公开(公告)号：US10763194B2

公开(公告)日：2020-09-01

申请号：US15713389

申请日：2017-09-22

Applicant: STMicroelectronics, Inc. ,  STMicroelectronics Pte Ltd

Inventor： Rennier Rodriguez ,  Bryan Christian Bacquian ,  Maiden Grace Maming ,  David Gani

IPC: H01L23/495 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56 ,  H01L21/78 ,  H01L23/00 ,  H01L21/683

Abstract: A semiconductor package includes a lead frame, a die, a discrete electrical component, and electrical connections. The lead frame includes leads and a die pad. Some of the leads include engraved regions that have recesses therein and the die pad may include an engraved region or multiple engraved regions. Each engraved region is formed to contain and confine a conductive adhesive from flowing over the edges of the engraved leads or the die pad. The boundary confines the conductive adhesive to the appropriate location on the engraved lead or the engraved die pad when being placed on the engraved regions. By utilizing a lead frame with engraved regions, the flow of the conductive adhesive or the wettability of the conductive adhesive can be contained and confined to the appropriate areas of the engraved lead or engraved die pad such that a conductive adhesive does not cause cross-talk between electrical components within a semiconductor package or short circuiting within a semiconductor package.

公开(公告)号：US20200241068A1

公开(公告)日：2020-07-30

申请号：US16746201

申请日：2020-01-17

Applicant: STMicroelectronics Pte Ltd

Inventor： Pedro Jr Santos PERALTA ,  David GANI

IPC: G01R31/28 ,  G01R31/26 ,  G01R31/3185 ,  H01L21/66

Abstract: A method of testing integrated circuit die for presence of a crack includes performing back end integrated circuit fabrication processes on a wafer having a plurality of integrated circuit die, the back end fabrication including an assembly process. The assembly process includes a) lowering a tip of a first manipulator arm to contact a given die such that pogo pins extending from the tip make electrical contact with conductive areas on the given die so that the pogo pins are electrically connected to a crack detector on the given die, b) picking up the given die using the first manipulator arm, and c) performing a conductivity test on the crack detector using the pogo pins to determine presence of a crack in the given die that extends from a periphery of the die, through a die seal ring of the die, and into an integrated circuit region of the die.

公开(公告)号：US20200168464A1

公开(公告)日：2020-05-28

申请号：US16690673

申请日：2019-11-21

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Tien Choy LOH

IPC: H01L21/3065 ,  H01L21/02 ,  H01L21/67

Abstract: One or more embodiments are directed to methods of removing a sacrificial layer from semiconductor wafers during wafer processing. In at least one embodiment, the sacrificial layer is removed from a wafer during an O2 plasma etch step. In one embodiment, the sacrificial layer is poly(p-phenylene-2, 6-benzobisoxazole) (PBO) or polyimide. The O2 plasma etch step causes a residue to form on the wafer. The residue is removed by immersing the wafer a solution that is a mixture of the tetramethylammonium hydroxide (TMAH) and water.

公开(公告)号：US10600758B2

公开(公告)日：2020-03-24

申请号：US16189010

申请日：2018-11-13

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Jian Zhou

IPC: H01L25/065 ,  H01L25/00 ,  H01L23/31 ,  H01L23/10 ,  H01L21/50

Abstract: A package packaged with a cap. The package features trenches, through holes, and a non-conductive coupling element forming a locking mechanism integrated embedded or integrated within a substrate. The package has a cap coupled to the non-conductive coupling element through ultrasonic plastic welding. The package protects the dice from an outside environment or external stresses or both. A method is desired to form package to reduce glue overflow defects in the package. Fabrication of the package comprises drilling holes in a substrate; forming trenches in the substrate; forming a non-conductive coupling element in the through holes and the trenches to form a locking mechanism; allowing the non-conductive coupling element to harden and cure; coupling a die or dice to the substrate; and coupling a cap to the non-conductive coupling element to protect the die or dice from an outside environment or external stresses or both.

公开(公告)号：US20190391264A1

公开(公告)日：2019-12-26

申请号：US16562189

申请日：2019-09-05

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Jing-En LUAN ,  Jerome TEYSSEYRE

IPC: G01S17/02 ,  G01S7/481 ,  H01L25/16

Abstract: A proximity sensor includes a printed circuit board substrate, a semiconductor die, electrical connectors, a lens, a light emitting assembly, and an encapsulating layer. The semiconductor die is positioned over the printed circuit board substrate with its upper surface facing away from the printed circuit board substrate. Each of the electrical connectors is in electrical communication with a contact pad of the semiconductor die and a respective contact pad of the printed circuit board substrate. The lens is positioned over a sensor area of the semiconductor die. The light emitting assembly includes a light emitting device having a light emitting area, a lens positioned over the light emitting area, and contact pads facing the printed circuit board substrate. The encapsulating layer is positioned on the printed circuit board substrate, at least one of the electrical connectors, the semiconductor die, the lens, and the light emitting assembly.

公开(公告)号：US20190273384A1

公开(公告)日：2019-09-05

申请号：US16282097

申请日：2019-02-21

Applicant: STMicroelectronics Pte Ltd

Inventor： Prabhu JYOTI ,  Cho Seng Dominic TAY

IPC: H02J7/00 ,  H01M2/02 ,  H01M2/10

Abstract: A battery charging system includes a first electrical connector disposed facing a first shelf, a second electrical connector disposed facing a second shelf, a first charge device coupled to the first electrical connector, and a second charge device coupled to the second electrical connector. A mobile device includes a first electrical connector, a first shelf portion and a second shelf portion, which are facing the first electrical connector, and a third shelf portion and a fourth shelf portion, which are facing the second electrical connector. Each of the electrical connectors of the battery charging system and the mobile device includes a first conductor, a second conductor, and a third conductor, with the first conductor electrically coupled to the third conductor, and the second conductor electrically isolated from and disposed between the first and third conductors, which enable the battery charging system and mobile device to easily swap batteries.

公开(公告)号：US20190237393A1

公开(公告)日：2019-08-01

申请号：US16380591

申请日：2019-04-10

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Wing Shenq Wong

IPC: H01L23/495 ,  H01L23/00 ,  H01L25/065

Abstract: A single chip integrated circuit (IC) package includes a die pad, and a spacer ring on the die pad defining a solder receiving area. A solder body is on the die pad within the solder receiving area. An IC die is on the spacer ring and is secured to the die pad by the solder body within the solder receiving area. Encapsulating material surrounds the die pad, spacer ring, and IC die. For a multi-chip IC package, a dam structure is on the die pad and defines multiple solder receiving areas. A respective solder body is on the die pad within a respective solder receiving area. An IC die is within each respective solder receiving area and is held in place by a corresponding solder body. Encapsulating material surrounds the die pad, dam structure, and plurality of IC die.

公开(公告)号：US20190195685A1

公开(公告)日：2019-06-27

申请号：US16213197

申请日：2018-12-07

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Laurent HERARD ,  David GANI

IPC: G01J1/02 ,  G01J1/42

CPC classification number: G01J1/0271 ,  G01J1/4204

Abstract: One or more embodiments are directed to ambient light sensor packages, and methods of making ambient light sensor packages. One embodiment is directed to an ambient light sensor package that includes an ambient light sensor die having opposing first and second surfaces, a light sensor on the first surface of the ambient light sensor die, one or more conductive bumps on the second surface of the ambient light sensor die, and a light shielding layer on at least the first surface and the second surface of the ambient light sensor die. The light shielding layer defines an opening over the light sensor. The ambient light sensor package may further include a transparent cover between the first surface of the ambient light sensor die and the light shielding layer, and an adhesive that secures the transparent cover to the ambient light sensor die.

公开(公告)号：US10254261B2

公开(公告)日：2019-04-09

申请号：US15213100

申请日：2016-07-18

Applicant: STMicroelectronics Pte Ltd

Inventor： Olivier Le Neel ,  Tien Choy Loh ,  Shian Yeu Kam ,  Ravi Shankar

IPC: G01N25/22 ,  G01N33/00

Abstract: A microelectronic device capable of detecting multiple gas constituents in ambient air can be used to monitor air quality. The microelectronic air quality monitor includes a plurality of temperature-sensitive gas sensors tuned to detect different gas species. Each gas sensor is tuned by programming an adjacent heater. An insulating air pocket formed below the sensor helps to maintain the sensor at a desired temperature. A temperature sensor may also be integrated with each gas sensor to provide additional feedback control. The heater, temperature sensor, and gas sensors are in the form of patternable thin films integrated on a single microchip. The device can be incorporated into computer workstations, smart phones, clothing, or other wearable accessories to function as a personal air quality monitor that is smaller, more accurate, and less expensive than existing air quality sensors.

公开(公告)号：US20180190616A1

公开(公告)日：2018-07-05

申请号：US15406589

申请日：2017-01-13

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Jian ZHOU

IPC: H01L25/065 ,  H01L25/00 ,  H01L23/31

CPC classification number: H01L25/0655 ,  H01L21/50 ,  H01L23/10 ,  H01L23/3121 ,  H01L25/50

Abstract: A package packaged with a cap. The package features trenches, through holes, and a non-conductive coupling element forming a locking mechanism integrated embedded or integrated within a substrate. The package has a cap coupled to the non-conductive coupling element through ultrasonic plastic welding. The package protects the dice from an outside environment or external stresses or both. A method is desired to form package to reduce glue overflow defects in the package. Fabrication of the package comprises drilling holes in a substrate; forming trenches in the substrate; forming a non-conductive coupling element in the through holes and the trenches to form a locking mechanism; allowing the non-conductive coupling element to harden and cure; coupling a die or dice to the substrate; and coupling a cap to the non-conductive coupling element to protect the die or dice from an outside environment or external stresses or both.