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    Thin film capacitor, thin film capacitor-embedded printed circuit board and manufacturing method of thin film capacitor
    21.
    发明授权
    Thin film capacitor, thin film capacitor-embedded printed circuit board and manufacturing method of thin film capacitor 有权
    薄膜电容器，薄膜电容器嵌入式印刷电路板以及薄膜电容器的制造方法

    公开(公告)号：US07943858B2

    公开(公告)日：2011-05-17

    申请号：US12076989

    申请日：2008-03-26

    Applicant: Seung Eun Lee ,  Yul Kyo Chung ,  Jung Won Lee ,  In Hyung Lee ,  Byung Ik Song

    Inventor： Seung Eun Lee ,  Yul Kyo Chung ,  Jung Won Lee ,  In Hyung Lee ,  Byung Ik Song

    IPC: H05K1/16

    CPC classification number: H05K1/162 ,  H01G4/105 ,  H01G4/33 ,  H05K2201/0175 ,  H05K2201/0179 ,  Y10T29/435

    Abstract: There is provided a thin film capacitor and a capacitor-embedded printed board improved in leakage current characteristics. A dielectric layer is formed of a BiZnNb-based amorphous metal oxide with a predetermined dielectric constant without being heat treated at a high temperature, and metallic phase bismuth of the BiZnNb-based amorphous metal oxide is adjusted in content to attain a desired dielectric constant. Also, another dielectric layer having a different content of metallic phase bismuth may be formed. The thin film capacitor including: a first electrode; a dielectric layer including a first dielectric film formed on the first electrode, the dielectric layer comprising a BiZnNb-based amorphous metal oxide; and a second electrode formed on the dielectric layer, wherein the BiZnNb-based amorphous metal oxide contains metallic phase bismuth.

    Abstract translation: 提供了薄膜电容器和电容器嵌入式印刷电路板，改善了漏电流特性。 电介质层由具有预定介电常数的BiZnNb基非晶态金属氧化物形成，而不在高温下进行热处理，并且将BiZnNb基非晶态金属氧化物的金属相铋的含量调节到所需的介电常数。 此外，可以形成具有不同金属相铋含量的另一介质层。 所述薄膜电容器包括：第一电极; 介电层，包括形成在所述第一电极上的第一电介质膜，所述电介质层包含BiZnNb基非晶态金属氧化物; 以及形成在所述电介质层上的第二电极，其中所述BiZnNb基非晶态金属氧化物含有金属相铋。

    LIQUID-CRYSTALLINE MEDUIM
    22.
    发明申请
    LIQUID-CRYSTALLINE MEDUIM 审中-公开
    液晶结构

    公开(公告)号：US20100301270A1

    公开(公告)日：2010-12-02

    申请号：US12600083

    申请日：2008-05-16

    Applicant: Eun-Young Kim ,  Seung-Eun Lee ,  Dong-Mee Song ,  Chul-Hee Cho

    Inventor： Eun-Young Kim ,  Seung-Eun Lee ,  Dong-Mee Song ,  Chul-Hee Cho

    IPC: C09K19/34 ,  C09K19/32 ,  C09K19/12

    CPC classification number: C09K19/42 ,  C09K2019/0407

    Abstract: The invention relates to a liquid-crystalline medium based on a mixture of polar compounds having negative dielectric anisotropy (Δε), which contains at least one compound selected from the group of compounds of the formula I, IIA and IIB and at least one compound of the formula I* in which R0, R1, R2, R1*, X1, X2, A1, A1*, A2*, Z1, Z2*, L1*, L2*n p, q, v, m and m* are as defined in claim 1, and to the use thereof for an active-matrix display based on the ECB, VA, PS-VA, FFS, PALC or IPS effect.

    Abstract translation: 本发明涉及一种基于具有负介电各向异性的极性化合物的混合物（＆Dgr。＆amp;）的液晶介质，其含有至少一种选自式I，IIA和IIB的化合物的化合物，并且至少 其中R0，R1，R2，R1 *，X1，X2，A1，A1 *，A2 *，Z1，Z2 *，L1 *，L2 * np，q，v，m和m * 如权利要求1中所定义的，以及其用于基于ECB，VA，PS-VA，FFS，PALC或IPS效果的有源矩阵显示器的用途。

    Capacitor and multi-layer board embedding the capacitor
    24.
    发明申请
    Capacitor and multi-layer board embedding the capacitor 审中-公开
    电容器和多层板嵌入电容器

    公开(公告)号：US20080158777A1

    公开(公告)日：2008-07-03

    申请号：US11979770

    申请日：2007-11-08

    Applicant: Seung Hyun Sohn ,  Yul Kyo Chung ,  Seung Eun Lee ,  Yee Na Shin

    Inventor： Seung Hyun Sohn ,  Yul Kyo Chung ,  Seung Eun Lee ,  Yee Na Shin

    IPC: H01G4/06 ,  H01G4/00

    CPC classification number: H05K1/162 ,  H01G4/232 ,  H01G4/30 ,  H01G4/33 ,  H05K1/0231 ,  H05K1/185 ,  H05K3/4644 ,  H05K2201/0179 ,  H05K2201/09509 ,  H05K2201/09763 ,  H05K2201/09781

    Abstract: There are provided a capacitor and a thin film capacitor-embedded multi-layer wiring board. The capacitor includes: first and second electrodes connected to first and second polarities; a dielectric layer formed therebetween; and at least one floating electrode disposed inside the dielectric layer and having overlaps with the first and second electrodes. The wiring board includes: an insulating body having a plurality of insulating layers thereon; a plurality of conductive patterns and conductive vias formed on the insulating layers, respectively, to constitute an interlayer circuit; and a thin film capacitor embedded in the insulating body, wherein the thin film capacitor includes a first electrode layer, a first dielectric layer, at least one floating electrode layer, a second dielectric layer and a second electrode layer sequentially formed, and wherein the first and second electrode layers are connected to the interlayer circuit and the floating electrode layer is not directly connected thereto.

    Abstract translation: 提供电容器和薄膜电容器嵌入式多层布线板。 电容器包括：连接到第一和第二极性的第一和第二电极; 在它们之间形成介电层; 以及至少一个浮置电极，其布置在电介质层的内部并与第一和第二电极重叠。 布线板包括：绝缘体，其上具有多个绝缘层; 分别形成在绝缘层上的多个导电图案和导电通孔，以构成层间电路; 以及嵌入在所述绝缘体中的薄膜电容器，其中所述薄膜电容器包括依次形成的第一电极层，第一电介质层，至少一个浮置电极层，第二电介质层和第二电极层，并且其中所述第一电极层 并且第二电极层连接到层间电路，并且浮动电极层不直接连接到其上。

    PHOTONIC QUANTUM RING LASER AND FABRICATION METHOD THEREOF
    28.
    发明申请
    PHOTONIC QUANTUM RING LASER AND FABRICATION METHOD THEREOF 失效
    光子量子激光器及其制造方法

    公开(公告)号：US20120252146A1

    公开(公告)日：2012-10-04

    申请号：US13524256

    申请日：2012-06-15

    Applicant: O Dae KWON ,  Mi-hyang SHIN ,  Seung Eun LEE ,  Young-heub JANG ,  Young Chun KIM ,  Junho YOON

    Inventor： O Dae KWON ,  Mi-hyang SHIN ,  Seung Eun LEE ,  Young-heub JANG ,  Young Chun KIM ,  Junho YOON

    IPC: H01L21/20

    CPC classification number: H01S5/34333 ,  B82Y20/00 ,  H01S5/0213 ,  H01S5/1075 ,  H01S5/1092 ,  H01S5/2027 ,  H01S5/2213 ,  H01S5/2214 ,  H01S5/2275 ,  H01S2304/04 ,  H04N9/315

    Abstract: A photonic quantum ring (PQR) laser includes an active layer having a multi-quantum-well (MQW) structure and etched lateral face. The active layer is formed to be sandwiched between p-GaN and n-GaN layers epitaxially grown on a reflector disposed over a support substrate. A coating layer is formed over an outside of the lateral faces of the active alyer, and upper electrode is electrically connected to an upper portion of the n-GaN layer, and a distributed Bragg reflector (DBR) is formed over the n-GaN layer and the upper electrode. Accordingly, the PQR laser is capable of oscillating a power-saving vertically dominant 3D multi-mode laser suitable for a low power display device, prevent the light speckle phenomenon, and generate focus-adjusted 3D soft light.

    Abstract translation: 光子量子环（PQR）激光器包括具有多量子阱（MQW）结构和蚀刻的侧面的有源层。 有源层形成为夹在p-GaN和外延生长在设置在支撑衬底上的反射器上的n-GaN层之间。 在活性聚合物的侧面的外侧形成有涂层，上部电极与n-GaN层的上部电连接，在n-GaN层上形成分布式布拉格反射体（DBR） 和上电极。 因此，PQR激光器能够振荡适用于低功率显示装置的省电垂直显示3D多模激光器，防止光斑现象，并产生聚焦调整的3D软光。

    PRINTED CIRCUIT BOARD HAVING EMBEDDED ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME
    29.
    发明申请
    PRINTED CIRCUIT BOARD HAVING EMBEDDED ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME 审中-公开
    具有嵌入式电子元件的印刷电路板及其制造方法

    公开(公告)号：US20120160550A1

    公开(公告)日：2012-06-28

    申请号：US13252777

    申请日：2011-10-04

    Applicant: Tae Sung JEONG ,  Doo Hwan LEE ,  Seung Eun LEE

    Inventor： Tae Sung JEONG ,  Doo Hwan LEE ,  Seung Eun LEE

    IPC: H05K1/09 ,  H05K1/16 ,  H05K1/02 ,  H05K3/30

    CPC classification number: H05K1/185 ,  H01L23/5389 ,  H01L24/19 ,  H01L2224/04105 ,  H05K2201/0355 ,  H05K2201/10674 ,  H05K2203/0152 ,  H05K2203/063 ,  H05K2203/1152 ,  H05K2203/1189 ,  H05K2203/1469 ,  Y10T29/4913

    Abstract: Disclosed is a printed circuit board having an embedded electronic component, which includes a first insulating layer, an electronic component disposed in an opening formed in a thickness direction of the first insulating layer and having a metal bump, a polymer layer formed on one side of the first insulating layer and on which the electronic component is seated so that the metal bump of the electronic component perforates the polymer layer, a second insulating layer formed on the other side of the first insulating layer so as to embed the electronic component, a first circuit layer formed on the second insulating layer, and a second circuit layer formed on the polymer layer so as to be directly electrically connected to the metal bump that perforates the polymer layer, and in which roughness is formed on the polymer layer so that the force of adhesion of the polymer layer to a plating layer is enhanced, thus ensuring reliability of the electrical connection of a circuit layer which is subsequently formed.

    Abstract translation: 公开了一种具有嵌入式电子部件的印刷电路板，其包括第一绝缘层，设置在沿第一绝缘层的厚度方向形成的开口中并具有金属凸块的电子部件，形成在第一绝缘层的一侧的聚合物层 第一绝缘层，并且电子部件就座于其上，使得电子部件的金属凸块穿透聚合物层;第二绝缘层，形成在第一绝缘层的另一侧上以嵌入电子部件;第一绝缘层， 形成在第二绝缘层上的电路层和形成在聚合物层上的第二电路层，以直接电连接到穿透聚合物层的金属凸块，并且在聚合物层上形成粗糙度，使得力 增强了聚合物层对镀层的粘附性，从而确保电路层的电连接的可靠性， 随后形成。

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