公开(公告)号：US10763194B2

公开(公告)日：2020-09-01

申请号：US15713389

申请日：2017-09-22

Applicant: STMicroelectronics, Inc. ,  STMicroelectronics Pte Ltd

Inventor： Rennier Rodriguez ,  Bryan Christian Bacquian ,  Maiden Grace Maming ,  David Gani

IPC: H01L23/495 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56 ,  H01L21/78 ,  H01L23/00 ,  H01L21/683

Abstract: A semiconductor package includes a lead frame, a die, a discrete electrical component, and electrical connections. The lead frame includes leads and a die pad. Some of the leads include engraved regions that have recesses therein and the die pad may include an engraved region or multiple engraved regions. Each engraved region is formed to contain and confine a conductive adhesive from flowing over the edges of the engraved leads or the die pad. The boundary confines the conductive adhesive to the appropriate location on the engraved lead or the engraved die pad when being placed on the engraved regions. By utilizing a lead frame with engraved regions, the flow of the conductive adhesive or the wettability of the conductive adhesive can be contained and confined to the appropriate areas of the engraved lead or engraved die pad such that a conductive adhesive does not cause cross-talk between electrical components within a semiconductor package or short circuiting within a semiconductor package.

公开(公告)号：US20190096788A1

公开(公告)日：2019-03-28

申请号：US15713389

申请日：2017-09-22

Applicant: STMicroelectronics, Inc. ,  STMicroelectronics Pte Ltd

Inventor： Rennier Rodriguez ,  Bryan Christian Bacquian ,  Maiden Grace Maming ,  David Gani

IPC: H01L23/495 ,  H01L23/00 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56 ,  H01L21/78 ,  H01L21/683

Abstract: A semiconductor package includes a lead frame, a die, a discrete electrical component, and electrical connections. The lead frame includes leads and a die pad. Some of the leads include engraved regions that have recesses therein and the die pad may include an engraved region or multiple engraved regions. Each engraved region is formed to contain and confine a conductive adhesive from flowing over the edges of the engraved leads or the die pad. The boundary confines the conductive adhesive to the appropriate location on the engraved lead or the engraved die pad when being placed on the engraved regions. By utilizing a lead frame with engraved regions, the flow of the conductive adhesive or the wettability of the conductive adhesive can be contained and confined to the appropriate areas of the engraved lead or engraved die pad such that a conductive adhesive does not cause cross-talk between electrical components within a semiconductor package or short circuiting within a semiconductor package.

公开(公告)号：US11585847B2

公开(公告)日：2023-02-21

申请号：US17826705

申请日：2022-05-27

Applicant: STMicroelectronics Pte Ltd

Inventor： Pedro Jr Santos Peralta ,  David Gani

IPC: G01R31/28 ,  H01L21/66 ,  G01R31/3185 ,  G01R31/26

Abstract: A method of testing an integrated circuit die (IC) for cracks includes performing an assembly process on a wafer including multiple ICs including: lowering a tip of a first manipulator arm to contact and pick up a given IC, flipping the given IC such that a surface of the IC facing the wafer faces a different direction, and transferring the IC to a tip of a second manipulator arm, applying pressure from the second manipulator arm to the given IC such that pogo pins extending from the tip of the first manipulator arm make electrical contact with conductive areas of the IC for connection to a crack detector on the IC, and performing a conductivity test on the crack detector using the pogo pins. If the conductivity test indicates a lack of presence of a crack, then the second manipulator arm is used to continue processing of the given IC.

公开(公告)号：US09793427B1

公开(公告)日：2017-10-17

申请号：US15218966

申请日：2016-07-25

Applicant: STMICROELECTRONICS PTE LTD

Inventor： David Gani

IPC: H01L27/15 ,  H01L31/024 ,  H01L31/173 ,  G01V8/10

CPC classification number: H01L31/024 ,  G01V8/10 ,  G01V8/12 ,  H01L31/173 ,  H01L2224/48091 ,  H01L2224/48471 ,  H01L2224/73265 ,  H01L2924/00014

Abstract: One or more embodiments are directed to system in package (SiP) for optical devices, including proximity sensor packaging. One embodiment is directed to an optical sensor that includes a substrate and a sensor die. A through-hole extends through the substrate, and a trench is formed in a first surface of the substrate and is in fluid communication with the through-hole. The sensor die is attached to the first surface of the substrate and covers the first through-hole and a first portion of the trench. A second portion of the trench is left uncovered by the sensor die.

公开(公告)号：US20150103297A1

公开(公告)日：2015-04-16

申请号：US14050522

申请日：2013-10-10

Applicant: STMICROELECTRONICS PTE. LTD

Inventor： WeeChinJudy LIM ,  David Gani ,  Hk Looi ,  Bs Aw ,  Cheng-hai Cheh

IPC: G02F1/29 ,  B23K31/02 ,  B32B37/24 ,  B23K1/00

CPC classification number: G02F1/29 ,  B23K1/0016 ,  B23K2101/38 ,  G02F2001/294 ,  G02F2202/28 ,  Y10T156/10

Abstract: An optical assembly may include a substrate, a housing carried by the substrate and having at least one adhesive-receiving recess in an upper surface thereof, and a lens carried by the housing. The optical assembly may also include a liquid crystal focus cell adjacent the lens and including cell layers and pairs of electrically conductive contacts associated therewith. The optical assembly may also include at least one electrically conductive member within the at least one adhesive-receiving recess and coupling together each pair of the electrically conductive contacts, and an adhesive body in the at least one adhesive-receiving recess covering the at least one electrically conductive member.

Abstract translation: 光学组件可以包括衬底，由衬底承载的壳体，并且在其上表面中具有至少一个粘合剂容纳凹部，以及由壳体承载的透镜。 光学组件还可以包括与透镜相邻的液晶聚焦单元，并且包括与其相关联的单元层和导电触点对。 所述光学组件还可以包括至少一个导电构件，在所述至少一个粘合剂容纳凹部内并且将每对所述导电触点连接在一起，并且所述至少一个粘合剂容纳凹部中的粘合体覆盖所述至少一个 导电部件。

公开(公告)号：US11581289B2

公开(公告)日：2023-02-14

申请号：US16935081

申请日：2020-07-21

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Yong Chen ,  David Gani

IPC: H01L25/065 ,  H01L21/56 ,  H01L25/16 ,  H01L23/13 ,  H01L23/498 ,  H01L23/00

Abstract: A multi-chip package including a first integrated circuit and a second integrated circuit. The first integrated circuit includes a first side having a first conductive layer, a second side having a second conductive layer, and an edge, the first conductive layer coupled to the second conductive layer at a location adjacent to the edge. The second integrated circuit is coupled to the second conductive layer of the first integrated circuit.

公开(公告)号：US11527511B2

公开(公告)日：2022-12-13

申请号：US16692720

申请日：2019-11-22

Applicant: STMicroelectronics Pte Ltd ,  STMicroelectronics (Grenoble 2) SAS

Inventor： David Gani ,  Jean-Michel Riviere

IPC: H01L25/065 ,  H01L23/48 ,  H01L23/498 ,  H01L23/528

Abstract: An electronic device includes a support substrate to which a first electronic chip and a second electronic chip are mounted in a position situated on top of one another. First electrical connection elements are interposed between the first electronic chip and the support substrate. Second electrical connection elements are interposed between the second electronic chip and the support substrate and are situated at a distance from a periphery of the first electronic chip. Third electrical connection elements are interposed between the first electronic chip and the second electronic chip.

公开(公告)号：US10147834B2

公开(公告)日：2018-12-04

申请号：US14885215

申请日：2015-10-16

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Laurent Herard ,  David Gani

IPC: H01L31/167 ,  H01L25/16 ,  H01L31/18 ,  H01L31/0203 ,  H01L33/00 ,  H01L33/58 ,  G01S17/02 ,  H01L31/16 ,  G01S7/481 ,  G01D5/347 ,  H01L33/54

Abstract: An electronic device includes a substrate, an optical sensor coupled to the substrate, and an optical emitter coupled to the substrate. A lens is aligned with the optical emitter and includes an upper surface and an encapsulation bleed stop groove around the upper surface. An encapsulation material is coupled to the substrate and includes first and second encapsulation openings therethrough aligned with the optical sensor and the lens, respectively.

公开(公告)号：US09525094B2

公开(公告)日：2016-12-20

申请号：US14671707

申请日：2015-03-27

Applicant: STMICROELECTRONICS PTE LTD ,  STMICROELECTRONICS (GRENOBLE 2) SAS

Inventor： Eric Saugier ,  Wing Shenq Wong ,  David Gani

IPC: H01L31/167 ,  H01L31/02 ,  H01L25/16 ,  H01S5/022 ,  H01S5/183 ,  H01L31/18

CPC classification number: H01L31/167 ,  H01L25/167 ,  H01L31/02005 ,  H01L31/18 ,  H01L2224/18 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01S5/02248 ,  H01S5/0226 ,  H01S5/02276 ,  H01S5/183 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A proximity sensor having a relatively small footprint includes a substrate, a semiconductor die, a light emitting device, and a cap. The light emitting device overlies the semiconductor die. The semiconductor die is secured to the substrate and includes a sensor area capable of detecting light from by the light emitting device. The cap also is secured to the substrate and includes a light barrier that prevents some of the light emitted by the light emitting device from reaching the sensor area. In one embodiment, the light emitting device and the semiconductor die are positioned on the same side of the substrate, wherein the light emitting device is positioned on the semiconductor die. In another embodiment, the light emitting device is positioned on one side of the substrate and the semiconductor die is positioned on an opposing side of the substrate.

Abstract translation: 具有相对较小占地面积的接近传感器包括衬底，半导体管芯，发光器件和帽。 发光器件覆盖半导体管芯。 半导体管芯被固定到基板上并且包括能够检测来自发光器件的光的传感器区域。 盖子也被固定到基板上并且包括防止由发光装置发射的一些光到达传感器区域的光栅。 在一个实施例中，发光器件和半导体管芯位于衬底的相同侧上，其中发光器件位于半导体管芯上。 在另一个实施例中，发光器件位于衬底的一侧，并且半导体管芯位于衬底的相对侧上。

公开(公告)号：US09244334B2

公开(公告)日：2016-01-26

申请号：US13853598

申请日：2013-03-29

Applicant: STMicroelectronics Pte Ltd.

Inventor： Hk Looi ,  Wee Chin Judy Lim ,  Cheng-Hai Cheh ,  Bs Aw ,  David Gani ,  Tin-Tun Maung ,  Choon Lee Lai

IPC: H04N5/225 ,  G03B3/10 ,  G02B7/09

CPC classification number: G03B3/10 ,  G02B7/08 ,  G02B7/09 ,  H02K41/031 ,  Y10T29/4913

Abstract: Described herein are various embodiments of contacts that include different portions angled with respect to one another and methods of manufacturing devices that include such contacts. In some embodiments, a module may include a first portion of a contact that is disposed within a housing and a second portion that is disposed outside of the housing, with the second portion angled with respect to the first portion. Manufacturing such devices may include depositing a conductive material to electrically connect the contact to a contact pad of a substrate. In some embodiments, a deposition process for depositing the conductive material may have a minimum dimension, which defines a minimum dimension of a conductive material once deposited. In some such embodiments, a distance between a terminal end of the contact pin and the contact pad may be greater than the minimum dimension of the deposition process.

Abstract translation: 这里描述的触点的各种实施例包括相对于彼此成角度的不同部分和制造包括这种触点的装置的方法。 在一些实施例中，模块可以包括设置在壳体内的接触件的第一部分和设置在壳体外部的第二部分，其中第二部分相对于第一部分成角度。 制造这样的器件可以包括沉积导电材料以将触点电连接到衬底的接触焊盘。 在一些实施例中，用于沉积导电材料的沉积工艺可以具有最小尺寸，其限定一旦沉积的导电材料的最小尺寸。 在一些这样的实施例中，接触针的末端与接触垫之间的距离可以大于沉积过程的最小尺寸。