公开(公告)号：US07737529B2

公开(公告)日：2010-06-15

申请号：US11582954

申请日：2006-10-19

申请人： Jin Seok Moon ,  Seung Eun Lee ,  Hyung Mi Jung ,  Yul Kyo Chung ,  Seung Hyun Sohn

发明人： Jin Seok Moon ,  Seung Eun Lee ,  Hyung Mi Jung ,  Yul Kyo Chung ,  Seung Hyun Sohn

IPC分类号： H01L29/00

CPC分类号： H05K1/162 ,  H05K3/388 ,  H05K2201/0175 ,  H05K2201/0179

摘要： The invention provides a PCB with a thin film capacitor embedded therein and a method for manufacturing the same. The PCB includes a lower electrode formed on an insulating substrate; an amorphous paraelectric film formed on the lower electrode via low temperature film formation; a buffer layer formed on the amorphous paraelectric film; a metal seed layer formed on the buffer layer; and an upper electrode formed on the metal seed layer.

摘要翻译： 本发明提供一种其中嵌有薄膜电容器的PCB及其制造方法。 PCB包括形成在绝缘基板上的下电极; 通过低温成膜形成在下电极上的非晶顺电膜; 形成在所述非晶正电介质膜上的缓冲层; 形成在缓冲层上的金属种子层; 以及形成在金属籽晶层上的上电极。

公开(公告)号：US20080100986A1

公开(公告)日：2008-05-01

申请号：US11907563

申请日：2007-10-15

申请人： Seung Hyun Sohn ,  Yul Kyo Chung ,  Sung Taek Lim ,  Hyung Mi Jung

发明人： Seung Hyun Sohn ,  Yul Kyo Chung ,  Sung Taek Lim ,  Hyung Mi Jung

IPC分类号： H01G4/00 ,  H01L21/20

CPC分类号： H01G4/33 ,  H01G4/228 ,  H05K1/162 ,  H05K3/388 ,  H05K3/4069 ,  H05K3/4652 ,  H05K2201/0179 ,  H05K2201/035 ,  H05K2201/09509 ,  H05K2201/09763

摘要： Provided is a method of manufacturing a capacitor embedded printed circuit board. In the method, a laminated body is prepared, including a laminated plate having first and second copper films on both sides thereof, where at least one bottom electrode is provided on at least one side. A dielectric layer is formed on the at least one bottom electrode. A metal layer is formed on a top surface of the dielectric layer where a capacitor is to be formed. A conductive paste layer is formed on at least one region of a top surface of the metal layer, where the conductive paste layer and the metal layer is provided as a top electrode. An insulation resin layers are formed on both sides of the laminated plate, respectively. A conductive via is formed in the insulation resin layer such that it is connected to the conductive paste layer.

摘要翻译： 提供一种制造电容器嵌入式印刷电路板的方法。 在该方法中，制备层压体，其包括其两侧具有第一和第二铜膜的层压板，其中在至少一侧上设置有至少一个底部电极。 在所述至少一个底部电极上形成介电层。 在要形成电容器的电介质层的顶表面上形成金属层。 在金属层的顶表面的至少一个区域上形成导电浆料层，其中导电浆料层和金属层设置为顶部电极。 绝缘树脂层分别形成在层压板的两侧。 导电通孔形成在绝缘树脂层中，使其与导电糊层连接。

公开(公告)号：US20090310323A1

公开(公告)日：2009-12-17

申请号：US12222799

申请日：2008-08-15

申请人： Sang Jin Baek ,  Yul Kyo Chung ,  Hyung Mi Jung ,  Jung Soo Byun

发明人： Sang Jin Baek ,  Yul Kyo Chung ,  Hyung Mi Jung ,  Jung Soo Byun

IPC分类号： H05K1/14 ,  H05K3/30

CPC分类号： H05K1/185 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/24227 ,  H01L2224/76155 ,  H01L2224/82047 ,  H01L2224/82102 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0106 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/18162 ,  H01L2924/3025 ,  H05K3/4602 ,  H05K2201/035 ,  H05K2201/10674 ,  H05K2203/0191 ,  Y10T29/49124 ,  Y10T29/4913

摘要： The present invention relates to a printed circuit board including an electronic component embedded therein and a method of manufacturing the board, which electrically connect electrode terminals of the electronic component to the internal circuit layers using connecting parts, thus the circuit density is dispersed

摘要翻译： 本发明涉及一种包括嵌入其中的电子部件的印刷电路板和使用连接部分将电子部件的电极端子与内部电路层电连接的板的制造方法，因此电路密度分散

公开(公告)号：US20110314667A1

公开(公告)日：2011-12-29

申请号：US13137655

申请日：2011-08-31

申请人： Sang Jin Baek ,  Yul Kyo Chung ,  Hyung Mi Jung ,  Jung Soo Byun

发明人： Sang Jin Baek ,  Yul Kyo Chung ,  Hyung Mi Jung ,  Jung Soo Byun

IPC分类号： H05K3/30

CPC分类号： H05K1/185 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/24227 ,  H01L2224/76155 ,  H01L2224/82047 ,  H01L2224/82102 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0106 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/18162 ,  H01L2924/3025 ,  H05K3/4602 ,  H05K2201/035 ,  H05K2201/10674 ,  H05K2203/0191 ,  Y10T29/49124 ,  Y10T29/4913

摘要： A method of manufacturing a printed circuit board including an electronic component embedded therein, including: preparing a core substrate, which has a cavity formed therein and which includes internal circuit layers formed thereon; attaching a tape to one side of the core substrate; attaching an electronic component on the tape such that the cavity receives the electronic component therein; forming a first insulating layer on another side of the core substrate such that the first insulating layer infiltrates into the cavity; removing the tape attached to the one side of the core substrate, and forming connecting parts for electrically connecting electrode terminals of the electronic component to the internal circuit layer formed on the one side of the core substrate; and forming a second insulating layer on the one side of the core substrate from which the tape is removed

摘要翻译： 一种制造包括嵌入其中的电子部件的印刷电路板的方法，包括：准备具有形成在其中并且包括形成在其上的内部电路层的空腔的芯基板; 将带附着到所述芯基板的一侧; 将电子部件附接在带上，使得空腔在其中接收电子部件; 在所述芯基板的另一侧上形成第一绝缘层，使得所述第一绝缘层渗透到所述空腔中; 去除附着在芯基板的一侧的带，并且形成用于将电子部件的电极端子电连接到形成在芯基板的一侧上的内部电路层的连接部分; 以及在所述芯基板的一侧上形成第二绝缘层，从所述芯基板移除所述带

公开(公告)号：US07485411B2

公开(公告)日：2009-02-03

申请号：US11700864

申请日：2007-02-01

申请人： Hyung Mi Jung ,  Yul Kyo Chung ,  Hyung Dong Kang

发明人： Hyung Mi Jung ,  Yul Kyo Chung ,  Hyung Dong Kang

IPC分类号： G03C5/00

CPC分类号： H05K1/162 ,  H05K3/16 ,  H05K3/4602 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/09763

摘要： In a method for manufacturing a printed circuit board with a thin film capacitor embedded therein, a conductive metal is sputtered via a first mask to form a lower electrode. A dielectric material is sputtered via a second mask to form a dielectric layer. The conductive metal is sputtered via a third mask to form an upper electrode. An insulating layer is stacked on a stack body with the upper electrode formed therein and via holes are perforated from a top surface of the insulating layer to a top surface of the lower electrode and from the top surface of the insulating layer to a top surface of the upper electrode formed on the substrate. Also, the stack body with the via holes formed therein is electrolytically and electrolessly plated.

摘要翻译： 在其中嵌入有薄膜电容器的印刷电路板的制造方法中，通过第一掩模溅射导电金属以形成下电极。 通过第二掩模溅射介电材料以形成电介质层。 通过第三掩模溅射导电金属以形成上电极。 绝缘层堆积在堆叠体上，上电极形成在其中，并且通孔从绝缘层的顶表面穿孔到下电极的顶表面，并从绝缘层的顶表面到 上电极形成在基板上。 此外，其中形成有通孔的堆叠体是电解和无电镀的。

公开(公告)号：US20070178412A1

公开(公告)日：2007-08-02

申请号：US11700864

申请日：2007-02-01

申请人： Hyung Mi Jung ,  Yul Kyo Chung ,  Hyung Dong Kang

发明人： Hyung Mi Jung ,  Yul Kyo Chung ,  Hyung Dong Kang

IPC分类号： G03C5/00

CPC分类号： H05K1/162 ,  H05K3/16 ,  H05K3/4602 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/09763

摘要： In a method for manufacturing a printed circuit board with a thin film capacitor embedded therein, a conductive metal is sputtered via a first mask to form a lower electrode. A dielectric material is sputtered via a second mask to form a dielectric layer. The conductive metal is sputtered via a third mask to form an upper electrode. An insulating layer is stacked on a stack body with the upper electrode formed therein and via holes are perforated from a top surface of the insulating layer to a top surface of the lower electrode and from the top surface of the insulating layer to a top surface of the upper electrode formed on the substrate. Also, the stack body with the via holes formed therein is electrolytically and electrolessly plated.

摘要翻译： 在其中嵌入有薄膜电容器的印刷电路板的制造方法中，通过第一掩模溅射导电金属以形成下电极。 通过第二掩模溅射介电材料以形成电介质层。 通过第三掩模溅射导电金属以形成上电极。 绝缘层堆积在堆叠体上，上电极形成在其中，并且通孔从绝缘层的顶表面穿孔到下电极的顶表面，并从绝缘层的顶表面到 上电极形成在基板上。 此外，其中形成有通孔的堆叠体是电解和无电镀的。

公开(公告)号：US07480980B2

公开(公告)日：2009-01-27

申请号：US11724211

申请日：2007-03-15

申请人： Hyung Mi Jung ,  Jin Seok Moon ,  Seok Bae ,  Mano Yasuhiko

发明人： Hyung Mi Jung ,  Jin Seok Moon ,  Seok Bae ,  Mano Yasuhiko

IPC分类号： H01F7/06

CPC分类号： H01F17/0006 ,  H01F41/046 ,  H01F41/26 ,  H05K1/0306 ,  H05K1/165 ,  H05K3/108 ,  Y10T29/4902

摘要： A planar magnetic inductor and a method for manufacturing the same are provided. The planar magnetic inductor comprises an insulating oxide magnetic layer formed on a substrate, a conductive coil separated from a lower surface of the insulating oxide magnetic layer while being completely embedded in the insulating oxide magnetic layer, and a cover layer formed on the insulating oxide magnetic layer for protecting the insulating oxide magnetic layer. The insulating oxide magnetic layer comprises a lower insulating oxide magnetic layer, and an upper insulating oxide magnetic layer formed on the lower insulating oxide magnetic layer, such that the conductive coil is completely embedded in the upper insulating oxide magnetic layer. The planar magnetic inductor can realize excellent high frequency characteristics and high inductance with a reduced scale.

摘要翻译： 提供一种平面磁感应器及其制造方法。 平面磁感应器包括形成在基板上的绝缘氧化物磁性层，在绝缘氧化物磁性层完全嵌入绝缘氧化物磁性层的下表面分离的导电线圈，以及形成在绝缘氧化物磁性层上的覆盖层 用于保护绝缘氧化物磁性层的层。 绝缘氧化物磁性层包括下绝缘氧化物磁性层和形成在下绝缘氧化物磁性层上的上绝缘氧化物磁性层，使得导电线圈完全嵌入上绝缘氧化物磁性层中。 平面磁感应器可以实现优异的高频特性和较小的电感。

公开(公告)号：US20120111618A1

公开(公告)日：2012-05-10

申请号：US13161760

申请日：2011-06-16

申请人： Hyung Mi Jung ,  Jae Choon Cho ,  Choon Keun Lee

发明人： Hyung Mi Jung ,  Jae Choon Cho ,  Choon Keun Lee

IPC分类号： H05K1/02 ,  C08L63/04 ,  C08L63/10 ,  C08L63/00

CPC分类号： H05K1/0353 ,  C08G59/08 ,  C08G59/182 ,  C08G59/186 ,  C08G59/304 ,  C08G59/621 ,  H05K1/0326 ,  H05K3/4655 ,  H05K2201/012 ,  Y10T428/12396

摘要： There are provided a flame-retardant resin composition for a multilayer wiring board and a multilayer wiring board having the same. The flame-retardant resin composition for a multilayer wiring board according to an exemplary embodiment of the present invention includes a composite epoxy resin including a naphthalene modified epoxy resin, a cresol novolac epoxy resin, a rubber modified epoxy resin and a phosphorous-based epoxy resin, as well as a flame retardant represented by a specific chemical formula. The flame-retardant resin composition for a multilayer wiring board and the multilayer wiring board having the same disclosed herein exhibits excellent flame retardancy, moisture resistance and peel strength.

摘要翻译： 提供了一种用于多层布线板的阻燃树脂组合物和具有该阻燃树脂组合物的多层布线板。 根据本发明的示例性实施方案的用于多层布线板的阻燃树脂组合物包括包含萘改性环氧树脂，甲酚酚醛环氧树脂，橡胶改性环氧树脂和磷基环氧树脂的复合环氧树脂 ，以及由特定化学式表示的阻燃剂。 用于多层布线板的阻燃树脂组合物和其中所公开的多层布线板具有优异的阻燃性，耐湿性和剥离强度。

公开(公告)号：US20110317382A1

公开(公告)日：2011-12-29

申请号：US12926411

申请日：2010-11-16

申请人： Jae Choon Cho ,  Hyung Mi Jung ,  Choon Keun Lee

发明人： Jae Choon Cho ,  Hyung Mi Jung ,  Choon Keun Lee

IPC分类号： H05K1/18 ,  C08L63/00

CPC分类号： H01B3/445 ,  C08L27/16 ,  H01B3/40 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/73267 ,  H05K1/0353 ,  H05K1/185 ,  H05K3/4644 ,  H05K2201/015

摘要： Disclosed herein are an insulating resin composition soluble fluorine-based resin, thermosetting resin; a solvent capable of simultaneously dissolving the soluble fluorine-based resin and the thermosetting resin, and a printed circuit substrate using the same.

摘要翻译： 本文公开了绝缘树脂组合物可溶性氟基树脂，热固性树脂; 能够同时溶解可溶性氟系树脂和热固性树脂的溶剂，以及使用其的印刷电路基板。

公开(公告)号：US08309636B2

公开(公告)日：2012-11-13

申请号：US13161760

申请日：2011-06-16

申请人： Hyung Mi Jung ,  Jae Choon Cho ,  Choon Keun Lee

发明人： Hyung Mi Jung ,  Jae Choon Cho ,  Choon Keun Lee

IPC分类号： C08K5/5397

CPC分类号： H05K1/0353 ,  C08G59/08 ,  C08G59/182 ,  C08G59/186 ,  C08G59/304 ,  C08G59/621 ,  H05K1/0326 ,  H05K3/4655 ,  H05K2201/012 ,  Y10T428/12396

摘要： There are provided a flame-retardant resin composition for a multilayer wiring board and a multilayer wiring board having the same. The flame-retardant resin composition for a multilayer wiring board according to an exemplary embodiment of the present invention includes a composite epoxy resin including a naphthalene modified epoxy resin, a cresol novolac epoxy resin, a rubber modified epoxy resin and a phosphorous-based epoxy resin, as well as a flame retardant represented by a specific chemical formula. The flame-retardant resin composition for a multilayer wiring board and the multilayer wiring board having the same disclosed herein exhibits excellent flame retardancy, moisture resistance and peel strength.

摘要翻译： 提供了一种用于多层布线板的阻燃树脂组合物和具有该阻燃树脂组合物的多层布线板。 根据本发明的示例性实施方案的用于多层布线板的阻燃树脂组合物包括包含萘改性环氧树脂，甲酚酚醛环氧树脂，橡胶改性环氧树脂和磷基环氧树脂的复合环氧树脂 ，以及由特定化学式表示的阻燃剂。 用于多层布线板的阻燃树脂组合物和其中所公开的多层布线板具有优异的阻燃性，耐湿性和剥离强度。