L2224/812 ,  H01L2224/81801 ,  H01L2225/06513 ,  H01L2924/0001 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/19043

摘要： A method for making a composite integrated device includes providing a first integrated device having a substrate, an overlying interconnect region, and a contact, wherein the contact electrically contacts the interconnect region and is at a surface of the first integrated device. The method further includes forming a sidewall spacer along a sidewall of a first opening in a first dielectric layer, located over the surface of the integrated device, and providing a deformable metal feature adjacent to the sidewall spacer and in the first opening. The method further includes providing a second integrated device having a substrate, an overlying interconnect region, a contact, and a second dielectric layer surrounding the contact of the second integrated device. The method further includes contacting the contact of the second integrated device with the deformable metal feature and pressing the first dielectric layer against the second dielectric layer.

摘要翻译： 一种制造复合集成器件的方法包括提供具有衬底，上覆互连区和触点的第一集成器件，其中所述触点与所述互连区电接触并位于所述第一集成器件的表面。 该方法还包括沿位于集成器件表面上的第一介电层中的第一开口的侧壁形成侧墙，并提供邻近侧壁间隔物和第一开口中的可变形金属特征。 该方法还包括提供具有衬底，上覆互连区域，接触件和围绕第二集成器件的触点的第二介电层的第二集成器件。 该方法还包括使第二集成器件的触点与可变形金属特征接触，并将第一电介质层压在第二介电层上。